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    ELECTRONIC ASSEMBLY
    93.
    发明申请
    ELECTRONIC ASSEMBLY 有权
    电子总成

    公开(公告)号：US20160266616A1

    公开(公告)日：2016-09-15

    申请号：US14798476

    申请日：2015-07-14

    Applicant: Acer Incorporated

    Inventor： Yi-Mu Chang ,  Yan-Lin Kuo ,  Cheng-Nan Ling ,  Chun-I Chen ,  Hsien-Wei Chen ,  Yu-Shih Wang ,  Chen-Chih Hou

    IPC: G06F1/16

    CPC classification number: G06F1/1683 ,  G06F1/1632 ,  G06F1/1654

    Abstract: An electronic assembly including a first body having at least one recess, a first electronic module disposed within the first body, at least one first terminal set disposed within the recess and electrically connected to the first electronic module, a second body having at least one protruding portion, a second electronic module disposed within the second body and at least one second terminal set disposed in the protruding portion, partially exposed by the surface of the protruding portion and electrically connected to the second electronic module. The first and the second bodies are assembled to each other by the protruding portion inserting into the recess, and the first terminal set contacts the second terminal set, such that the first and the second electronic modules are electrically connected to each other through the first and the second terminal sets.

    Abstract translation: 一种电子组件，包括具有至少一个凹部的第一主体，设置在所述第一主体内的第一电子模块，设置在所述凹部内并电连接到所述第一电子模块的至少一个第一端子组，具有至少一个突出部 设置在所述第二主体内的第二电子模块和设置在所述突出部分中的至少一个第二端子组，所述至少一个第二端子组由所述突出部分的表面部分地暴露并电连接到所述第二电子模块。 第一和第二主体通过插入凹部中的突出部彼此组装，并且第一端子组接触第二端子组，使得第一和第二电子模块通过第一和第二端子组彼此电连接， 第二台终端机。

    ELECTRONIC PERIPHERAL AND ELECTRONIC DEVICE
    94.
    发明申请
    ELECTRONIC PERIPHERAL AND ELECTRONIC DEVICE 审中-公开
    电子外围和电子设备

    公开(公告)号：US20150077914A1

    公开(公告)日：2015-03-19

    申请号：US14164275

    申请日：2014-01-27

    Applicant: Acer Incorporated

    Inventor： Yi-Ta Huang ,  Cheng-Nan Ling ,  Wen-Chieh Tai ,  Yu-Shih Wang

    IPC: G06F1/16

    CPC classification number: G06F1/1684 ,  G06F1/1632 ,  G06F1/1656

    Abstract: An electronic device adapted to be electrically connected to an electronic peripheral is provided. The electronic peripheral includes a main body and a plurality of peripheral pads. The peripheral pads are disposed on a corresponding surface of the main body. The electronic device includes a body and a plurality of device pads. The body includes a receiving surface. The device pads are disposed on the receiving surface. When the corresponding surface is disposed on the receiving surface and each of the peripheral pads is in contact with the corresponding device pad, the main body is electrically connected with the body.

    Abstract translation: 提供了一种适于电连接到电子外围设备的电子设备。 电子外围设备包括主体和多个外围垫。 外围垫片设置在主体的相应表面上。 电子装置包括主体和多个装置垫。 主体包括接收面。 装置垫设置在接收表面上。 当对应的表面设置在接收表面上并且每个外围焊盘与相应的装置焊盘接触时，主体与主体电连接。

    PORTABLE ELECTRONIC DEVICE
    96.
    发明公开
    PORTABLE ELECTRONIC DEVICE 审中-公开

    公开(公告)号：US20240069606A1

    公开(公告)日：2024-02-29

    申请号：US18501055

    申请日：2023-11-03

    Applicant: Acer Incorporated ,  Sinher Technology Inc.

    Inventor： Yi-Ta Huang ,  Cheng-Nan Ling ,  Chih-Chun Liu ,  Yung-Chang Chiang

    IPC: G06F1/16 ,  F16C11/04

    CPC classification number: G06F1/1681 ,  F16C11/04 ,  G06F1/1616 ,  E05D3/18

    Abstract: A portable electronic device including a first body, a second body, and a hinge mechanism is provided. The second body is connected to the first body through the hinge mechanism, and the hinge mechanism has a basis axis located at the first body and a rotation axis located at a lower end of the second body. When the second body rotates with respect to the first body, the rotation axis slides along an arc shaped path with respect to the basis axis to increase or decrease a distance between the rotation axis and the basis axis and increase or decrease a distance between the lower end of the second body and a back end of the first body.

    Casing and manufacturing method thereof
    99.
    发明授权
    Casing and manufacturing method thereof 有权

    公开(公告)号：US11778766B2

    公开(公告)日：2023-10-03

    申请号：US17087634

    申请日：2020-11-03

    Applicant: Acer Incorporated

    Inventor： Wen-Hsin Lin ,  Cheng-Nan Ling ,  Wen-Chieh Tai

    IPC: H05K5/04 ,  B23K26/362 ,  B24B19/02 ,  C25D13/20

    CPC classification number: H05K5/04 ,  B23K26/362 ,  B24B19/02 ,  C25D13/20

    Abstract: A manufacturing method of a casing including the following steps is provided. A magnesium alloy substrate is provided first. Next, a protective film is formed on the magnesium alloy substrate. A grinding treatment, a cutting treatment, or an engraving treatment is then performed to remove portions of the protective film and portions of the magnesium alloy substrate. An electrophoretic coating treatment is performed afterwards to form a light-transmissive coating layer covering the protective film and the magnesium alloy substrate. A casing is also provided.

    ELECTRONIC DEVICE
    100.
    发明申请
    ELECTRONIC DEVICE 有权

    公开(公告)号：US20230090418A1

    公开(公告)日：2023-03-23

    申请号：US18071654

    申请日：2022-11-30

    Applicant: Acer Incorporated

    Inventor： Yi-Ta Huang ,  Cheng-Nan Ling ,  Wu-Chen Lee ,  Wen-Chieh Tai ,  Kun-You Chuang

    IPC: G06F1/16

    Abstract: An electronic device including a hinge module, a first body, a second body, and a flexible display assembled to the first body and the second body is provided. Each of the first body and the second body is pivoted and slidably connected to the hinge module, and a cover of the hinge module is exposed out of the first body and the second body. The first body and the second body are rotated relatively via the hinge module to bend or flatten the flexible display, when the flexible display is bending from a flat state, a bending portion of the flexible display leans against the cover and pushes the cover away from the first body and the second body.

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