公开(公告)号：US20230240020A1

公开(公告)日：2023-07-27

申请号：US17586212

申请日：2022-01-27

Applicant: XILINX, INC.

Inventor： Bhavesh PATEL

IPC: H05K3/34 ,  H05K1/11 ,  H05K1/02

CPC classification number: H05K3/3436 ,  H05K1/115 ,  H05K1/024 ,  H05K2201/10734 ,  H05K2201/0183

Abstract: An electronic device and methods for fabricating the same are disclosed herein that utilize a dam formed on a printed circuit board (PCB) that is positioned to substantially prevent edge bond material, utilized to secure a chip package to the PCB, from interfacing with the solder balls transmitting signals between the PCB and chip package.