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公开(公告)号:US12208599B2
公开(公告)日:2025-01-28
申请号:US17166080
申请日:2021-02-03
Applicant: CompoSecure, LLC
Inventor: Adam Lowe
IPC: B32B3/30 , B32B15/00 , B32B15/20 , B32B33/00 , B42D25/00 , B42D25/373 , B44C1/14 , B44D5/00 , G06K19/02 , G06K19/077 , B42D25/415 , B42D25/445 , C23C22/52 , C23C22/63 , G06K19/04
Abstract: A non-provisioned card having a front side and a back side, and at least one visible surface that is patinated or activated to promote patination.
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公开(公告)号:US11915074B2
公开(公告)日:2024-02-27
申请号:US16508570
申请日:2019-07-11
Applicant: CompoSecure, LLC
Inventor: John Herslow
IPC: G06K19/02 , G06K19/077 , B32B37/00 , B32B37/18
CPC classification number: G06K19/02 , B32B37/003 , B32B37/025 , G06K19/022 , G06K19/07716 , G06K19/07722 , B32B37/182 , B32B2307/554 , B32B2425/00 , G06K19/07794
Abstract: Cards embodying the invention include a core subassembly whose elements define the functionality of the card and a hard coat subassembly attached to the top and/or bottom sides of the core subassembly to protect the core subassembly from wear and tear and being scratched. The core subassembly may be formed solely of plastic layers or of different combinations of plastic and metal layers and may include all the elements of a smart card enabling contactless RF communication and/or direct contact communication. The hard coat subassembly includes a hard coat layer, which typically includes nanoparticles, and a buffer or primer layer formed so as to be attached between the hard coat layer and the core subassembly for enabling the lasering of the core subassembly without negatively impacting the hard coat layer and/or for imparting color to the card.
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公开(公告)号:US20240054311A1
公开(公告)日:2024-02-15
申请号:US18383996
申请日:2023-10-26
Applicant: CompoSecure, LLC
Inventor: Adam Lowe
IPC: G06K19/077
CPC classification number: G06K19/0772 , G06K19/07718
Abstract: A process for manufacturing a transaction card includes forming an opening in a card body of the transaction card; inserting an electronic component into the opening; and disposing a non-conductive material about the electronic component. A transaction card includes a molded electronic component.
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公开(公告)号:US20230419328A1
公开(公告)日:2023-12-28
申请号:US18037465
申请日:2021-11-17
Applicant: CompoSecure, LLC
Inventor: Adam Lowe , Todd Nuzum
CPC classification number: G06Q20/4018 , G06Q20/353 , G06Q20/3278 , G06Q20/023
Abstract: Systems, methods, transaction cards, mobile devices, processors, and computer memory programmed with machine-readable instructions, for providing a dynamic Card Verification Value (dCVV) to a user of a transaction card. A mobile device associated with the user and with the transaction card initiates a non-payment near field communication (NFC) with the transaction card, receives a message from the transaction card in the non-payment NFC communication, transmits a prompt to an IP address or web address over a global computer information network, and receives a secure communication from containing the dCVV from a server accessible from the IP address or web address in response to the prompt. The dCVV code is then provided to the user. In embodiments, the non-payment NFC may be initiated via a card tap, a user interface, or a communication from a website.
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公开(公告)号:US11842240B2
公开(公告)日:2023-12-12
申请号:US17502790
申请日:2021-10-15
Applicant: CompoSecure, LLC
Inventor: Adam Lowe
IPC: G06K19/06 , G06K19/07 , G06K19/077
CPC classification number: G06K19/0723 , G06K19/07773
Abstract: A dual interface transaction card includes a metal card body having first and second surfaces. A contact-only transaction module is secured in the card body, the contact-only transaction module including contact pads disposed on the first surface of the card body and including a first transaction circuit. A contactless transaction module is secured in a void in the metal card body. The contactless transaction module includes a second transaction circuit and an antenna. Also disclosed is a process for manufacturing the dual interface transaction card. The process includes the steps of constructing a metal card body having the first and second surfaces, securing the contact-only transaction module in the metal card body, forming the void in the metal card body, and securing the contactless transaction module in the void.
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公开(公告)号:US11501128B2
公开(公告)日:2022-11-15
申请号:US17101092
申请日:2020-11-23
Applicant: CompoSecure, LLC
Inventor: Adam Lowe , Syeda Hussain
IPC: G06K19/077 , G06K19/06 , G06K19/02
Abstract: A transaction card is described. The transaction card includes a non-plastic layer, one or more embedded electronics, a fill layer, and one or more additional layers. The non-plastic layer has first and second faces and a thickness therebetween, and at least a first opening in the first face. The one or more embedded electronic components are disposed in or adjacent the first opening. The fill layer is in contact with the embedded electronic components, disposed in portions of the first opening not occupied by the embedded electronics. The one or more additional layers are disposed over the fill layer.
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公开(公告)号:US11367693B2
公开(公告)日:2022-06-21
申请号:US16452740
申请日:2019-06-26
Applicant: CompoSecure, LLC
Inventor: John Herslow
IPC: H01L23/00 , B32B37/12 , B32B38/06 , B42D25/41 , B42D25/328 , G06K19/077 , H01L21/56 , B42D25/425 , B42D25/435 , B32B7/12 , B32B15/04 , G06K19/06 , H01L23/498 , B42D25/373 , B42D25/47 , B32B38/10 , B32B38/00
Abstract: Composite cards formed include a security layer comprising a hologram or diffraction grating formed at, or in, the center, or core layer, of the card. The hologram may be formed by embossing a designated area of the core layer with a diffraction pattern and depositing a thin layer of metal on the embossed layer. Additional layers may be selectively and symmetrically attached to the top and bottom surfaces of the core layer. A laser may be used to remove selected portions of the metal formed on the embossed layer, at selected stages of forming the card, to impart a selected pattern or information to the holographic region. The cards may be ‘lasered’ when the cards being processed are attached to, and part of, a large sheet of material, whereby the “lasering” of all the cards on the sheet can be done at the same time and relatively inexpensively.
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公开(公告)号:US11315002B2
公开(公告)日:2022-04-26
申请号:US17101096
申请日:2020-11-23
Applicant: CompoSecure, LLC
Inventor: Adam Lowe , Syeda Hussain
IPC: G06K19/077 , G06K19/06 , G06K19/02
Abstract: A process for making a transaction card defined by a plurality of layers is described. The process includes providing a first portion of the card, the first portion comprising a non-plastic layer having first and second faces and a thickness therebetween; forming an opening in the non-plastic layer, the opening defined through the first face; disposing embedded electronics in the opening; providing a second portion of the card; and providing a fill disposed in portions of the opening not occupied by the embedded electronics and attaching the first portion of the card to the second portion of the card.
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公开(公告)号:US11267172B2
公开(公告)日:2022-03-08
申请号:US16320597
申请日:2017-07-26
Applicant: CompoSecure, LLC
Inventor: Adam Lowe
IPC: B29C45/14 , G06K19/077 , H01Q13/10 , H05K1/18 , H05K3/28 , H05K3/30 , B22D19/00 , B29C45/17 , B29L17/00
Abstract: A process for manufacturing a transaction card includes forming an opening in a card body of the transaction card; inserting an electronic component into the opening; and molding a molding material about the electronic component. A transaction card includes a molded electronic component.
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公开(公告)号:US11247371B2
公开(公告)日:2022-02-15
申请号:US17151390
申请日:2021-01-18
Applicant: CompoSecure, LLC
Inventor: Adam Lowe
IPC: B29C45/14 , G06K19/077 , H01Q13/10 , H05K1/18 , H05K3/28 , H05K3/30 , B22D19/00 , B29C45/17 , B29L17/00
Abstract: A transaction card having an opening in a metal card body, a booster antenna in the opening, and a molding material about the booster antenna. A process for manufacturing the transaction card includes forming an opening in a card body, inserting a booster antenna into the opening, and molding a molding material about the booster antenna.
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