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公开(公告)号：US20190185684A1
公开(公告)日：2019-06-20
申请号：US16284659
申请日：2019-02-25
申请人： Yazaki Corporation
发明人： Maki YAMADA , Rie Katsumata , Yukito Aoyama
摘要： An electrically conductive paste contains: metal nanoparticles which are protected by an organic compound containing an amino group and have an average particle diameter of 30 nm to 400 nm; metal particles which are protected by a higher fatty acid and have an average particle diameter of 1 μm to 5 μm; an organic solvent; and a resin component consisting of a cellulose derivative. A conductor obtained by firing the electrically conductive paste has a film thickness of 30 μm or more and a specific resistance of 5.0×10−6 Ω·cm or less. In this way, the electrically conductive paste can reduce the resistance of the obtained conductor and to increase the amount of current flowing. A wiring board includes a conductor obtained from the electrically conductive paste.
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公开(公告)号：US20170223827A1
公开(公告)日：2017-08-03
申请号：US15489945
申请日：2017-04-18
申请人： YAZAKI Corporation
发明人： Maki YAMADA , Hiroki KONDO , Makoto KAMBE
CPC分类号： H05K1/0353 , H05K1/09 , H05K1/095 , H05K1/181 , H05K1/189 , H05K3/0014 , H05K3/12 , H05K3/1208 , H05K3/284 , H05K3/32 , H05K2201/0145 , H05K2201/0158 , H05K2201/10272 , H05K2203/095
摘要： A film-like printed circuit board includes: a low-melting-point resin film substrate composed of a low-melting-point resin in which a melting point is 370° C. or less; a circuit formed in a manner that a circuit-forming conductive paste applied onto the low-melting-point resin film substrate is subjected to plasma baking; an electronic component bonding layer formed in a manner that a mounting conductive paste applied onto the circuit is subjected to the plasma baking; and an electronic component mounted on the circuit via the electronic component bonding layer.
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