公开(公告)号：US06762164B2

公开(公告)日：2004-07-13

申请号：US10303281

申请日：2002-11-25

Applicant: Sang-Nyun Kim ,  Ho-Jeong Ahn ,  Chang-Woo Lee ,  Min-Ho Lee ,  Jung-Hun Kim ,  Jong-Il Kim ,  Seung-Jin Kim ,  Ho-Song Cho ,  Heon-Sik Lee ,  Hyung-Jin Kim

Inventor： Sang-Nyun Kim ,  Ho-Jeong Ahn ,  Chang-Woo Lee ,  Min-Ho Lee ,  Jung-Hun Kim ,  Jong-Il Kim ,  Seung-Jin Kim ,  Ho-Song Cho ,  Heon-Sik Lee ,  Hyung-Jin Kim

IPC: A61K3813

CPC classification number: A61K38/13 ,  A61K8/64 ,  A61Q5/12 ,  A61Q7/00 ,  C07K7/645

Abstract: Disclosed is a hair growth promoting agent including a cyclosporin derivative as an active ingredient, and more particularly, a hair growth promoting agent including a cyclosporin A derivative substituted in the 3-position as an active ingredient.

Abstract translation: 公开了包含环孢菌素衍生物作为活性成分的毛发生长促进剂，更具体地，涉及包含以3-位取代的环孢菌素A衍生物作为活性成分的毛发生长促进剂。

公开(公告)号：US06521595B1

公开(公告)日：2003-02-18

申请号：US09580694

申请日：2000-05-30

Applicant: Sang-Nyun Kim ,  Ho-Jeong Ahn ,  Myung-Kee Kim ,  Jong-Il Kim ,  Jung-Hun Kim ,  Chang-Woo Lee ,  Min-Ho Lee ,  Chang-Deok Kim ,  Ho-Song Cho ,  Hyun-Sik Kim ,  Min-Hwan Jung ,  Seung-Jin Kim

Inventor： Sang-Nyun Kim ,  Ho-Jeong Ahn ,  Myung-Kee Kim ,  Jong-Il Kim ,  Jung-Hun Kim ,  Chang-Woo Lee ,  Min-Ho Lee ,  Chang-Deok Kim ,  Ho-Song Cho ,  Hyun-Sik Kim ,  Min-Hwan Jung ,  Seung-Jin Kim

IPC: A61K3813

CPC classification number: A61K8/64 ,  A61K2800/70 ,  A61Q5/00 ,  A61Q5/02 ,  A61Q7/00 ,  Y10S514/828 ,  Y10S514/88 ,  Y10S514/881

Abstract: The present invention relates to methods for treating alopecia and stimulating hair growth and pharmaceutical compositions using nonimmunosuppressive [&ggr;-hydroxy-methylleucine4] cyclosporin A having superior hair growth-promoting effect, wherein the hydroxyl group is added to the carbon position of No. 4 methylleucine of cyclosporin A by the microorganism.

Abstract translation: 本发明涉及使用具有优异毛发生长促进作用的非免疫抑制性γ-羟基 - 甲基亮氨酸4]环孢菌素A治疗脱发和刺激毛发生长的方法和药物组合物，其中将羟基加入到4号甲基亮氨酸的碳位 的环孢菌素A。

公开(公告)号：US5897339A

公开(公告)日：1999-04-27

申请号：US915668

申请日：1997-08-21

Applicant: Young Jae Song ,  Se Yong Oh ,  Tae Je Cho ,  Seung Ho Ahn ,  Min Ho Lee

Inventor： Young Jae Song ,  Se Yong Oh ,  Tae Je Cho ,  Seung Ho Ahn ,  Min Ho Lee

IPC: C09J177/00 ,  C09J179/08 ,  C09J183/10 ,  C09J201/00 ,  H01L23/28 ,  H01L23/495 ,  H01L23/50 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC classification number: H01L24/27 ,  H01L23/4951 ,  H01L24/06 ,  H01L24/32 ,  H01L24/743 ,  H01L24/83 ,  H01L2224/04042 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/2919 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2224/92147 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/351

Abstract: A lead-on-chip semiconductor device package is formed by attaching a lead frame having a single adhesive layer to a semiconductor chip. Electrode pads of the chip are electrically connected by bonding wires and mechanically connected by the adhesive layer to the lead frame, and then encapsulated by an encapsulant such as molding compound. The adhesive layer is formed from a liquid adhesive having a certain viscosity. The adhesive material is continuously applied to spaces between adjacent inner leads as well as the top surface of the leads and then cured. The leads are disposed at the same intervals and include some side leads with a larger width in order to form the adhesive layer with a uniform thickness. Thermoplastic resins are preferably used as the adhesive, but thermosetting resins may be used as well. In the case of thermoplastic resins, the temperature of a cure step is about 200.degree. C. and that of chip attachment step is about 400.degree. C.

Abstract translation: 通过将具有单一粘合剂层的引线框架附接到半导体芯片来形成片上半导体器件封装。 芯片的电极焊盘通过接合线电连接，并通过粘合剂层机械地连接到引线框架，然后由诸如模塑料的密封剂包封。 粘合剂层由具有一定粘度的液体粘合剂形成。 将粘合剂材料连续地施加到相邻的内部引线之间的空间以及引线的顶表面上，然后固化。 引线以相同的间隔布置，并且包括具有较大宽度的一些侧引线，以便形成具有均匀厚度的粘合剂层。 优选使用热塑性树脂作为粘合剂，但是也可以使用热固性树脂。 在热塑性树脂的情况下，固化步骤的温度为约200℃，芯片附着步骤的温度为约400℃。