公开(公告)号：US20220398410A1

公开(公告)日：2022-12-15

申请号：US17343798

申请日：2021-06-10

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Ching-Pei LIN ,  Ming-Tsung YEH ,  Chuan-Guei WANG ,  Ji-Fu KUNG

IPC: G06K9/62 ,  G06K9/32 ,  G06N5/04

Abstract: A manufacturing data analyzing method and a manufacturing data analyzing device are provided. The manufacturing data analyzing method includes the following steps. Each of at least one numerical data, at least one image data and at least one text data is transformed into a vector. The vectors are gathered to obtain a combined vector. The combined vector is inputted into an inference model to obtain a defect cause and a modify suggestion.

公开(公告)号：US20220384139A1

公开(公告)日：2022-12-01

申请号：US17369077

申请日：2021-07-07

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Zheng-Yang LI ,  Chian-Chen KUO ,  Yi-Cheng LU ,  Ji-Fu KUNG

IPC: H01J37/08 ,  H01L21/67 ,  H01J37/305 ,  H01J27/18

Abstract: An automatic adjustment method and an automatic adjustment device of a beam of a semiconductor apparatus, and a training method of a parameter adjustment model are provided. The automatic adjustment method of the beam of the semiconductor apparatus includes the following steps. The semiconductor apparatus generates the beam. A wave curve of the beam is obtained. The wave curve is segmented into several sections. The slope of each of the sections is obtained. Several environmental factors of the semiconductor apparatus are obtained. According to the slopes and the environmental factors, at least one parameter adjustment command of the semiconductor apparatus is analyzed through the parameter adjustment model.

公开(公告)号：US20220283217A1

公开(公告)日：2022-09-08

申请号：US17226460

申请日：2021-04-09

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Ji-Fu KUNG ,  Yi-Lin HUNG ,  Chih-Chung KUO ,  Wei-Che LIN

IPC: G01R31/26

Abstract: An equipment sensing circuit board and an operation method thereof are provided. The equipment sensing circuit board equipped on a semiconductor equipment includes a main sensor, a backup sensor, a first electronic fuse, a second electronic fuse, and a multiplexer. The main sensor and the backup sensor are used to monitor the operation of the semiconductor equipment to output a main sensing signal and a backup sensing signal respectively. The first electronic fuse is disposed on the main sensor to output a first status signal. The second electronic fuse is disposed on the backup sensor to output a second status signal. The multiplexer is connected to the main sensor, the backup sensor, the first electronic fuse and the second electronic fuse. The multiplexer selects to output the main sensing signal or the backup sensing signal according to the combination of the first state signal and the second state signal.

公开(公告)号：US20220222162A1

公开(公告)日：2022-07-14

申请号：US17180897

申请日：2021-02-22

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Ching-Pei LIN ,  Ji-Fu KUNG ,  Te-Hsuan CHEN ,  Yi-Lin HUNG

IPC: G06F11/32 ,  G06F11/34 ,  G06F11/30 ,  G06K9/62

Abstract: An operation method and an operation device of a failure detection and classification (FDC) model are provided. The operation method of the FDC model includes the following steps. A plurality of raw traces are continuously obtained. If the raw traces have started to be changed from the first waveform to the second waveform, whether at least N pieces in the race traces have been changed to the second waveform is determined. If at least N pieces in the raw traces have been changed to the second waveform, the raw traces which have been changed to the second waveform are automatically segmented to obtain several windows. An algorithm is automatically set for each of the windows. Through each of the algorithms, an indicator of each of the windows is obtained. The FDC model is retrained based on these indicators.