公开(公告)号：US20140026776A1

公开(公告)日：2014-01-30

申请号：US14019615

申请日：2013-09-06

Applicant: U.S. Army Research Laboratory ATTN: RDRL-LOC-I

Inventor： Laszlo J. Kecskes ,  Micah J. Gallagher ,  Anthony J. Roberts ,  Kristopher A. Darling

IPC: B22F3/02 ,  C22C9/00 ,  F42B3/28 ,  B22F3/10

CPC classification number: C22C9/00 ,  B22F1/0003 ,  B22F3/02 ,  B22F3/10 ,  B22F2009/041 ,  B22F2009/043 ,  B22F2302/45 ,  B22F2998/00 ,  B22F2998/10 ,  C22C1/002 ,  C22C1/0425 ,  C22C45/001 ,  C22C2200/04 ,  F42B1/032 ,  F42B3/28 ,  B22F9/04 ,  B22F3/14 ,  B22F3/087 ,  B22F3/15 ,  B22F3/17 ,  B22F3/20

Abstract: High-density thermodynamically stable nanostructured copper-based metallic systems, and methods of making, are presented herein. A ternary high-density thermodynamically stable nanostructured copper-based metallic system includes: a solvent of copper (Cu) metal; that comprises 50 to 95 atomic percent (at. %) of the metallic system; a first solute metal dispersed in the solvent that comprises 0.01 to 50 at. % of the metallic system; and a second solute metal dispersed in the solvent that comprises 0.01 to 50 at. % of the metallic system. The internal grain size of the solvent is suppressed to no more than 250 nm at 98% of the melting point temperature of the solvent and the solute metals remain uniformly dispersed in the solvent at that temperature. Processes for forming these metallic systems include: subjecting powder metals to a high-energy milling process, and consolidating the resultant powder metal subjected to the milling to form a bulk material.

Abstract translation: 本文给出了高密度热力学稳定的纳米结构铜基金属体系及其制备方法。 三元高密度热力学稳定的纳米结构铜基金属体系包括：铜（Cu）金属的溶剂; 其包含50至95原子百分比（at。％）的金属系统; 分散在溶剂中的第一溶质金属含有0.01〜50at。 ％的金属系统; 和分散在溶剂中的第二溶质金属，其包含0.01至50at。 ％的金属系统。 在溶剂的熔点温度的98％下，溶剂的内部晶粒尺寸被抑制为不超过250nm，并且在该温度下溶质中的溶质均匀地分散在溶剂中。 用于形成这些金属体系的方法包括：使粉末金属经受高能量的研磨工艺，并将所得到的经研磨的粉末金属固结成块状材料。

公开(公告)号：US20140196813A1

公开(公告)日：2014-07-17

申请号：US13742380

申请日：2013-01-16

Applicant: U.S. ARMY RESEARCH LABORATORY ATTN: RDRL-LOC-I

Inventor： Kristopher A. Darling ,  Micah J. Gallagher ,  Anthony J. Roberts ,  Laszlo J. Kecskes

IPC: B65B31/04

CPC classification number: B22F9/04 ,  B02C17/18 ,  B22F2009/041 ,  C22C1/1084

Abstract: The invention is an apparatus and method for safely depressurizing milling vials. The invention utilizes a machinist vise in communication with a pneumatic air cylinder mounted in a jig inside glove box enclosure. The invention utilizes a method for safely depressurizing milling vials. The milling vials are placed into the machinist vise inside the enclosure. The ram of the pneumatic air cylinder is placed on top of the milling vial and the pneumatic air cylinder is pressed firmly against the cap of the milling vial. Next, the air inside the enclosure is evacuated of atmosphere after which the pressure is slowly released from the pneumatic air cylinder. During this stage of the method the operator is a safe distance from the enclosure. As pressure is removed from the pneumatic air cylinder the ram is retracted and the cap of milling vial is removed.

Abstract translation: 本发明是用于安全减压研磨小瓶的装置和方法。 本发明利用与安装在手套箱外壳内的夹具中的气动气缸连通的机械师台钳。 本发明利用了一种用于安全减压研磨小瓶的方法。 研磨小瓶被放置在机壳内的机械师台钳内。 气动气缸的压头放置在研磨小瓶的顶部，气动气缸紧紧地压靠在研磨小瓶的盖上。 接下来，将外壳内的空气排出大气，然后从气动气缸缓慢释放压力。 在该方法的这个阶段，操作者距离机箱是安全的距离。 当压力从气动气缸中移除时，压头缩回，并且铣刀的盖子被移除。

公开(公告)号：US09333558B2

公开(公告)日：2016-05-10

申请号：US13779803

申请日：2013-02-28

Applicant: U.S. Army Research Laboratory ATTN: RDRL-LOC-I

Inventor： Kristopher A. Darling ,  Laszlo J. Kecskes ,  Brady G. Butler

IPC: B22F9/04 ,  C22C9/00 ,  F42B1/032 ,  B02C17/20 ,  B02C17/18 ,  B02C23/06

CPC classification number: B22F9/04 ,  B02C17/1815 ,  B02C17/20 ,  B02C23/00 ,  B02C23/06 ,  B22F1/0018 ,  B22F2009/043 ,  B22F2009/049 ,  B22F2999/00 ,  C22C1/0425 ,  C22C9/00 ,  F42B1/032 ,  B22F2202/03

Abstract: A binary or higher order high-density thermodynamically stable nanostructured copper-tantalum based metallic system according to embodiments of the invention may be formed of: a solvent of copper (Cu) metal that comprises 70 to 100 atomic percent (at. %) of the metallic system; and a solute of tantalum (Ta) metal dispersed in the solvent metal, that comprises 0.01 to 15 at. % of the metallic system. The metallic system is thermally stable, with the absence of substantial gross grain growth, such that the internal grain size of the solvent metal is substantially suppressed to no more than about 250 nm at approximately 98% of the melting point temperature of the solvent metal and the solute metal remains substantially uniformly dispersed in the solvent metal at that temperature. Processes for forming these metallic systems may include: subjecting powder metals of solvent and the solute to a high-energy milling process using a high-energy milling device to impart high impact energies to its contents. Due to their high-density thermodynamically stable nanostructured, these metallic systems are an ideal candidate for fabricating shaped charge liners for ordinance.

Abstract translation: 根据本发明的实施方案的二元或更高阶高密度热力学稳定的纳米结构铜 - 钽基金属体系可以由以下物质形成：铜（Cu）金属的溶剂，其包含70至100原子％（原子百分比） 金属系统 以及分散在溶剂金属中的钽（Ta）金属溶质，其含有0.01〜15at。 ％的金属系统。 金属体系是热稳定的，不存在实质的总晶粒生长，使得溶剂金属的内部晶粒尺寸在溶剂金属的熔点温度的约98％时基本上被抑制到不超过约250nm，并且 在该温度下，溶质金属基本均匀地分散在溶剂金属中。 用于形成这些金属体系的方法可以包括：使用高能研磨装置对溶剂的粉末金属和溶质进行高能量研磨工艺，以赋予其内容物高的冲击能。 由于它们的高密度热力学稳定的纳米结构，这些金属系统是制造用于法规的成形充电衬垫的理想候选者。

公开(公告)号：US20180229308A1

公开(公告)日：2018-08-16

申请号：US15896804

申请日：2018-02-14

Applicant: U.S. Army Research Laboratory ATTN: RDRL-LOC-I

Inventor： Laszlo J. Kecskes ,  Kristopher A. Darling ,  Rajiv S. Mishra ,  Yuri Mishin ,  Kiran N. Solanki ,  Mansa Rajagopalan

IPC: B22F9/00 ,  B22F9/04 ,  B22F9/12 ,  B22F9/14 ,  C22C9/00

Abstract: Novel metallic systems and methods for their fabrication provide an extreme creep-resistant nano-crystalline metallic material. The material comprises a matrix formed of a solvent metal with crystalline grains having diameters of no more than about 500 nm, and a plurality of dispersed metallic particles formed on the basis of a solute metal in the solvent metal matrix and having diameters of no more than about 200 nm. The particle density along the grain boundary of the matrix is as high as about 2 nm2 of grain boundary area per particle so as to substantially block grain boundary motion and rotation and limit creep at temperatures above 35% of the melting point of the material.

公开(公告)号：US20160319397A1

公开(公告)日：2016-11-03

申请号：US15092702

申请日：2016-04-07

Applicant: U.S. Army Research Laboratory ATTN: RDRL-LOC-I

Inventor： Laszlo J. Kecskes ,  Micah J. Gallagher ,  Anthony J. Roberts ,  Kristopher A. Darling

IPC: C22C9/00 ,  F42B1/032 ,  B22F1/00

CPC classification number: C22C9/00 ,  B22F1/0003 ,  B22F3/02 ,  B22F3/10 ,  B22F2009/041 ,  B22F2009/043 ,  B22F2302/45 ,  B22F2998/00 ,  B22F2998/10 ,  C22C1/002 ,  C22C1/0425 ,  C22C45/001 ,  C22C2200/04 ,  F42B1/032 ,  F42B3/28 ,  B22F9/04 ,  B22F3/14 ,  B22F3/087 ,  B22F3/15 ,  B22F3/17 ,  B22F3/20

Abstract: High-density thermodynamically stable nanostructured copper-based metallic systems, and methods of making, are presented herein. A ternary high-density thermodynamically stable nanostructured copper-based metallic system includes: a solvent of copper (Cu) metal; that comprises 50 to 95 atomic percent (at. %) of the metallic system; a first solute metal dispersed in the solvent that comprises 0.01 to 50 at. % of the metallic system; and a second solute metal dispersed in the solvent that comprises 0.01 to 50 at. % of the metallic system. The internal grain size of the solvent is suppressed to no more than 250 nm at 98% of the melting point temperature of the solvent and the solute metals remain uniformly dispersed in the solvent at that temperature. Processes for forming these metallic systems include: subjecting powder metals to a high-energy milling process, and consolidating the resultant powder metal subjected to the milling to form a bulk material.

Abstract translation: 本文给出了高密度热力学稳定的纳米结构铜基金属体系及其制备方法。 三元高密度热力学稳定的纳米结构铜基金属体系包括：铜（Cu）金属的溶剂; 其包含50至95原子百分比（at。％）的金属系统; 分散在溶剂中的第一溶质金属含有0.01〜50at。 ％的金属系统; 和分散在溶剂中的第二溶质金属，其包含0.01至50at。 ％的金属系统。 在溶剂的熔点温度的98％下，溶剂的内部晶粒尺寸被抑制为不超过250nm，并且在该温度下溶质中的溶质均匀地分散在溶剂中。 用于形成这些金属体系的方法包括：使粉末金属经受高能量的研磨工艺，并将所得到的经研磨的粉末金属固结成块状材料。

公开(公告)号：US20160114462A1

公开(公告)日：2016-04-28

申请号：US14923878

申请日：2015-10-27

Applicant: U.S. Army Research Laboratory ATTN: RDRL-LOC-I

Inventor： Laszlo J. Kecskes ,  Micah J. Gallagher ,  Anthony J. Roberts ,  Heather A. Murdoch ,  Kristopher A. Darling

IPC: B24C1/10

CPC classification number: B24C1/10 ,  B24C7/0007 ,  C21D7/06 ,  C21D8/00

Abstract: Nanostructured or ultra-fine grained metallic systems according to embodiments of the invention may be formed of: pure Cu, pure Fe, or pure Ti, with grain sizes of less than 140 nm, 348 nm, or 59 nm, respectively. The metallic systems demonstrate a monotonically increasing grain size dependence from a minimum value attained at the surface; and a converse relation of microhardness, decreasing from 160 kg/mm2, 265 kg/mm2, or 320 kg/mm2, respectively. The grain refinement process at cryogenic conditions relies on the suppression of room temperature dislocation-mediated deformation mechanisms which facilitate grain restructuring, relaxation, and reorientation. At the cryogenic conditions, alternative mechanism for grain refinement, such as shear localization or dynamic recrystallization may be more dominant. Processes for refining the grain size of these metallic systems may include: subjecting metal plates to a high-energy milling process using a high-energy milling device to impart high impact energies to its surface. Due to the high-efficiency of this attrition process, these metallic systems are ideal candidates for improved corrosion and wear resistance.

Abstract translation: 根据本发明的实施方案的纳米结构或超细晶粒金属体系可以分别由具有小于140nm，348nm或59nm的晶粒尺寸的纯Cu，纯Fe或纯Ti形成。 金属系统表现出从表面达到的最小值单调递增的晶粒尺寸依赖性; 和显微硬度的相关关系，分别从160 kg / mm2，265 kg / mm2或320 kg / mm2下降。 低温条件下的晶粒细化过程依赖于抑制室温位错介导的变形机制，促进晶粒重组，松弛和重新取向。 在低温条件下，晶粒细化的替代机理如剪切定位或动态重结晶可能更为主导。 用于精炼这些金属体系的晶粒尺寸的方法可以包括：使用高能铣削装置对金属板进行高能量铣削加工，以赋予其表面高的冲击能。 由于这种磨损过程的高效率，这些金属系统是改善耐腐蚀和耐磨性的理想选择。

公开(公告)号：US10766071B2

公开(公告)日：2020-09-08

申请号：US15896804

申请日：2018-02-14

Applicant: U.S. Army Research Laboratory ATTN: RDRL-LOC-I

Inventor： Laszlo J. Kecskes ,  Kristopher A. Darling ,  Rajiv S. Mishra ,  Yuri Mishin ,  Kiran N. Solanki ,  Mansa Rajagopalan

IPC: B22F9/00 ,  B22F9/12 ,  B22F9/14 ,  C22C9/00 ,  B22F9/04 ,  B22F1/00 ,  C22C1/04 ,  B82Y40/00 ,  B22F3/20 ,  B82Y30/00

Abstract: Novel metallic systems and methods for their fabrication provide an extreme creep-resistant nano-crystalline metallic material. The material comprises a matrix formed of a solvent metal with crystalline grains having diameters of no more than about 500 nm, and a plurality of dispersed metallic particles formed on the basis of a solute metal in the solvent metal matrix and having diameters of no more than about 200 nm. The particle density along the grain boundary of the matrix is as high as about 2 nm2 of grain boundary area per particle so as to substantially block grain boundary motion and rotation and limit creep at temperatures above 35% of the melting point of the material.

公开(公告)号：US09387535B2

公开(公告)日：2016-07-12

申请号：US13742380

申请日：2013-01-16

Applicant: U.S. Army Research Laboratory ATTN: RDRL-LOC-I

Inventor： Kristopher A. Darling ,  Micah J. Gallagher ,  Anthony J. Roberts ,  Laszlo J. Kecskes

IPC: B02C17/18 ,  B22F9/04 ,  C22C1/10

CPC classification number: B22F9/04 ,  B02C17/18 ,  B22F2009/041 ,  C22C1/1084

Abstract: The invention is an apparatus and method for safely depressurizing milling vials. The invention utilizes a machinist vise in communication with a pneumatic air cylinder mounted in a jig inside glove box enclosure. The invention utilizes a method for safely depressurizing milling vials. The milling vials are placed into the machinist vise inside the enclosure. The ram of the pneumatic air cylinder is placed on top of the milling vial and the pneumatic air cylinder is pressed firmly against the cap of the milling vial. Next, the air inside the enclosure is evacuated of atmosphere after which the pressure is slowly released from the pneumatic air cylinder. During this stage of the method the operator is a safe distance from the enclosure. As pressure is removed from the pneumatic air cylinder the ram is retracted and the cap of milling vial is removed.

Abstract translation: 本发明是用于安全减压研磨小瓶的装置和方法。 本发明利用与安装在手套箱外壳内的夹具中的气动气缸连通的机械师台钳。 本发明利用了一种用于安全减压研磨小瓶的方法。 研磨小瓶被放置在机壳内的机械师台钳内。 气动气缸的压头放置在研磨小瓶的顶部，气动气缸紧紧地压靠在研磨小瓶的盖上。 接下来，将外壳内的空气排出大气，然后从气动气缸缓慢释放压力。 在该方法的这个阶段，操作者距离机箱是安全的距离。 当压力从气动气缸中移除时，压头缩回，并且铣刀的盖子被移除。

公开(公告)号：US20150375301A1

公开(公告)日：2015-12-31

申请号：US13779803

申请日：2013-02-28

Applicant: U.S. Army Research Laboratory ATTN: RDRL-LOC-I

Inventor： Kristopher A. Darling ,  Laszlo J. Kecskes ,  Brady G. Butler

IPC: B22F9/04 ,  B02C23/06 ,  B02C17/20 ,  B02C17/18 ,  C22C9/00 ,  F42B1/032

CPC classification number: B22F9/04 ,  B02C17/1815 ,  B02C17/20 ,  B02C23/00 ,  B02C23/06 ,  B22F1/0018 ,  B22F2009/043 ,  B22F2009/049 ,  B22F2999/00 ,  C22C1/0425 ,  C22C9/00 ,  F42B1/032 ,  B22F2202/03

Abstract: A binary or higher order high-density thermodynamically stable nanostructured copper-tantalum based metallic system according to embodiments of the invention may be formed of: a solvent of copper (Cu) metal that comprises 70 to 100 atomic percent (at. %) of the metallic system; and a solute of tantalum (Ta) metal dispersed in the solvent metal, that comprises 0.01 to 15 at. % of the metallic system. The metallic system is thermally stable, with the absence of substantial gross grain growth, such that the internal grain size of the solvent metal is substantially suppressed to no more than about 250 nm at approximately 98% of the melting point temperature of the solvent metal and the solute metal remains substantially uniformly dispersed in the solvent metal at that temperature. Processes for forming these metallic systems may include: subjecting powder metals of solvent and the solute to a high-energy milling process using a high-energy milling device to impart high impact energies to its contents. Due to their high-density thermodynamically stable nanostructured, these metallic systems are an ideal candidate for fabricating shaped charge liners for ordinance.

Abstract translation: 根据本发明的实施方案的二元或更高阶高密度热力学稳定的纳米结构铜 - 钽基金属体系可以由以下物质形成：铜（Cu）金属的溶剂，其包含70至100原子％（原子百分比） 金属系统 以及分散在溶剂金属中的钽（Ta）金属溶质，其含有0.01〜15at。 ％的金属系统。 金属体系是热稳定的，不存在实质的总晶粒生长，使得溶剂金属的内部晶粒尺寸在溶剂金属的熔点温度的约98％下基本上被抑制到不超过约250nm， 在该温度下，溶质金属基本均匀地分散在溶剂金属中。 用于形成这些金属体系的方法可以包括：使用高能研磨装置对溶剂的粉末金属和溶质进行高能量研磨工艺，以赋予其内容物高的冲击能。 由于它们的高密度热力学稳定的纳米结构，这些金属系统是制造用于法规的成形充电衬垫的理想候选者。