公开(公告)号：US20050224948A1

公开(公告)日：2005-10-13

申请号：US11033845

申请日：2005-01-13

Applicant: Jong-Joo Lee ,  Young-Hee Song

Inventor： Jong-Joo Lee ,  Young-Hee Song

IPC: H01L23/50 ,  G11C11/00 ,  H01L23/02 ,  H05K1/18

CPC classification number: H05K1/181 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2924/15311 ,  H01L2924/19105 ,  H05K2201/10159 ,  H05K2201/10734 ,  H05K2203/1572 ,  Y02P70/611 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method and apparatus of fabricating a semiconductor device are disclosed. The semiconductor device may include a buffer chip package having a buffer chip mounted on a buffer chip substrate and at least one memory package mounted on the buffer chip substrate, wherein the at least one memory package may include a plurality of memory chips. Further, the buffer chip package may have a plurality of external connection terminals.

Abstract translation: 公开了制造半导体器件的方法和装置。 半导体器件可以包括缓冲芯片封装，其具有安装在缓冲芯片基板上的缓冲芯片和安装在缓冲芯片基板上的至少一个存储器封装，其中所述至少一个存储器封装可以包括多个存储器芯片。 此外，缓冲芯片封装可以具有多个外部连接端子。