公开(公告)号：US20180156665A1

公开(公告)日：2018-06-07

申请号：US15329020

申请日：2015-08-27

Applicant: ZEUS CO., LTD.

Inventor： Kwang Il JUNG ,  Byeong Su LEE ,  Joo Hyung RYU

IPC: G01J5/00 ,  G01J5/08 ,  G01J5/52 ,  G01J5/60 ,  H01L21/66 ,  H01L21/302 ,  H01L21/67

CPC classification number: G01J5/0007 ,  B08B7/0035 ,  G01J5/0846 ,  G01J5/522 ,  G01J5/60 ,  H01L21/302 ,  H01L21/67051 ,  H01L21/67063 ,  H01L21/6708 ,  H01L21/67098 ,  H01L21/67115 ,  H01L21/6715 ,  H01L21/67248 ,  H01L22/12

Abstract: Disclosed are a substrate processing apparatus and a substrate processing method. The substrate processing apparatus includes an emissivity setting unit to which emissivity at a liquid chemical which is brought into contact with a substrate or emissivity at an interface at which the substrate and the liquid chemical are in contact with each other is input, a radiant energy input unit to which radiant energy radiating from the liquid chemical or the interface is input, and a calculation unit that calculates a calculation temperature of the liquid chemical or the interface based on the emissivity and the radiant energy.

公开(公告)号：US20170221730A1

公开(公告)日：2017-08-03

申请号：US15328595

申请日：2015-08-28

Applicant: ZEUS CO., LTD.

Inventor： Kwang Il JUNG ,  Byeong Su LEE ,  Joo Hyung RYU

IPC: H01L21/67 ,  H01L21/68

CPC classification number: H01L21/67023 ,  H01L21/67057 ,  H01L21/67075 ,  H01L21/6708 ,  H01L21/67115 ,  H01L21/67248 ,  H01L21/68

Abstract: The present invention relates to a substrate processing heater device that heats a substrate to process the substrate and a substrate solution processing device including the same. The substrate processing heater device includes a heater part having an opposite surface with a size greater than that of a processing surface of the substrate to heat the substrate and a lamp part comprising a plurality of lamp units disposed adjacent to each other on the heater part. Thus, since the opposite surface of the heater part has the size greater than that of the processing surface of the substrate, and the plurality of lamp units are disposed adjacent to each other, a heating temperature may be uniformly maintained on the processing surface of the substrate to prevent the substrate processing surface from being non-uniformly processed, thereby improving substrate processing efficiency.

公开(公告)号：US20200013918A1

公开(公告)日：2020-01-09

申请号：US16086740

申请日：2017-02-21

Applicant: ZEUS CO., LTD.

Inventor： Byeong Su LEE ,  Young Ik PARK ,  Dong Jin CHUNG ,  Shin II OH

IPC: H01L31/18 ,  H01L31/05

Abstract: A wire processing apparatus for a tabbing apparatus is provided. The wire processing apparatus for a tabbing apparatus has: a wire supplying device cutting a wire to a predetermined length; a cell conveying device, on which the wire and a cell are placed, and which conveys the wire and the cell in a conveyance direction; and a wire transferring device receiving the wire from the wire supplying device and transferring the wire to the cell conveying device. The cell is placed on the wire in the state where the wire transferring device grips the wire placed on the cell conveying device.

公开(公告)号：US20170229602A1

公开(公告)日：2017-08-10

申请号：US15514945

申请日：2015-09-22

Applicant: ZEUS CO., LTD.

Inventor： Hyung Chul GONG ,  Byeong Su LEE ,  Tae Hoon KIM

IPC: H01L31/18 ,  H01L23/00 ,  H01L31/05

CPC classification number: H01L31/188 ,  H01L24/78 ,  H01L31/04 ,  H01L31/05 ,  H01L31/18 ,  H01L2224/78621 ,  H01L2924/00014 ,  Y02E10/50 ,  H01L2224/45099

Abstract: Provided is a wire setting apparatus of a tabbing apparatus. A wire setting apparatus of a tabbing apparatus according to the present invention includes: a conveyer; a wire placement platform installed adjacent to the conveyer such that a portion of a wire placed on the conveyor lies on the wire placement platform; and a placement gripper device configured to grip the wire and to place the wire on the wire placement platform.