公开(公告)号：US20060175109A1

公开(公告)日：2006-08-10

申请号：US11047584

申请日：2005-02-02

申请人： Chih-Hung Cheng

发明人： Chih-Hung Cheng

IPC分类号： B62K11/00

CPC分类号： B62K5/01 ,  B62H1/12

摘要： A pair of side wheels mounted to the front wheel of a motorcycle includes front base frame, steering unit comprised of linkage and steering rod set being pivoted to the center of the base frame, two side suspensions, and two side wheels; a pair of connection rods of the linkage unit each respectively pivoted to the base of the side wheel unit; a regulator from the suspension unit being connected to where between the base and the base frame, and further to head tube of the frame through an absorber; and the base being pivoted to the side wheel to improve riding safety and stability.

摘要翻译： 安装在摩托车的前轮上的一对侧轮包括前基座，由连杆和转向杆组构成的转向单元，该转向杆组件枢转到基架的中心，两个侧悬架和两个侧轮; 所述联动单元的一对连接杆各自分别枢转到所述侧轮单元的基部; 来自悬挂单元的调节器连接到基座和底座之间的位置，并且通过吸收器进一步到框架的头管; 并且基座枢转到侧轮以改善骑行安全性和稳定性。

公开(公告)号：US06171976B2

公开(公告)日：2001-01-09

申请号：US09261098

申请日：1999-03-02

申请人： Chih-Hung Cheng

发明人： Chih-Hung Cheng

IPC分类号： H01L21302

CPC分类号： H01L21/31053

摘要： A method of chemical-mechanical polishing. A die region and a scribe line region are defined on a wafer. A dummy pattern is formed in the scribe line region. A dielectric layer is formed to cover the dummy pattern and the wafer. The dielectric layer is planarized by chemical-mechanical polishing.

摘要翻译： 化学机械抛光方法。 芯片区域和划线区域被限定在晶片上。 在划线区域中形成虚拟图案。 形成介电层以覆盖虚设图案和晶片。 介电层通过化学机械抛光进行平面化。

公开(公告)号：US08786504B2

公开(公告)日：2014-07-22

申请号：US13110896

申请日：2011-05-18

申请人： Hsin-Chin Hsu ,  Fang-Lih Lin ,  Chih-Hung Cheng

发明人： Hsin-Chin Hsu ,  Fang-Lih Lin ,  Chih-Hung Cheng

IPC分类号： H01Q9/00 ,  H04B5/00 ,  H04B17/00

CPC分类号： H04B5/0068 ,  H04B5/0081 ,  H04B17/21

摘要： A circuit capable of automatically calibrating a resonant frequency of an antenna includes the antenna, a switch, a conversion unit, a count comparator, and a capacitor array. The switch is coupled to the antenna for being turned on and turned off according to a pulse. The antenna is used for generating the resonant frequency according to on and off of the switch. The conversion unit is coupled to the antenna for generating a clock according to a signal with the resonant frequency. The count comparator is coupled to the conversion unit for counting a number generated by a reference clock during a period of the clock, and comparing the pulse number with a predetermined value to generate an adjustment signal. The capacitor array is used for adjusting capacitance of the capacitor array according to the adjustment signal.

摘要翻译： 能够自动校准天线的谐振频率的电路包括天线，开关，转换单元，计数比较器和电容器阵列。 开关被耦合到天线，以根据脉冲被导通和关断。 该天线用于根据开关的导通和关断产生谐振频率。 转换单元耦合到天线，用于根据具有谐振频率的信号产生时钟。 计数比较器耦合到转换单元，用于在时钟周期期间对由参考时钟生成的数字进行计数，并将脉冲数与预定值进行比较以产生调整信号。 电容器阵列用于根据调整信号调整电容器阵列的电容。

公开(公告)号：US07245494B2

公开(公告)日：2007-07-17

申请号：US11285028

申请日：2005-11-23

申请人： Chih-Hung Cheng

发明人： Chih-Hung Cheng

IPC分类号： H05K7/20

CPC分类号： H01L23/427 ,  F28D15/0275 ,  F28F1/32 ,  F28F3/048 ,  G06F1/20 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A thermal module includes a thermal body, at least one thermal tube, and a holding part. The thermal tube includes a heat receiving portion and condenser terminals connecting with the thermal body, wherein the heat receiving portion has a plane. The holding part includes a plate body with trenches therein, wherein the trenches has through holes and a connecting part formed between the through holes. The through holes are used for receiving and holding the heat receiving portion of the thermal tube. The connecting part are connected with a top surface of the heat receiving portion. Thus, thermal transfer is speed up, and the thermal module is assembled without a thermal treatment which causing a copper reduction reaction, resulting in improvement of thermal conduction, reduction of cost, and manufacturing time saving.

摘要翻译： 热模块包括热体，至少一个热管和保持部。 热管包括热接收部分和与热体连接的冷凝器端子，其中热接收部分具有平面。 保持部包括其中具有沟槽的板体，其中沟槽具有通孔和形成在通孔之间的连接部。 通孔用于接收和保持热管的受热部分。 连接部与受热部的顶面连接。 因此，热转印加速，热模块组装而不进行铜还原反应的热处理，导致热传导的提高，成本的降低和制造时间的节省。

公开(公告)号：US20070144710A1

公开(公告)日：2007-06-28

申请号：US11313917

申请日：2005-12-22

申请人： Chih-Hung Cheng

发明人： Chih-Hung Cheng

IPC分类号： H05K7/20

CPC分类号： H01L23/427 ,  F28D15/0275 ,  F28F1/32 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method for manufacturing a heat pipe cooling device. The heat pipe cooling device includes a U-shaped heat pipe, which is embedded within a heat conductor. The heat conductor includes a rectangular base and an upper cover connected to the base. The base includes many retaining grooves which allow the absorption end of the heat pipe to be disposed therein. The upper cover includes many through holes formed thereon corresponding to the cooling end of the heat pipe. The bottom surface includes many protrusive portions corresponding to the inner side of the absorption end of the heat pipe. Furthermore, the upper cover and the base both include a positioning portion for engaging each other. In this manner, the upper cover is pressed on the cooling end of the heat pipe. The protrusive portion will push the heat pipe to tightly contact with the base. Finally, a planarization process is performed, thereby making the bottom surface of the absorption end and the bottom surface of the heat conductor to form a flat surface.

摘要翻译： 一种热管冷却装置的制造方法。 热管冷却装置包括嵌入热导体内的U形热管。 热导体包括矩形基座和连接到基座的上盖。 基座包括允许热管的吸收端设置在其中的许多保持槽。 上盖包括形成在其上的许多通孔，其对应于热管的冷却端。 底表面包括对应于热管的吸收端的内侧的许多突出部分。 此外，上盖和底座都包括用于彼此接合的定位部。 以这种方式，上盖被压在热管的冷却端上。 突出部分将推动热管与基座紧密接触。 最后，进行平坦化处理，从而使吸收端的底面和导热体的底面形成平坦面。

公开(公告)号：US07093648B1

公开(公告)日：2006-08-22

申请号：US11313913

申请日：2005-12-22

申请人： Chih-Hung Cheng

发明人： Chih-Hung Cheng

IPC分类号： H05K7/20

CPC分类号： H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat pipe cooling device includes a heat conductor base, heat pipes and a cooling body. The heat conductor base further includes a base with multiple trenches and an upper cover. The heat pipes include a heat reception end and a cooling end. When the heat reception end of the heat pipes is contained in the trenches of the base, the bottom portion of the heat reception end tightly contacts the trenches. The upper cover includes multiple through holes and compressive portions formed between each pair of the through holes. The upper cover and the base are then tightly combined. The cooling end of the heat pipe penetrates the through hole. The compressive portion between the through holes is securely affixed above the heat reception end of the heat pipes. A cooling body is connected to the cooling end of the heat pipe, thereby forming the heat pipe cooling device.

摘要翻译： 热管冷却装置包括热导体基座，热管和冷却体。 热导体基底还包括具有多个沟槽的底座和上盖。 热管包括热接收端和冷却端。 当热管的热接收端容纳在基底的沟槽中时，受热端的底部与沟槽紧密接触。 上盖包括形成在每对通孔之间的多个通孔和压缩部分。 然后将上盖和底座紧紧组合。 热管的冷却端穿过通孔。 通孔之间的压缩部牢固地固定在热管的受热端的上方。 冷却体连接到热管的冷却端，从而形成热管冷却装置。