-
公开(公告)号：US09883579B1
公开(公告)日：2018-01-30
申请号：US15353726
申请日：2016-11-16
Applicant: Unimicron Technology Corp.
Inventor： Hsiang-Hung Huang
CPC classification number: H05K1/0203 , H05K1/113 , H05K1/116 , H05K1/182 , H05K3/30 , H05K3/4007 , H05K3/4084 , H05K3/4644 , H05K2201/10083 , H05K2201/10734
Abstract: A package structure includes a circuit substrate, first and second build-up circuit structures, and a plurality of piezoelectric heat dissipation units. The circuit substrate includes a core layer, a plurality of electronic devices, and a conducting unit. The electronic devices are embedded in the core layer, and active surfaces of the two adjacent electronic devices respectively face a first surface and a second surface of the core layer. The conducting unit is disposed on the core layer and electrically connected to the electronic devices. The first and second build-up circuit structures are respectively disposed on the first and the second surfaces and respectively have at least one first and at least one second openings. The piezoelectric heat dissipation units respectively correspond to the active surfaces of the electronic devices and are electrically connected to the conducting unit exposed by the first and the second openings.
-
公开(公告)号：US10470317B2
公开(公告)日：2019-11-05
申请号：US15853990
申请日：2017-12-26
Applicant: Unimicron Technology Corp.
Inventor： Hsiang-Hung Huang , Chi-Min Chang
Abstract: A method for manufacturing a circuit board includes: forming a first adhesive layer on a first surface of a vibration unit, in which the vibration unit includes at least one piezoelectric material layer; forming a first stacking structure on the first adhesive layer; and applying a voltage to the at least one piezoelectric material layer to cause the at least one piezoelectric material layer to vibrate, such that the first stacking structure is separate from the vibration unit.
-
Search Results
2
records
(took 0.011 seconds)
