CLEANING COMPOSITION AND METHOD FOR CLEANING SUBSTRATE FOR ELECTRONIC DEVICE
    94.
    发明申请
    CLEANING COMPOSITION AND METHOD FOR CLEANING SUBSTRATE FOR ELECTRONIC DEVICE 有权
    用于清洁电子设备的基板的清洁组合物和方法

    公开(公告)号:US20100319735A1

    公开(公告)日:2010-12-23

    申请号:US12867468

    申请日:2009-02-13

    IPC分类号: B08B3/12 C11D3/60

    摘要: A cleaning composition which is capable of removing both organic soiling and particulate soiling adhered to a substrate for an electronic device with a high degree of cleanliness, and which also has minimal impact on the environment, as well as a method of cleaning a substrate for an electronic device. The present invention relates to a cleaning composition used for cleaning a substrate for an electronic device including a water-soluble salt (A) containing a transition metal, a chelating agent (B) and a peroxide (C), wherein the amount of the chelating agent (B) is not less than 0.5 molar equivalents relative to the amount of the water-soluble salt (A) containing a transition metal.

    摘要翻译: 一种清洁组合物,其能够除去附着在具有高清洁度的电子设备的基板上并且对环境影响最小的有机污染物和微粒污染物,以及清洁基板的方法, 电子设备。 本发明涉及一种清洗组合物,其用于清洗包含含有过渡金属的水溶性盐(A),螯合剂(B)和过氧化物(C))的电子器件用基材,其中螯合剂 试剂(B)相对于含有过渡金属的水溶性盐(A)的量不小于0.5摩尔当量。