公开(公告)号：US20160211196A1

公开(公告)日：2016-07-21

申请号：US15007607

申请日：2016-01-27

Applicant: UNITED TEST AND ASSEMBLY CENTER LTD.

Inventor： Danny RETUTA ,  Hien Boon TAN ,  Anthony Yi Sheng SUN ,  Mary Annie CHEONG

IPC: H01L23/495 ,  H01L23/31

CPC classification number: H01L23/49506 ,  H01L21/4832 ,  H01L23/3107 ,  H01L23/3157 ,  H01L23/495 ,  H01L23/4952 ,  H01L23/49524 ,  H01L23/49541 ,  H01L23/49582 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/32245 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48639 ,  H01L2224/49171 ,  H01L2224/49433 ,  H01L2224/73265 ,  H01L2224/85439 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/181 ,  Y10T29/49121 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A method of manufacturing a lead frame includes providing an electrically conductive layer having a plurality of holes at a top surface. The plurality of holes form a structure of leads and a die pad on the electrically conductive layer. The plurality of holes are filled with a non-conductive material. Next; an electrically conductive foil is attached on the top surface of the electrically conductive layer and the non-conductive epoxy material. The, the electrically conductive foil is etched to create a network of leads, die pad, bus lines, dam bars and tie lines, wherein the bus lines connect the leads to the dam bar, the dam bar is connected to the tie line and the tie line is connected to the die pad.

Abstract translation: 制造引线框架的方法包括提供在顶表面具有多个孔的导电层。 多个孔在导电层上形成引线和管芯焊盘的结构。 多个孔填充有非导电材料。 下一个; 导电箔附着在导电层和非导电环氧材料的顶表面上。 导电箔被蚀刻以形成引线网络，管芯焊盘，总线，坝条和连接线，其中总线将引线连接到堤坝，坝条连接到连接线， 连接线连接到管芯焊盘。