公开(公告)号：US20240387448A1

公开(公告)日：2024-11-21

申请号：US18419733

申请日：2024-01-23

Applicant: Tokyo Electron Limited

Inventor： Francisco MACHUCA ,  James S. PAPANU ,  Xinkang TIAN ,  Arkalgud SITARAM

IPC: H01L23/00 ,  G01N23/04 ,  G01N23/083 ,  G01N23/18 ,  H01L21/66 ,  H01L21/67

Abstract: A hybrid bonding apparatus includes a hybrid bonder that has a bonder head and is configured to bond a first semiconductor structure to a second semiconductor structure via hybrid bonding. The hybrid bonding apparatus also includes an X-ray probe having an X-ray source and a detector. The bonder head is positioned in a measurement gap between the X-ray source and the detector or positioned in a measurement space opposite to both the X-ray source and the detector. The X-ray probe is configured to irradiate X-rays through the first semiconductor structure and the second semiconductor structure, in whole or in part, to measure relative positions of the first semiconductor structure and the second semiconductor structure. The hybrid bonder is configured to align the first semiconductor structure and the second semiconductor structure based on the relative positions of the first semiconductor structure and the second semiconductor structure.

公开(公告)号：US20240419885A1

公开(公告)日：2024-12-19

申请号：US18535103

申请日：2023-12-11

Applicant: Tokyo Electron Limited

Inventor： Yan CHEN ,  Vi VUONG ,  Xinkang TIAN ,  Francisco MACHUCA

IPC: G06F30/398 ,  G06F119/18

Abstract: A method of film thickness modeling includes receiving optical data of a sample having a top layer and at least one underlying layer. First simulation data are obtained by inputting the optical data into a multi-layer model. When a GOF of the first simulation data is below a threshold, a simulated thickness is obtained by inputting the optical data into a top-layer model that is substantially unaffected by the at least one underlying layer. A starting point of the thickness of the multi-layer model is adjusted based on the simulated thickness. Second simulation data are obtained by inputting the optical data into the multi-layer model. When the GOF of the second simulation data is below the threshold, the starting point of the thickness in the multi-layer model is re-adjusted, and third simulation data are obtained by inputting the optical data into the multi-layer model.