Abstract:
A composition is disclosed of about 15 to about 70% organic resin, about 30 to about 85% nonconductive filler, and about 0.001% to about 1.0% of a surfactant having a perfluorinated chain at least 3 carbon atoms long at one end and a polar group at the other end, and having the property of lowering the surface energy of the resin. The composition is hardened into an article such as a printed circuit board. Unexpectedly, the presence of the surfactant in the articles decreases the drop in volume resistivity which occurs in high humidity. Also disclosed is a method of making the article by coating the filler with a solution of the surfactant, evaporating the solvent, immersing the filler in the resin, and hardening the resin.