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公开(公告)号：US5429819A
公开(公告)日：1995-07-04
申请号：US134124
申请日：1993-10-08
申请人： Hiroaki Oka , Toshikazu Tomioka , Katsumi Tomita , Kenji Hoshino , Atsushi Nishino , Shigeharu Ueda
发明人： Hiroaki Oka , Toshikazu Tomioka , Katsumi Tomita , Kenji Hoshino , Atsushi Nishino , Shigeharu Ueda
摘要： An antiviral composition comprising: a thiosulfate salt and at least one of thiosulfate complex salt of a metal and a porous particulate carrier; said metal being at least one selected from the group consisting of silver, copper and zinc; said salts being carried on said porous particulate carrier. It is applicable to a wide range of living environment such as medical instruments and appliances, hygienic implements as well as kitchen utensils, and also demonstrates an antibacterial activity in addition to the antiviral activity. The composition releases its salts slowly to the environment and the antiviral and antibacterial activities of said composition lasts for a long period of time. A method for preparing said composition as well as an antiviral disinfection method and a virucidal disinfection fluid using said composition are also disclosed.
摘要翻译： 一种抗病毒组合物，其包含：硫代硫酸盐和金属的硫代硫酸盐配合盐和多孔颗粒载体中的至少一种; 所述金属为选自银，铜和锌的至少一种; 所述盐被携带在所述多孔颗粒载体上。 它适用于各种生活环境，如医疗仪器和电器，卫生用具以及厨房用具，除抗病毒活性外，还具有抗菌活性。 该组合物缓慢地将其盐释放到环境中，并且所述组合物的抗病毒和抗菌活性持续很长时间。 还公开了使用所述组合物制备所述组合物的方法以及抗病毒消毒方法和杀病毒消毒液。
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公开(公告)号：US5651978A
公开(公告)日：1997-07-29
申请号：US693496
申请日：1996-08-02
CPC分类号： A01N59/16
摘要： An antibacterial composition having a heat-resistant property sufficient for avoiding its decomposition or discoloration at the resin molding temperature comprises; a silver thiosulfate complex salt carried on silica gel particles having an equilibrium water content of 10% or smaller, wherein at least part of the surface of the silica gel particles carrying said silver thiosulfate complex salt is covered with a coating layer composed of silicon dioxide formed by means of hydrolysis of an alkoxysilane.
摘要翻译： 具有足以避免其在树脂成型温度下分解或变色的耐热性的抗菌组合物包括： 将平均含水量为10％以下的硅胶粒子上载持的硫代硫酸银配合盐，其中载有所述硫代硫酸银配合盐的硅胶粒子表面的至少一部分被形成有二氧化硅的被覆层覆盖 通过烷氧基硅烷的水解。
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公开(公告)号：US5516519A
公开(公告)日：1996-05-14
申请号：US420182
申请日：1995-04-11
申请人： Hiroaki Oka , Toshikazu Tomioka , Katsumi Tomita , Kenji Hoshino , Atsushi Nishino , Shigeharu Ueda
发明人： Hiroaki Oka , Toshikazu Tomioka , Katsumi Tomita , Kenji Hoshino , Atsushi Nishino , Shigeharu Ueda
摘要： An antiviral composition comprising: a thiosulfate salt and at least one of thiosulfate complex salt of a metal and a porous particulate carrier; said metal being at least one selected from the group consisting of silver, copper and zinc; said salts being carried on said porous particulate carrier. It is applicable to a wide range of living environment such as medical instruments and appliances, hygienic implements as well as kitchen utensils, and also demonstrates an antibacterial activity in addition to the antiviral activity. The composition releases its salts slowly to the environment and the antiviral and antibacterial activities of said composition lasts for a long period of time. A method for preparing said composition as well as an antiviral disinfection method and a virucidal disinfection fluid using said composition are also disclosed.
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4.发明授权
公开(公告)号：US5645846A
公开(公告)日：1997-07-08
申请号：US582786
申请日：1996-01-04
申请人： Hiroaki Oka , Toshikazu Tomioka , Katsumi Tomita , Kenji Hoshino , Atsushi Nishino , Shigeharu Ueda
发明人： Hiroaki Oka , Toshikazu Tomioka , Katsumi Tomita , Kenji Hoshino , Atsushi Nishino , Shigeharu Ueda
摘要： An antiviral composition comprising: a thiosulfate salt and at least one of thiosulfate complex salt of a metal and a porous particulate carrier; said metal being at least one selected from the group consisting of silver, copper and zinc: said salts being carried on said porous particulate carrier. It is applicable to a wide range of living environment such as medical instruments and appliances, hygienic implements as well as kitchen utensils, and also demonstrates an antibacterial activity in addition to the antiviral activity. The composition releases its salts slowly to the environment and the antiviral and antibacterial activities of said composition lasts for a long period of time. A method for preparing said composition as well as an antiviral disinfection method and a virucidal disinfection fluid using said composition are also disclosed.
摘要翻译： 一种抗病毒组合物，其包含：硫代硫酸盐和金属的硫代硫酸盐配合盐和多孔颗粒载体中的至少一种; 所述金属为选自银，铜和锌中的至少一种金属：所述盐载于所述多孔颗粒载体上。 它适用于各种生活环境，如医疗仪器和电器，卫生用具以及厨房用具，除抗病毒活性外，还具有抗菌活性。 该组合物缓慢地将其盐释放到环境中，并且所述组合物的抗病毒和抗菌活性持续很长时间。 还公开了使用所述组合物制备所述组合物的方法以及抗病毒消毒方法和杀病毒消毒液。
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公开(公告)号：US5510109A
公开(公告)日：1996-04-23
申请号：US51581
申请日：1993-04-22
IPC分类号： A01N25/08 , A01N25/12 , A01N25/34 , A01N41/08 , A01N59/02 , A01N59/08 , A01N59/16 , A01N59/20 , C08K3/28 , C08K3/30 , C08K9/04 , C09K3/10 , A01N25/26
摘要： An antibacterial and antifungal composition which comprises an antibacterial and antifungal material carried on a porous particle carrier is provided. Preferably, the porous particle carrier is a silica gel particle. The antibacterial and antifungal material is at least one metal complex salt, and can contain plant extracts and the like in addition to the metal complex salt. At least a portion of the surface of the above-mentioned carrier having the antibacterial and antifungal composition can be coated with a coating material.
摘要翻译： 提供了一种抗菌和抗真菌组合物，其包含承载在多孔颗粒载体上的抗细菌和抗真菌物质。 优选地，多孔颗粒载体是硅胶颗粒。 抗菌和抗真菌材料是至少一种金属络合物盐，并且除了金属络合物盐之外，还可含有植物提取物等。 具有抗菌和抗真菌组合物的上述载体的表面的至少一部分可涂覆有涂料。
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公开(公告)号：US5494505A
公开(公告)日：1996-02-27
申请号：US379093
申请日：1995-01-26
摘要： A composite plating coating includes a metal plating coating which is dispersed with an antibacterial and antifungal composition and/or a fragrant composition. Particularly, by dispersing carriers absorbed with an antibacterial and antifungal composition and a fragrant composition in a metal plating coating, a composite plating coating with an antibacterial and antifungal effect and a fragrance effect can be obtained.
摘要翻译： 复合电镀涂层包括用抗菌和抗真菌组合物和/或芳香组合物分散的金属镀覆涂层。 特别是，通过将吸附有抗菌，抗真菌剂，芳香剂的载体分散在金属镀覆层中，可以获得具有抗菌，抗真菌效果和香味效果的复合镀覆层。
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公开(公告)号：US06475328B2
公开(公告)日：2002-11-05
申请号：US09455648
申请日：1999-12-07
IPC分类号： A01N2500
CPC分类号： H05K3/285 , A01N25/34 , A01N53/00 , C08L63/00 , H01L23/564 , H01L2924/0002 , H05K3/28 , H05K2201/0209 , Y10T428/31522 , A01N25/10 , A01N2300/00 , H01L2924/00
摘要： To present printed wiring boards and other electronic components having excellent cockroach repelling performance even after solder reflow or solder flow. A conductive layer having a mounting land is provided on a insulating layer as a substrate, a solder resist is applied to cover the conductive layer excluding the mounting land, and an electronic component material containing a cockroach repellent is applied on the solder resist. This electronic component material is a paste containing a resin curable by crosslinking, a cockroach repellent, and a filler such as silica or talc, and by crosslinking and curing the resin by chemical reaction, a dried cockroach repelling layer is exposed and formed on the surface of the printed wiring board.
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8.发明授权Electronic component material containing pest repellent, electronic component using the same, and its manufacturing method 失效含有驱虫剂的电子部件材料，使用其的电子部件及其制造方法公开(公告)号：US06387387B1
公开(公告)日：2002-05-14
申请号：US09015365
申请日：1998-01-29
IPC分类号： A01N2508
CPC分类号： H05K3/285 , A01N25/34 , A01N53/00 , C08L63/00 , H01L23/564 , H01L2924/0002 , H05K3/28 , H05K2201/0209 , Y10T428/31522 , A01N25/10 , A01N2300/00 , H01L2924/00
摘要： To present printed wiring boards and other electronic components having excellent cockroach repelling performance even after solder reflow or solder flow. A conductive layer having a mounting land is provided on a insulating layer as a substrate, a solder resist is applied to cover the conductive layer excluding the mounting land, and an electronic component material containing a cockroach repellent is applied on the solder resist. This electronic component material is a paste containing a resin curable by crosslinking, a cockroach repellent, and a filler such as silica or talc, and by crosslinking and curing the resin by chemical reaction, a dried cockroach repelling layer is exposed and formed on the surface of the printed wiring board.
摘要翻译： 即使在焊料回流或焊料流动之后，也提供具有优异的蟑螂排斥性能的印刷线路板和其他电子部件。在作为基板的绝缘层上设置具有安装台面的导电层，涂覆阻焊剂以覆盖除了 在阻焊剂上涂布安装台面和含有蟑螂驱除剂的电子部件材料。 该电子部件材料是含有通过交联固化的树脂，蟑螂驱除剂和填充剂如二氧化硅或滑石的糊料，并且通过化学反应使树脂交联和固化，将干燥的蟑螂驱除层暴露并形成在表面上 的印刷线路板。
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