公开(公告)号：US20150053463A1

公开(公告)日：2015-02-26

申请号：US14093660

申请日：2013-12-02

Applicant: UNIMICRON TECHNOLOGY CORP.

Inventor： CHI-SHIANG CHEN ,  HSIU-CHING HU ,  KUN-WU LI ,  FANG-PING WU

IPC: H05K1/02 ,  H05K3/46

CPC classification number: H05K3/4691 ,  H05K1/0278 ,  H05K1/185 ,  H05K3/0011 ,  H05K3/0035 ,  H05K3/0047 ,  H05K3/005 ,  H05K3/007 ,  H05K3/4644 ,  H05K3/4694 ,  H05K2201/048 ,  H05K2203/0384 ,  H05K2203/167 ,  Y10T29/49155

Abstract: A rigid flex board module includes a rigid flex circuit board and a high-density interconnected circuit board. The rigid flex circuit board includes a flexible circuit board, a first rigid circuit board and a first adhesive layer. The flexible circuit board includes a bending portion and a jointing portion connected to the bending part. The rigid flex circuit board is disposed on the jointing portion to expose the bending portion. The first rigid circuit board electrically connects with the flexible circuit board. The first adhesive layer connects the first rigid circuit board and the jointing portion. The high-density interconnected circuit board is disposed in the first rigid circuit board and is electrically connected to the first rigid circuit board.

Abstract translation: 刚性柔性板模块包括刚性柔性电路板和高密度互连电路板。 刚性柔性电路板包括柔性电路板，第一刚性电路板和第一粘合剂层。 柔性电路板包括弯曲部和连接到弯曲部的接合部。 刚性柔性电路板设置在接合部分上以露出弯曲部分。 第一刚性电路板与柔性电路板电连接。 第一粘合剂层连接第一刚性电路板和接合部分。 高密度互连电路板设置在第一刚性电路板中并与第一刚性电路板电连接。