公开(公告)号：US09372956B1

公开(公告)日：2016-06-21

申请号：US14537295

申请日：2014-11-10

Applicant: Xilinx, Inc.

Inventor： Yuezhen Fan ,  Eric J. Thorne ,  Xiao-Yu Li ,  Glenn O'Rourke ,  Stephen M. Trimberger

IPC: G06F9/455 ,  G06F17/50

CPC classification number: G06F17/5081 ,  G06F17/5054

Abstract: A method of enabling the use of a programmable device having impaired circuitry includes determining one or more locations of the impaired circuitry of the programmable device; generating a defect map for the programmable device based on the determined locations of the impaired circuitry; generating a plurality of configuration bitstreams to implement a circuit in the programmable device; selecting one of the plurality of configuration bitstreams that does not use the impaired circuitry indicated by the defect map; and programming the programmable device with the selected configuration bitstream.

Abstract translation: 能够使用具有受损电路的可编程设备的方法包括确定可编程设备的受损电路的一个或多个位置; 基于所确定的受损电路的位置，生成可编程设备的缺陷图; 生成多个配置比特流以实现可编程设备中的电路; 选择不使用由缺陷图指示的受损电路的多个配置比特流中的一个; 以及使用所选择的配置比特流对可编程设备进行编程。

公开(公告)号：US09417309B1

公开(公告)日：2016-08-16

申请号：US14092588

申请日：2013-11-27

Applicant: Xilinx, Inc.

Inventor： Yuezhen Fan ,  Daisy Lu

IPC: G01J5/02 ,  G01R35/00

CPC classification number: G01R35/005 ,  G01R31/2896 ,  G01R31/311

Abstract: An apparatus for calibrating a three-dimensional thermography fault isolation tool, includes: a substrate having two or more pins; a first semiconductor die coupled to the substrate; a first heat generating test component at the first semiconductor die; and a second heat generating test component, wherein the first heat generating test component and the second heat generating test component are located at different respective heights; wherein the first heat generating test component is configured to produce a first temperature change in response to a voltage applied by the three-dimensional thermography fault isolation tool to the two or more pins; and wherein the second heat generating test component is configured to produce a second temperature change in response to the voltage or another voltage applied by the three-dimensional thermography fault isolation tool.

Abstract translation: 一种用于校准三维热成像故障隔离工具的设备，包括：具有两个或更多个引脚的基板; 耦合到所述衬底的第一半导体管芯; 在第一半导体管芯处的第一发热测试部件; 以及第二发热试验部件，其中，所述第一发热试验部件和所述第二发热试验部件位于不同的高度处; 其中所述第一发热测试部件被配置为响应于由所述三维热成像故障隔离工具施加到所述两个或更多个引脚的电压而产生第一温度变化; 并且其中所述第二发热测试部件被配置为响应于由所述三维热成像故障隔离工具施加的电压或另一电压而产生第二温度变化。