公开(公告)号：US11551955B2

公开(公告)日：2023-01-10

申请号：US16831739

申请日：2020-03-26

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Ming-Che Lai ,  Hua-Wei Peng ,  Chia-He Cheng ,  Ming-Tso Chen ,  Chao-Chi Lu ,  Hsin-Hsu Lin ,  Kuo-Tsai Lo ,  Kao-Hua Wu ,  Huan-Hsin Yeh

IPC: H01L21/67 ,  G05B19/418 ,  G06T7/00

Abstract: A substrate processing apparatus includes a process station for processing a substrate; a cassette station integrated with the process station; a substrate carriage equipped for transferring the substrate between said process station and the cassette station through a passage located at an interface between the process station and said cassette station; and a substrate scanner equipped at said interface between the process station and the cassette station for capturing surface image data during transportation of the substrate that passes through the passage.

公开(公告)号：US12259657B2

公开(公告)日：2025-03-25

申请号：US18306995

申请日：2023-04-25

Applicant: United Microelectronics Corp.

Inventor： Zhi Fan Sun ,  Kuo Feng Huang ,  Ming Hsien Chung ,  Hua-Wei Peng ,  Chih Chung Kuo

IPC: G03F7/00 ,  G01F23/14

Abstract: A lithography system includes an immersion lithographic apparatus, a fluid supply device, and a sensor. The fluid supply is configured to supply fluid to the immersion lithographic apparatus. The fluid supply device includes at least one liquid storage tank, an upper liquid pipe and a lower liquid pipe connected to the liquid storage tank. The sensor includes at least one hydraulic pressure gauge. The at least one hydraulic pressure gauge is arranged near a lower part of the liquid storage tank and connected to the lower liquid pipe and the upper liquid pipe so as to measure the hydraulic pressure at a bottom of the liquid storage tank. The height of the liquid level in the liquid storage tank is calculated from the hydraulic pressure.

公开(公告)号：US20210280444A1

公开(公告)日：2021-09-09

申请号：US16831739

申请日：2020-03-26

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Ming-Che Lai ,  Hua-Wei Peng ,  Chia-He Cheng ,  Ming-Tso Chen ,  Chao-Chi Lu ,  Hsin-Hsu Lin ,  Kuo-Tsai Lo ,  Kao-Hua Wu ,  Huan-Hsin Yeh

IPC: H01L21/67 ,  G05B19/418 ,  G06T7/00

Abstract: A substrate processing apparatus includes a process station for processing a substrate; a cassette station integrated with the process station; a substrate carriage equipped for transferring the substrate between said process station and the cassette station through a passage located at an interface between the process station and said cassette station; and a substrate scanner equipped at said interface between the process station and the cassette station for capturing surface image data during transportation of the substrate that passes through the passage.

公开(公告)号：US20240319611A1

公开(公告)日：2024-09-26

申请号：US18306995

申请日：2023-04-25

Applicant: United Microelectronics Corp.

Inventor： Zhi Fan Sun ,  Kuo Feng Huang ,  Ming Hsien Chung ,  Hua-Wei Peng ,  Chih Chung Kuo

IPC: G03F7/20 ,  G01F23/14

CPC classification number: G03F7/70341 ,  G01F23/14 ,  G03F7/70525

Abstract: A lithography system includes an immersion lithographic apparatus, a fluid supply device, and a sensor. The fluid supply is configured to supply fluid to the immersion lithographic apparatus. The fluid supply device includes at least one liquid storage tank, an upper liquid pipe and a lower liquid pipe connected to the liquid storage tank. The sensor includes at least one hydraulic pressure gauge. The at least one hydraulic pressure gauge is arranged near a lower part of the liquid storage tank and connected to the lower liquid pipe and the upper liquid pipe so as to measure the hydraulic pressure at a bottom of the liquid storage tank. The height of the liquid level in the liquid storage tank is calculated from the hydraulic pressure.

公开(公告)号：US09978795B1

公开(公告)日：2018-05-22

申请号：US15401087

申请日：2017-01-08

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Jy-Hwang Lin ,  Wen-Chieh Wang ,  Tien-Shang Kuo ,  Fu-Hsuan Chu ,  Hua-Wei Peng

IPC: H01L31/00 ,  H01L27/146 ,  H01L23/00

CPC classification number: H01L27/14625 ,  H01L23/562 ,  H01L27/1462 ,  H01L27/14623 ,  H01L27/14643 ,  H01L27/14678

Abstract: A semiconductor structure includes a substrate, a plurality of image sensing devices formed in the substrate, at least a passivation layer formed on the substrate, a plurality of first metal patterns formed on the passivation layer, a plurality of gaps formed between the first metal patterns, an insulating layer lining the gaps, and a plurality of light-guiding structures respectively formed in the gaps. The light-guiding structures respectively include an anchor portion and a body portion, and bottom surfaces of the anchor portions being lower than top surfaces of the first metal patterns.