Abstract:
A SaaS platform to manage a clinical trial is disclosed. The platform enables on-boarding of patients for the clinical trial for one or more clinical research organizations. Such details are necessary for categorisation of the one or more patients. A medical compliance module is set up to capture real time bio-physical parameters indicative of health condition of the patients. The medical compliance module also monitors adherence of each of the patients to the one or more treatment plans designed for the clinical trials. Additionally, a database management module receives, and stores data associated with the clinical trial from the one or more clinical research organisations. Storing of such classified data is being done with specific privacy level for security. An access control module further enables collaborative clinical trial among the one or more clinical research organisations by sharing the data associated with the clinical trial in real-time.
Abstract:
A memory bank includes memory cells and an additional cell to determine an operating voltage of the memory bank. The additional cell has an operating margin that is less than a corresponding operating margin of the other memory cells in the memory bank.
Abstract:
An SRAM bitcell includes first and second CMOS inverters connected as a latch defining a true node and a complement node. The bitcell further includes true and complement bitline nodes. A first direct connection is provided between the true bitline node and a back gate of at least a p-channel transistor, and perhaps also an n-channel transistor, in the second CMOS inverter. A second direct connection is provided between the complement bitline node and a back gate of at least a p-channel transistor, and perhaps also an n-channel transistor, in the first CMOS inverter. A first pass transistor is coupled between the true bitline node and the true node, and a second pass transistor is coupled between the complement bitline node and the complement node. Direct connections are also provided between a wordline and the back gates of each of the first and second pass transistors.
Abstract:
An SRAM bitcell includes first and second CMOS inverters connected as a latch defining a true node and a complement node. The bitcell further includes true and complement bitline nodes. A first direct connection is provided between the true bitline node and a back gate of at least a p-channel transistor, and perhaps also an n-channel transistor, in the second CMOS inverter. A second direct connection is provided between the complement bitline node and a back gate of at least a p-channel transistor, and perhaps also an n-channel transistor, in the first CMOS inverter. A first pass transistor is coupled between the true bitline node and the true node, and a second pass transistor is coupled between the complement bitline node and the complement node. Direct connections are also provided between a wordline and the back gates of each of the first and second pass transistors.
Abstract:
A memory bank includes memory cells and an additional cell to determine an operating voltage of the memory bank. The additional cell has an operating margin that is less than a corresponding operating margin of the other memory cells in the memory bank.
Abstract:
A memory chip configuration aims that reduces the bitline leakage in standby as well as dynamic operation mode. The chip design comprises of—a n×m FET matrix, vertically running bitlines—each shared by a column in the array, horizontally running wordlines—each shared by a row in the array, horizontally running sourcelines—each shared by a row in the array. The sourceline signal for a row is generated by complementing the wordline signal for the same row. The memory cell read operations with the proposed configuration, substantially control the bitline leakage current thereby enhancing the memory speed by reducing the noise during read operations. Also the configuration is unconstrained by design parameters that include size and geometries of memory chips, cell densities, complexity of memory structures, fabrication technologies, etc.