Abstract:
A method for manufacturing a semiconductor device is disclosed, comprising: providing a substrate, a gate region on the substrate and a semiconductor region at both sides of the gate region; forming sacrificial spacers, which cover a portion of the semiconductor region, on sidewalls of the gate region; forming a metal layer on a portion of the semiconductor region outside the sacrificial spacers and on the gate region; removing the sacrificial spacers; performing annealing so that the metal layer reacts with the semiconductor region to form a metal-semiconductor compound layer on the semiconductor region; and removing unreacted metal layer. By separating the metal layer from the channel and the gate region of the device with the thickness of the sacrificial spacers, the effect of metal layer diffusion on the channel and the gate region is reduced and performance of the device is improved.
Abstract:
The present invention forms Hf1-xSixOy having a cubic phase or a tetragonal phase by doping a specific amount of SiO2 component into the high-K gate dielectric material HfO2 in combination with an optimized thermal processing technique, to thereby acquire a high-K gate dielectric thin film material having a greater bandgap, a higher K value and high thermal stability. Besides, the high-K gate dielectric thin film and a preparation method thereof proposed in the present invention are helpful to solve the problem of crystallization of ultra-thin films.
Abstract:
There is provided a method for forming a metal interlayer via, comprising: forming a seed layer on a first dielectric layer and a first metal layer embedded in the first dielectric layer; forming a mask pattern on the seed layer to expose a portion of the seed layer covering some of the first metal layer; growing a second metal layer on the exposed portion of the seed layer; removing the mask pattern and a portion of the seed layer carrying the mask pattern to expose side walls of the second metal layer, a portion of the first metal layer and the first dielectric layer; forming an insulating barrier layer on the side walls, the portion of the first metal layer and the first dielectric layer. There is also provided a method for forming a metal interconnection line. Both of them can suppress the occurrence of voids. There is further provided a metal interconnection structure comprising a contact plug, a via and a metal interconnection line, wherein the via is formed on the metal interconnection line, the metal gate and/or the contact plug.
Abstract:
An apparatus and method for frequency division and filtering are provided. The apparatus includes a memory unit, an extrema calculation unit, and an envelope calculation unit. The memory unit is for storing sample data. The extrema calculation unit is for outputting and storing a number of maximum values and a number of minimum values to the memory unit according to the sample data. The envelope calculation unit is for calculating a mean envelope according to the maximum values and the minimum values, wherein within a duration when the envelope calculation unit respectively calculates an upper envelope and a lower envelope according to the maximum values and the minimum values, the envelope calculation unit outputs a value of the mean envelope to the memory unit according to a value of the upper envelope and a value of the lower envelope with respect to a corresponding identical address.
Abstract:
A method includes assigning each of a plurality of disk write and disk read requests to respective ones of a plurality of queues. Each queue has an occupancy level and a weight. A score is assigned to each of the plurality of queues, based on the occupancy and weight of the respective queue. An operation type is selected to be granted a next disk access. The selection is from the group consisting of disk write, disk read, and processor request. One of the queues is selected based on the score assigned to each queue, if the selected operation type is disk write request or disk read request. The next disk access is granted to the selected operation type and, if the selected operation type is disk write or disk read, to the selected queue.