公开(公告)号：US11710681B2

公开(公告)日：2023-07-25

申请号：US17495788

申请日：2021-10-06

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： Tanawan Chaowasakoo ,  Hua Hong Tan ,  Alexander Lucero Laylo ,  Thanawat Jaengkrajarng

IPC: H01L23/495 ,  H01L23/31 ,  H01L25/065 ,  H01L23/00 ,  H01L25/00 ,  H01L25/07 ,  H01L21/56

CPC classification number: H01L23/49513 ,  H01L23/3128 ,  H01L23/49517 ,  H01L23/49541 ,  H01L23/49575 ,  H01L24/17 ,  H01L24/29 ,  H01L24/32 ,  H01L24/40 ,  H01L24/49 ,  H01L24/83 ,  H01L24/84 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/074 ,  H01L25/50 ,  H01L21/56 ,  H01L23/3107 ,  H01L2224/32245 ,  H01L2224/8384 ,  H01L2224/83815 ,  H01L2224/8484 ,  H01L2224/84815 ,  H01L2924/181

Abstract: An embodiment related to a device. The device includes a first die with first and second die surfaces. The second die surface is bonded to a first die attach pad (DAP) disposed on a first substrate surface of a package substrate and the first die surface includes a first die contact pad. The device also includes a first clip bond including a first clip bond horizontal planar portion attached to the first die contact pad on the first die surface, and a first clip bond vertical portion disposed on an edge of the first clip bond horizontal planar portion. The first clip bond vertical portion is attached to a first substrate bond pad on the first substrate surface. The device further includes a first conductive clip-die bonding layer with spacers on the first die contact pad of the first die. The first conductive clip-die bonding layer bonds the first clip bond horizontal planar portion to the first die contact pad, and the spacers maintain a uniform Bond Line Thickness (BLT) of the first conductive clip-die bonding layer.

公开(公告)号：US11145575B2

公开(公告)日：2021-10-12

申请号：US16677595

申请日：2019-11-07

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： Tanawan Chaowasakoo ,  Hua Hong Tan ,  Alexander Lucero Laylo ,  Thanawat Jaengkrajarng

IPC: H01L23/02 ,  H01L23/34 ,  H01L23/495 ,  H01L23/00 ,  H01L25/00 ,  H01L25/07 ,  H01L25/065 ,  H01L21/56 ,  H01L23/31

Abstract: An embodiment related to a method for forming a device is disclosed. The method includes providing a package substrate having a first die attach pad (DAP) and a first bond pad, forming a first conductive die-substrate bonding layer on the first DAP, and attaching a first major surface of a first die to the first DAP. The first die includes a first die contact pad on a second major surface of the first die. A first conductive clip-die bonding layer with spacers is formed on the first die contact pad of the first die. A first conductive clip-substrate bonding layer is formed on the first bond pad of the package substrate. The method also includes attaching a first clip bond to the first die and the first bond pad. The first clip bond includes a first horizontal planar portion attached to the first die over the first die contact pad and a second vertical portion attached to the first bond pad.

公开(公告)号：US20210202339A1

公开(公告)日：2021-07-01

申请号：US17138741

申请日：2020-12-30

Applicant: UTAC Headquarters Pte. Ltd.

Inventor： Surachai Uraisakul ,  Siriwanna Ounkaew ,  Panumard Thammavet ,  Tanawan Chaowasakoo

IPC: H01L23/31 ,  H01L23/495 ,  H01L23/00 ,  H01L21/48 ,  H01L21/56

Abstract: The present disclosure is directed to improving package adhesion to provide more reliable semiconductor packages. The semiconductor package may be, for example, a leadframe including one or multiple dies attached thereto. The semiconductor package may include only clip bonds or only wire bonds or a combination of clip bonds and wire bonds. An adhesion enhancement coating may be disposed in between the package substrate and the encapsulant to improve package adhesion. For example, the adhesion enhancement coating enhances the sealing by bonding respectively with the inorganic materials of the package substrate and the organic materials of the encapsulant.