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公开(公告)号：US20220389225A1
公开(公告)日：2022-12-08
申请号：US17752884
申请日：2022-05-25
Applicant: TAIMIDE TECHNOLOGY INCORPORATION
Inventor： YI-HSUEH HO , MENG-YING TSAI
IPC: C08L101/12
Abstract: A polymer film is provided, the polymer film comprises a liquid crystal polymer, comprising a soluble liquid crystal polymer and an insoluble liquid crystal polymer; and a polyimide polymer; wherein the polymer film has a thermal expansion coefficient between 0 and 60 ppm/t of 50° C. to 200° C., a water absorption rate less than 0.5%, a dielectric loss tangent of Df less than 0.005 at a frequency of 10 GHz, and a storage elastic modulus greater than 0.1 GPa at 310° C. A method for manufacturing the polymer film, the method for manufacturing the polymer film comprises steps: providing a liquid crystal polymer powder; providing a liquid crystal polymer glue; providing a polyamic acid glue; mixing the liquid crystal polymer powder, the liquid crystal polymer glue and the polyamic acid glue into a mixed solution, the mixed solution is made into a gel film.
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2.发明授权公开(公告)号：US10040939B2
公开(公告)日：2018-08-07
申请号：US14697185
申请日：2015-04-27
Applicant: TAIMIDE TECHNOLOGY INCORPORATION
Inventor： Chun-Ting Lai , Chih-Wei Lin
IPC: C08L79/08 , C08J5/18 , C09D179/08 , C08G73/10
Abstract: A polyimide film includes a polyimide, a carbon black present in a quantity between about 0.5 wt % and about 5 wt %, and a fluorine-containing polymer present in a quantity between about 15 wt % and about 40 wt %. The polyimide film can be a single-layer film or a multi-layer film, and has a low dielectric constant and low gloss.
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公开(公告)号：US20150018484A1
公开(公告)日：2015-01-15
申请号：US14249702
申请日：2014-04-10
Applicant: Chih-Wei Lin , Meng-Ying Tsai
Inventor： Chih-Wei Lin , Meng-Ying Tsai
CPC classification number: C08J5/18 , B29C39/003 , B29K2079/08 , B29K2105/0032 , C08G73/1067 , C08G73/1071 , C08J2379/08 , C09D179/08
Abstract: A polyimide film includes a polyimide polymer forming a main molecular structure of the polyimide film, and polyimide particles present in the polyimide film at a weight ratio between about 15 wt % and 30 wt % of a total weight of the polyimide film, the polyimide particles having an average diameter between about 3 μm and 8 μm. The polyimide film can have a 60° gloss value equal to or smaller than 10, a haze equal to or higher than 90%, and a Young's modulus equal to or higher than 280 kgf/mm2. In some embodiments, methods of fabricating the polyimide film are also described.
Abstract translation: 聚酰亚胺膜包括形成聚酰亚胺膜的主要分子结构的聚酰亚胺聚合物和以聚酰亚胺膜的总重量的约15重量％至30重量％的重量比存在于聚酰亚胺膜中的聚酰亚胺颗粒，聚酰亚胺颗粒 平均直径约3μm至8μm。 聚酰亚胺膜可以具有等于或小于10的60°光泽值，雾度等于或高于90％，杨氏模量等于或高于280kgf / mm2。 在一些实施例中，还描述了制造聚酰亚胺膜的方法。
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公开(公告)号：US08461257B2
公开(公告)日：2013-06-11
申请号：US13599550
申请日：2012-08-30
Applicant: Sheng-Yu Huang , Chung-Yi Chen
Inventor： Sheng-Yu Huang , Chung-Yi Chen
IPC: C08L79/08
CPC classification number: C08G73/1039 , C08J5/18 , C08J2379/08 , C08L79/08
Abstract: A process of manufacturing a white polyimide film comprising performing condensation polymerization of monomers comprising diamine and dianhydride components to obtain a solution; adding a dehydrant, a catalyst and a coloration filler into the solution to obtain a precursor solution; coating a layer of the precursor solution on a support; and baking the coated layer of the precursor solution to form a white polyimide film. The diamine component can include 2,2′-bis(trifluoromethyl)benzidine, and the dianhydride component can include 3,3′,4,4′-biphenyltetracarboxylic dianhydride and 2,2-bis[4-(3,4-dicarboxyphenoxy)phenyl]propane dianhydride. The coloration filler can include TiO2, Al2O3, CaCO3, CaSO4, SiO2, BN, AlN and clay.
Abstract translation: 一种制造白色聚酰亚胺膜的方法，包括进行包含二胺和二酐组分的单体的缩聚以获得溶液; 向溶液中加入脱水剂，催化剂和着色填料，得到前体溶液; 将一层前体溶液涂覆在载体上; 并烘烤前体溶液的涂层以形成白色聚酰亚胺膜。 二胺组分可包括2,2'-双（三氟甲基）联苯胺，二酐组分可包括3,3'，4,4'-联苯四羧酸二酐和2,2-双[4-（3,4-二羧基苯氧基） 苯基]丙烷二酐。 着色填料可以包括TiO2，Al2O3，CaCO3，CaSO4，SiO2，BN，AlN和粘土。
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公开(公告)号：US20240076451A1
公开(公告)日：2024-03-07
申请号：US18457370
申请日：2023-08-29
Applicant: TAIMIDE TECHNOLOGY INCORPORATION
Inventor： YUNG-CHU CHUANG , YI-HSUEH HO , TING-XUAN DENG
CPC classification number: C08G73/1067 , C08G73/1032 , C08K3/04 , C08K5/18 , C08K7/26 , C08J2379/08
Abstract: Provide a black matte polyimide film, including polyimide in an amount from 87 to 97 wt % of the black matte polyimide film, in which aromatic dianhydride and aromatic diamine are polymerized to form a polyimide precursor, and the polyimide precursor is chemically cyclized to form the polyimide, wherein the aromatic dianhydride at least includes 3,3′,4,4′-biphenyltetracarboxylic dianhydride in an amount being no less than 20 mol % of the aromatic dianhydride, and the aromatic diamine at least includes p-phenylenediamine in an amount from 5 to 40 mol % of the aromatic diamine; carbon black in an amount from 2 to 8 wt % of the black matte polyimide film; and silicon dioxide powder having a particle size between 1 and 10 μm and a density less than 1 g/cm3 and being in an amount from 1 to 5 wt % of the polyimide film.
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Patent Agency Ranking
公开(公告)号：US11732160B2
公开(公告)日：2023-08-22
申请号：US17106211
申请日：2020-11-30
Applicant: TAIMIDE TECHNOLOGY INCORPORATION
Inventor： Chun-Chi Hsu , Chun-Ting Lai , Chih-Wei Lin
CPC classification number: C09J7/38 , C09J7/25 , C09J7/383 , C09J7/385 , H01L33/0095 , C09J2203/326 , C09J2301/1242 , C09J2301/312 , C09J2433/00 , C09J2479/086
Abstract: A composite film for use in an LED wafer-level packaging process to facilitate adhesion of an LED wafer to a carrier and an LED wafer-level packaging process carried out with a heating process are introduced. The composite film includes a substrate including a first surface and a second surface; a heat-resisting pressure-sensing adhesive formed on the first surface of the substrate to allow the LED wafer to be adhered to the substrate; and a heat-resisting thermally-visbreaking pressure-sensing adhesive formed on the second surface of the substrate to allow the substrate to be adhered to the carrier. The heat-resisting thermally-visbreaking pressure-sensing adhesive undergoes the heating process to reduce its adhesiveness strength; thus, upon completion of the LED wafer-level packaging process, the carrier can be detached from the composite film easily.
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公开(公告)号：US20230203309A1
公开(公告)日：2023-06-29
申请号：US17979005
申请日：2022-11-02
Applicant: TAIMIDE TECHNOLOGY INCORPORATION
Inventor： CHUN-HUA LI , YI-HSUEH HO
IPC: C08L79/08
CPC classification number: C08L79/08
Abstract: Provides an alkali-resistant black matte polyimide film, including polyimide in an amount from 75 to 93 wt % of the alkali-resistant black matte polyimide film, in which dianhydride and diamine are polymerized to form a polyimide precursor, and the polyimide precursor is chemically cyclized to form the polyimide, wherein the dianhydride includes pyromellitic dianhydride (PMDA) and 3,3′,4,4′-biphenyltetracarboxylic dianhydride (BPDA), and the diamine includes p-Phenylenediamine (PDA) and 4,4′-oxydianiline (ODA), and wherein the BPDA is an amount from 2 to 35 wt % of the dianhydride, and the PDA is in an amount from 10 to 70 wt % of the diamine; carbon black in an amount from 2 to 8 wt % of the alkali-resistant black matte polyimide film; and polyimide micropowder having a particle size between 2 and 10 μm and being in an amount from 5 to 10 wt % of the alkali-resistant black matte polyimide film.
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公开(公告)号：US11655348B2
公开(公告)日：2023-05-23
申请号：US17355204
申请日：2021-06-23
Applicant: TAIMIDE TECHNOLOGY INCORPORATION
Inventor： Jia-Hao Wu , Chia-Ying Chou , Chun-Yi Cheng
CPC classification number: C08J5/18 , C08G73/1003 , C08J3/11 , C08J3/247 , C08J7/0427 , C08L33/24 , C08J2333/24
Abstract: A method for manufacturing a polyimide composite film for a flexible metal-clad substrate includes the following steps, providing a polyamide acid solution; providing fluorine polymer particles and mixing the fluorine polymer particles with a dispersant and an organic solution to prepare a fluorine polymer particle dispersion; forming a colloidal polyimide film from the polyamide acid solution; and coating the colloidal polyimide film with the fluorine polymer particle dispersion and then performing baking to form a polyimide composite film.
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公开(公告)号：US11597880B2
公开(公告)日：2023-03-07
申请号：US17752880
申请日：2022-05-25
Applicant: TAIMIDE TECHNOLOGY INCORPORATION
Inventor： Yi-Hsueh Ho , Meng-Ying Tsai
Abstract: A polymer film is provided, the polymer film comprises a liquid crystal polymer, comprising a soluble liquid crystal polymer and an insoluble liquid crystal polymer; and a polyimide polymer, accounting for 5 wt % or more of the polymer film. A method for manufacturing the polymer film is also provided, the method for manufacturing the polymer film comprises steps: providing a liquid crystal polymer powder, a particle size of the liquid crystal polymer powder is 0.1 um to 20 um; providing a liquid crystal polymer glue, a solid content of which is greater than 3 wt %; providing a polyamic acid glue; mixing the liquid crystal polymer powder, the liquid crystal polymer glue and the polyamic acid glue into a mixed solution, the mixed solution is made into a gel film, and the gel film is baked at a temperature of 300° C. to form a polymer film.
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公开(公告)号：US20220389177A1
公开(公告)日：2022-12-08
申请号：US17752880
申请日：2022-05-25
Applicant: TAIMIDE TECHNOLOGY INCORPORATION
Inventor： YI-HSUEH HO , MENG-YING TSAI
Abstract: A polymer film is provided, the polymer film comprises a liquid crystal polymer, comprising a soluble liquid crystal polymer and an insoluble liquid crystal polymer; and a polyimide polymer, accounting for 5 wt % or more of the polymer film. A method for manufacturing the polymer film is also provided, the method for manufacturing the polymer film comprises steps: providing a liquid crystal polymer powder, a particle size of the liquid crystal polymer powder is 0.1 um to 20 um; providing a liquid crystal polymer glue, a solid content of which is greater than 3 wt %; providing a polyamic acid glue; mixing the liquid crystal polymer powder, the liquid crystal polymer glue and the polyamic acid glue into a mixed solution, the mixed solution is made into a gel film, and the gel film is baked at a temperature of 300° C. to form a polymer film.
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