公开(公告)号：US20200337179A1

公开(公告)日：2020-10-22

申请号：US16914096

申请日：2020-06-26

Applicant: Intel Corporation

Inventor： Jeff Ku ,  Ming-Che Lee ,  Wei-Ming Chu ,  Cora Nien

IPC: H05K7/20

Abstract: Particular embodiments described herein provide for an expandable heat sink for an electronic device. The expandable heat sink includes flexible thermal conductive material and an activator. The activator can cause the expandable heat sink to be in a retracted configuration with a retracted height or in an expanded configuration with an expanded height, wherein the expanded height is greater than the retracted height. In an example, the flexible thermal conductive material includes graphite sheets.

公开(公告)号：US10747277B2

公开(公告)日：2020-08-18

申请号：US16226360

申请日：2018-12-19

Applicant: Intel Corporation

Inventor： Jeff Ku ,  Shantanu D Kulkarni ,  Gavin Sung

IPC: G06F1/20 ,  H05K7/20

Abstract: System and method for transferring heat generated by internal electronic components of a mobile computer to its external environment. Heat absorption and transfer elements disposed, in part, proximate heat-producing components move the heat to a remote heat sink assembly adapted to dissipate the heat. Example embodiments include one or more fans to produce internal airflow(s) that further facilitate internal heat transfer.

公开(公告)号：US20190251698A1

公开(公告)日：2019-08-15

申请号：US16201894

申请日：2018-11-27

Applicant: Intel Corporation

Inventor： Simon Tsai ,  Jeff Ku ,  Gavin Sung ,  Paul M. Zagacki ,  Tim Liu ,  Ivan By Wang ,  Christopher J. Hamlin

IPC: G06T7/50 ,  G06T7/80 ,  G06T7/40 ,  H04N5/225 ,  H04N5/33

CPC classification number: G06T7/50 ,  G06T7/40 ,  G06T7/80 ,  H04N5/225 ,  H04N5/2252 ,  H04N5/332

Abstract: Methods and apparatus relating to a mechanical system on computer with rotational projector and RealSense™ camera are described. In an embodiment, a device includes three portions: a first portion to comprise a projector; a second portion to comprise a camera; and a third portion to comprise one or more computing system components. At least the first and second portions are rotationally engaged to allow for independent rotation of the first portion and the second portion. Other embodiments are also disclosed and claimed.

公开(公告)号：US20190129480A1

公开(公告)日：2019-05-02

申请号：US16226360

申请日：2018-12-19

Applicant: Intel Corporation

Inventor： Jeff Ku ,  Shantanu D Kulkarni ,  Gavin Sung

IPC: G06F1/20 ,  H05K5/02 ,  H05K7/20

Abstract: System and method for transferring heat generated by internal electronic components of a mobile computer to its external environment. Heat absorption and transfer elements disposed, in part, proximate heat-producing components move the heat to a remote heat sink assembly adapted to dissipate the heat. Example embodiments include one or more fans to produce internal airflow(s) that further facilitate internal heat transfer.

公开(公告)号：USD819018S1

公开(公告)日：2018-05-29

申请号：US29540695

申请日：2015-09-25

Applicant: Intel Corporation

Designer： Simon Tsai ,  Oliver Tsui ,  Jeff Ku ,  Pei-yang Sung

公开(公告)号：US09696754B2

公开(公告)日：2017-07-04

申请号：US14225933

申请日：2014-03-26

Applicant: INTEL CORPORATION

Inventor： Russell S. Aoki ,  Jeff Ku ,  Sheng-Chao Lin

IPC: G06F1/16

CPC classification number: G06F1/162 ,  G06F1/1616 ,  G06F1/1681 ,  Y10T16/545 ,  Y10T16/5472 ,  Y10T29/24

Abstract: Techniques for forming a hinge are described herein. The hinge is to couple a first housing of a computing device and a second housing of the computing device. The hinge is to cause the first housing to have three degrees of freedom in movement from the second housing.