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公开(公告)号:US06338622B2
公开(公告)日:2002-01-15
申请号:US08952476
申请日:1998-02-13
IPC分类号: B29C4720
CPC分类号: B29C47/20 , B29C47/0023 , B29C47/085 , B29C47/705
摘要: A pipe molding die of the present invention is capable of rectifying a flow of a molten resin by a resin reservoir and uniformizing the flow of the resin extruded from the die in whichever position in a peripheral direction on a flow path within the die. Consequently, ununiformity in wall thickness of the resin pipe to be molded can be eliminated. The pipe molding die comprises a throttle part as one of components thereof, which includes a core, a shell part fitted to the core and a resin reservoir as a portion of a flow path which is formed between the core and the shell part. A molten, resin as a pipe raw material flows through the flow path. The resin reservoir is provided in at least one of the core and the shell part, and takes a ring-like shape circumscribing a central axis of the pipe molding die with the central axis centered. The resin reservoir assumes a recessed shape in cross-section.
摘要翻译: 本发明的管状成型模具能够通过树脂储存器对熔融树脂的流动进行整流,并使从模具挤出的树脂的流动在模具内的流路上的周向的哪个位置均匀化。 因此,可以消除要成型的树脂管的壁厚不均匀性。 管模成形模具包括作为其部件之一的节流部件,其包括芯部,装配到芯部的壳部分和作为形成在芯部和壳部之间的流路的一部分的树脂储存器。 作为管材原料的熔融树脂流过流路。 树脂储存器设置在芯部和壳部中的至少一个中,并且以中心轴为中心以环形形状围绕管模成形模的中心轴线。 树脂储存器在横截面中呈凹形。
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公开(公告)号:US5424104A
公开(公告)日:1995-06-13
申请号:US178616
申请日:1994-01-07
申请人: Yoshikatsu Amimoto , Fumitoshi Ikejiri , Sanehiro Yamamoto , Akinori Toyota , Katunari Nishimura , Masahiro Kanda , Tetsuo Kato
发明人: Yoshikatsu Amimoto , Fumitoshi Ikejiri , Sanehiro Yamamoto , Akinori Toyota , Katunari Nishimura , Masahiro Kanda , Tetsuo Kato
IPC分类号: C08L51/06 , C08K5/49 , C08K5/524 , C08L77/00 , C08L77/06 , H01R13/46 , B29D22/00 , B29D23/00
CPC分类号: C08L77/00
摘要: Disclosed is a thermoplastic resin composition comprising(A) an aromatic polyamide comprisingdicarboxylic acid units comprising 50-100 mol % of units derived from terephthalic acid, and 0-50 mol % of units derived from an aromatic dicarboxylic acid other than terephthalic acid and/or an aliphatic-dicarboxylic acid having 4-20 carbon atoms, anddiamine units derived from an aliphatic diamine and/or an alicyclic diamine,said aromatic polyamide having an intrinsic viscosity of 0.5-3.0 dl/g as measured in conc. sulfuric acid at 30.degree. C. and a melting point of higher than 300.degree. C.,(B) a graft modified .alpha.-olefin polymer, and/or a graft modified aromatic vinyl hydrocarbon/conjugated diene copolymer or hydrogenated product thereof, and(C) an aliphatic polyamide,wherein said thermoplastic resin composition comprises 10-80 parts by weight of the graft modified .alpha.-olefin polymer, and/or the graft modified aromatic vinyl hydrocarbon/conjugated diene copolymer or hydrogenated product thereof (B) and 5-80 parts by weight of the aliphatic polyamide (C), based on 100 parts by weight of the aromatic polyamide (A).
摘要翻译: 公开了一种热塑性树脂组合物,其包含(A)包含二羧酸单元的芳族聚酰胺,所述二羧酸单元包含50-100摩尔%的由对苯二甲酸衍生的单元,以及0-50摩尔%的衍生自除对苯二甲酸之外的芳族二羧酸的单元和/ 或具有4-20个碳原子的脂族二羧酸,以及衍生自脂族二胺和/或脂环族二胺的二胺单元,所述芳族聚酰胺的特性粘度为浓度为0.5-3.0dl / g。 硫酸在30℃,熔点高于300℃,(B)接枝改性的α-烯烃聚合物和/或接枝改性的芳族乙烯基烃/共轭二烯共聚物或其氢化产物和( C)脂肪族聚酰胺,其中所述热塑性树脂组合物包含10-80重量份的接枝改性的α-烯烃聚合物和/或接枝改性的芳族乙烯基烃/共轭二烯共聚物或其氢化产物(B)和5- 基于100重量份的芳族聚酰胺(A),80重量份的脂肪族聚酰胺(C)。
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公开(公告)号:US5405904A
公开(公告)日:1995-04-11
申请号:US244627
申请日:1994-06-03
IPC分类号: C08L77/00 , C08L77/10 , H01B3/30 , H01B3/44 , H01R13/46 , H01R13/50 , H01R13/627 , C08G18/60
摘要: The connector of the present invention has a housing formed from a polyamide resin composition which comprises 65-85% by weight of a specific polyamide (A), and 5-20% by weight of a graft-modified .alpha.-olefin random copolymer and/or graft-modified vinyl aromatic hydrocarbon/conjugated diene copolymer or a hydrogenation product thereof (B), and 0.1-1.0% by weight, based on 100% by weight of the total of the aromatic polyamide (A) and graft-modified copolymer (B), of a polyethylene wax or a metallic salt of an aliphatic carboxylic acid having 26-32 carbon atoms (C), and further, optionally, an antioxidant (D).An object of the present invention is to provide a connector which is free from a decrease in characteristics such as toughness by heating, and, in particular, can be formed with excellent moldability, and is light weight.
摘要翻译: PCT No.PCT / JP93 / 01429 Sec。 371日期:1994年6月3日 102(e)日期1994年6月3日PCT提交1993年10月5日PCT公布。 出版物WO94 / 08363 日本1994年04月14日。本发明的连接器具有由聚酰胺树脂组合物形成的壳体,其包含65-85重量%的特定聚酰胺(A)和5-20重量%的接枝改性 α-烯烃无规共聚物和/或接枝改性的乙烯基芳烃/共轭二烯共聚物或其氢化产物(B),相对于芳族聚酰胺(A)的总量的100重量%为0.1-1.0重量% )和接枝改性共聚物(B),聚乙烯蜡或具有26-32个碳原子的C的脂族羧酸的金属盐(C),以及任选的抗氧化剂(D)。 本发明的目的是提供一种连接器,其不会因加热而导致的韧性等特性的降低,特别是可以形成成型性优异,重量轻。
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