公开(公告)号：US20220384139A1

公开(公告)日：2022-12-01

申请号：US17369077

申请日：2021-07-07

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Zheng-Yang LI ,  Chian-Chen KUO ,  Yi-Cheng LU ,  Ji-Fu KUNG

IPC: H01J37/08 ,  H01L21/67 ,  H01J37/305 ,  H01J27/18

Abstract: An automatic adjustment method and an automatic adjustment device of a beam of a semiconductor apparatus, and a training method of a parameter adjustment model are provided. The automatic adjustment method of the beam of the semiconductor apparatus includes the following steps. The semiconductor apparatus generates the beam. A wave curve of the beam is obtained. The wave curve is segmented into several sections. The slope of each of the sections is obtained. Several environmental factors of the semiconductor apparatus are obtained. According to the slopes and the environmental factors, at least one parameter adjustment command of the semiconductor apparatus is analyzed through the parameter adjustment model.

公开(公告)号：US20240260198A1

公开(公告)日：2024-08-01

申请号：US18113767

申请日：2023-02-24

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Zheng-Yang LI ,  Li-Hsin YANG ,  Ming-Tung WANG ,  Shu-Mei FANG ,  Chia-Chan TSAI

IPC: H05K3/00 ,  G06T5/20

CPC classification number: H05K3/0008 ,  G06T5/20 ,  H05K2203/166

Abstract: An equipment automatic alignment method and a process robot device using the same are provided. The equipment automatic alignment method includes following steps. An image of an equipment is obtained. The image is enhanced to obtain a plurality of candidate patterns. Each of the candidate patterns is expanded to obtain a first rectangular block and a second rectangular block. A plurality of first target patterns are obtained according to the first rectangular block, and a plurality of second target patterns are obtained according to the second rectangular block. A first base point is obtained from the first target patterns, and a second base point is obtained from the second target patterns. An operation command is generated according to the first base point and the second base point to automatically control an operation interface of the equipment, so that the first base point is aligned with the second base point.