公开(公告)号：US20230170325A1

公开(公告)日：2023-06-01

申请号：US18096179

申请日：2023-01-12

申请人： Kulicke and Soffa Industries, Inc.

发明人： Gary S. Gillotti ,  Racheli Herskowits

IPC分类号： H01L23/00 ,  H01L21/66

CPC分类号： H01L24/78 ,  H01L24/85 ,  H01L22/12 ,  H01L22/14 ,  H01L2224/78621

摘要： A method of determining a bonding status between a wire and at least one bonding location of a workpiece is provided. The method includes the steps of: (a) bonding a portion of a wire to a bonding location of a workpiece using a bonding tool of a wire bonding machine; (b) determining a motion profile of the bonding tool for determining if the portion of the wire is bonded to the bonding location, the motion profile being configured to result in the wire being broken during the motion profile if the portion of the wire is not bonded to the bonding location; and (c) moving the bonding tool along the motion profile to determine if the portion of the wire is bonded to the bonding location. Other methods of determining a bonding status between a wire and at least one bonding location of a workpiece are also provided.

公开(公告)号：US09865560B2

公开(公告)日：2018-01-09

申请号：US15298406

申请日：2016-10-20

申请人： Kulicke and Soffa Industries, Inc.

发明人： Thomas J. Colosimo, Jr. ,  Jon W. Brunner

IPC分类号： H01L21/00 ,  H01L23/00

CPC分类号： H01L24/43 ,  H01L24/48 ,  H01L24/78 ,  H01L24/85 ,  H01L24/97 ,  H01L2224/432 ,  H01L2224/45099 ,  H01L2224/451 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/4845 ,  H01L2224/48465 ,  H01L2224/78301 ,  H01L2224/78611 ,  H01L2224/78621 ,  H01L2224/85045 ,  H01L2224/851 ,  H01L2224/85181 ,  H01L2224/85201 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2224/85365 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01049

摘要： A method of forming a wire interconnect structure includes the steps of: (a) forming a wire bond at a bonding location on a substrate using a wire bonding tool; (b) extending a length of wire, continuous with the wire bond, to another location; (c) pressing a portion of the length of wire against the other location using the wire bonding tool; (d) moving the wire bonding tool, and the pressed portion of the length of wire, to a position above the wire bond; and (e) separating the length of wire from a wire supply at the pressed portion, thereby providing a wire interconnect structure bonded to the bonding location.

公开(公告)号：US20180005979A1

公开(公告)日：2018-01-04

申请号：US15199548

申请日：2016-06-30

申请人： Simon Savard

发明人： Simon Savard

IPC分类号： H01L23/00 ,  B23K20/10

CPC分类号： H01L24/85 ,  H01L21/48 ,  H01L21/50 ,  H01L23/48 ,  H01L24/09 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L2223/6611 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48472 ,  H01L2224/49111 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/49427 ,  H01L2224/78313 ,  H01L2224/78318 ,  H01L2224/78601 ,  H01L2224/78611 ,  H01L2224/78621 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/20752 ,  H01L2224/05599

摘要： A wedge bonding method for simultaneously connecting two wires to a first component and then to a second component includes a) feeding the two wires side by side through a guide channel located at a lower end of a bonding wedge tool, b) positioning the bonding wedge tool over the first component and performing a first bond connection thereon, c) positioning the bonding wedge tool over the second component and performing a second bond connection thereon; and d) breaking tails of the two wires near the second bond connection.

公开(公告)号：US20170345787A1

公开(公告)日：2017-11-30

申请号：US15678619

申请日：2017-08-16

申请人： Kulicke and Soffa Industries, Inc.

发明人： Thomas J. Colosimo, JR. ,  Jon W. Brunner

IPC分类号： H01L23/00

CPC分类号： H01L24/43 ,  H01L24/48 ,  H01L24/78 ,  H01L24/85 ,  H01L24/97 ,  H01L2224/432 ,  H01L2224/45099 ,  H01L2224/451 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/4845 ,  H01L2224/48465 ,  H01L2224/78301 ,  H01L2224/78611 ,  H01L2224/78621 ,  H01L2224/78631 ,  H01L2224/85045 ,  H01L2224/851 ,  H01L2224/85181 ,  H01L2224/85201 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2224/85365 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01049

摘要： A method of forming a wire interconnect structure includes the steps of: (a) forming a wire bond at a bonding location on a substrate using a wire bonding tool; (b) extending a length of wire, continuous with the wire bond, to another location; (c) pressing a portion of the length of wire against the other location using the wire bonding tool; (d) moving the wire bonding tool, and the pressed portion of the length of wire, to a position above the wire bond; and (e) separating the length of wire from a wire supply at the pressed portion, thereby providing a wire interconnect structure bonded to the bonding location.

公开(公告)号：US20160225739A1

公开(公告)日：2016-08-04

申请号：US15096588

申请日：2016-04-12

申请人： Invensas Corporation

发明人： Belgacem Haba ,  Reynaldo Co ,  Rizza Lee Saga Cizek ,  Wael Zohni

IPC分类号： H01L23/00 ,  B23K20/00 ,  H01L21/56

CPC分类号： H01L24/85 ,  B23K20/004 ,  B23K20/005 ,  B23K20/007 ,  H01L21/4853 ,  H01L21/56 ,  H01L23/49811 ,  H01L24/43 ,  H01L24/78 ,  H01L2224/04105 ,  H01L2224/056 ,  H01L2224/432 ,  H01L2224/4382 ,  H01L2224/43985 ,  H01L2224/783 ,  H01L2224/78301 ,  H01L2224/7855 ,  H01L2224/78621 ,  H01L2224/78822 ,  H01L2224/85 ,  H01L2224/85345 ,  H01L2224/85399 ,  H01L2224/96 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/2064 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： An electrically conductive lead is formed using a bonding tool. After bonding the wire to a metal surface and extending a length of the wire beyond the bonding tool, the wire is clamped. Movement of the bonding tool imparts a kink to the wire at a location where the wire is fully separated from any metal element other than the bonding tool. A forming element, e.g., an edge or a blade skirt provided at an exterior surface of the bonding tool can help kink the wire. Optionally, twisting the wire while tensioning the wire using the bonding tool can cause the wire to break and define an end. The lead then extends from the metal surface to the end, and may exhibit a sign of the torsional force applied thereto.

摘要翻译： 使用接合工具形成导电引线。 在将金属丝接合到金属表面上并将一段长度的金属丝延伸超过粘合工具之后，线被夹紧。 焊接工具的移动在电线与除了焊接工具之外的任何金属元件完全分离的位置处对电线施加扭结。 形成元件，例如设置在接合工具的外表面处的边缘或叶片裙部可以帮助扭结线。 可选地，在使用接合工具张紧线的同时扭转线可能导致线断裂并限定端部。 引线然后从金属表面延伸到末端，并且可能表现出施加到其上的扭转力的迹象。

公开(公告)号：US09082753B2

公开(公告)日：2015-07-14

申请号：US14297701

申请日：2014-06-06

申请人： Invensas Corporation

发明人： Belgacem Haba ,  Reynaldo Co ,  Rizza Lee Saga Cizek ,  Wael Zohni

IPC分类号： B23K31/02 ,  H01L21/44 ,  H01L23/00 ,  B23K20/00 ,  H01L23/498 ,  H01L21/48

CPC分类号： H01L24/85 ,  B23K20/004 ,  B23K20/005 ,  B23K20/007 ,  H01L21/4853 ,  H01L21/56 ,  H01L23/49811 ,  H01L24/43 ,  H01L24/78 ,  H01L2224/04105 ,  H01L2224/056 ,  H01L2224/432 ,  H01L2224/4382 ,  H01L2224/43985 ,  H01L2224/783 ,  H01L2224/78301 ,  H01L2224/7855 ,  H01L2224/78621 ,  H01L2224/78822 ,  H01L2224/85 ,  H01L2224/85345 ,  H01L2224/85399 ,  H01L2224/96 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/2064 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： An electrically conductive lead is formed using a bonding tool. After bonding the wire to a metal surface and extending a length of the wire beyond the bonding tool, the wire is clamped. Movement of the bonding tool imparts a kink to the wire at a location where the wire is fully separated from any metal element other than the bonding tool. A forming element, e.g., an edge or a blade skirt provided at an exterior surface of the bonding tool can help kink the wire. Twisting the wire while tensioning the wire using the bonding tool can cause the wire to break and define an end. The lead then extends from the metal surface to the end, and may exhibits a sign of the torsional force applied thereto.

摘要翻译： 使用接合工具形成导电引线。 在将金属丝接合到金属表面上并将一段长度的金属丝延伸超过粘合工具之后，线被夹紧。 焊接工具的移动在电线与除了焊接工具之外的任何金属元件完全分离的位置处对电线施加扭结。 形成元件，例如设置在接合工具的外表面处的边缘或叶片裙部可以帮助扭结线。 使用接合工具拉紧电线时扭绞线会导致电线断裂并限定端部。 引线然后从金属表面延伸到末端，并且可以表现出施加到其上的扭转力的标志。

公开(公告)号：US3448910A

公开(公告)日：1969-06-10

申请号：US3448910D

申请日：1966-09-02

申请人： SOLA BASIC IND

发明人： MILLER CHARLES FREDRICK ,  ZENKER RAYMOND O

IPC分类号： B23K5/00 ,  H01L21/00 ,  B23K27/00

CPC分类号： H01L24/78 ,  B23K5/006 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/78301 ,  H01L2224/78621 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01079 ,  Y10T83/2198 ,  H01L2224/48 ,  H01L2924/00 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/00015 ,  H01L2924/2075 ,  H01L2924/20754

公开(公告)号：US20240105673A1

公开(公告)日：2024-03-28

申请号：US18010458

申请日：2021-08-26

申请人： SHINKAWA LTD.

发明人： Toru MAEDA ,  Osamu KAKUTANI

IPC分类号： H01L23/00 ,  B23K20/00 ,  B23K20/10

CPC分类号： H01L24/78 ,  B23K20/004 ,  B23K20/106 ,  B23K2101/40 ,  H01L2224/78621 ,  H01L2224/78701 ,  H01L2224/78753

摘要： A bonding apparatus includes: a clamper able to clamp a wire between a pair of arms; a horn, in which a first through hole able to hold a capillary, and a second through hole adjacent to the first through hole and penetrating the horn in an up-down direction are further formed; and a bonding stage able to carry a workpiece. An alignment method for aligning a horn and a damper of a bonding apparatus with each other includes: disposing a mirror surface to be parallel to a bonding stage; aligning a mirror image of a second through hole reflected on the mirror surface with a center of the second through hole when the mirror surface is viewed through the second through hole; and aligning the damper based on a position of the mirror image and the horn.

公开(公告)号：US20230282613A1

公开(公告)日：2023-09-07

申请号：US17769760

申请日：2021-06-07

申请人： SHINKAWA LTD.

发明人： Toshihiko TOYAMA ,  Shinsuke TEI

IPC分类号： H01L23/00 ,  H01L25/065 ,  B23K20/00 ,  B23K20/10 ,  B23K28/02

CPC分类号： H01L24/85 ,  B23K20/005 ,  B23K20/10 ,  B23K28/02 ,  H01L24/45 ,  H01L24/78 ,  H01L25/0657 ,  B23K2101/40 ,  H01L2224/45005 ,  H01L2224/78301 ,  H01L2224/78621 ,  H01L2224/85205 ,  H01L2225/06503 ,  H01L2924/40

摘要： A manufacturing method of a semiconductor device includes: a first step of, after joining a wire to an electrode using a capillary, forming a wire part by moving the capillary to a third target pointwhile feeding out the wire; a second step of forming a bent part by moving the capillary to a fourth target point while feeding out the wire; a third step of processing the bent part into a planned cut part by repeating lowering and raising of the capillary for multiple times; and a fourth step of cutting the wire at the planned cut part by raising the capillary with a wire clamper closed to form a pin wire.

公开(公告)号：US20180090464A1

公开(公告)日：2018-03-29

申请号：US15716525

申请日：2017-09-27

申请人： SHINKAWA LTD.

发明人： Shigeru HAYATA ,  Satoshi ENOKIDO

IPC分类号： H01L23/00 ,  B23K1/06 ,  B23K35/02 ,  B23K3/08

CPC分类号： H01L24/78 ,  B23K1/06 ,  B23K3/08 ,  B23K20/007 ,  B23K20/26 ,  B23K35/0261 ,  B23K2101/40 ,  B23K2101/42 ,  H01L2224/78621 ,  H01L2224/78701 ,  H01L2224/78702 ,  H01L2224/78753

摘要： In order to easily and accurately measure an offset for wire bonding and improve precision of wire bonding, a wiring bonding apparatus includes a first imaging unit, a bonding tool, a moving mechanism, a reference member, a second imaging unit arranged on the opposite side to the bonding tool and the first imaging unit with respect to a reference surface, and a control unit. The first imaging unit detects a position of an optical axis of the first image capture unit with respect to a position of the reference member, the second imaging unit detects the position of the reference member when moving the bonding tool above the reference member according to pre-stored offset values, and detects a position of a ball-shaped tip section of a wire, and the control unit measures a change in offset between the bonding tool and the first imaging unit based on each detection result.