公开(公告)号：US08950279B2

公开(公告)日：2015-02-10

申请号：US13542583

申请日：2012-07-05

Applicant: Chih-Hung Cheng ,  Wei-Ming Huang

Inventor： Chih-Hung Cheng ,  Wei-Ming Huang

IPC: F16H19/02

CPC classification number: F16H25/2015 ,  F16H2025/209 ,  H02K7/06 ,  H02K7/1166 ,  H02K11/21 ,  Y10T74/18688 ,  Y10T74/18792 ,  Y10T74/19828

Abstract: A linear actuator includes a motor, a movable unit, and a stroke control unit. The motor includes a spindle. The movable unit includes a worm gear and a rotary shaft. The worm is provided with annular spiral or helix teeth. The stroke control unit includes at least one transmission member and at least one micro switch. The at least one transmission member is engaged with and driven by the spiral or the helix teeth of the movable unit for synchronical rotation to activating or deactivating the micro switch. In this way, the linear actuator is simplified in structure and reduced in volume.

Abstract translation: 线性致动器包括马达，可移动单元和行程控制单元。 电机包括一个主轴。 可移动单元包括蜗轮和旋转轴。 蜗杆带有环形螺旋或螺旋齿。 行程控制单元包括至少一个传动构件和至少一个微动开关。 所述至少一个传动构件与所述可移动单元的螺旋或螺旋齿接合并由所述可移动单元的螺旋齿驱动，用于同步旋转以启动或停用所述微动开关。 以这种方式，线性致动器的结构简化并且体积减小。

公开(公告)号：US08484845B2

公开(公告)日：2013-07-16

申请号：US12562352

申请日：2009-09-18

Applicant: Kuo-Len Lin ,  Chen-Hsiang Lin ,  Ken Hsu ,  Chih-Hung Cheng

Inventor： Kuo-Len Lin ,  Chen-Hsiang Lin ,  Ken Hsu ,  Chih-Hung Cheng

IPC: B21D53/06 ,  B21D22/06

CPC classification number: F28D15/043 ,  B21D22/025 ,  B21D22/06 ,  B21D53/08 ,  F28D15/0233 ,  F28D15/0266 ,  F28D15/0275 ,  F28F1/32 ,  Y10T29/4935 ,  Y10T29/49353 ,  Y10T29/49391 ,  Y10T29/53122

Abstract: A heat conducting structure, a heat sink with the heat conducting structure, and a manufacturing method of the heat conducting structure are disclosed. The manufacturing method includes the steps of providing a first mold (20) and a second mold (30) having different concave cambers (211, 211a, 221, 221a), using the first mold (20) to progressively compress the heat pipes (10) and form a camber (112) at an evaporating section (11), using the second mold (30) to compress the camber (112) to form a contact plane (112′) and an attaching plane (113′) perpendicular to each other, coating an adhesive (50) on the contact planes (112′), connecting the contact planes to make the attaching planes co-planar.

Abstract translation: 公开了一种导热结构，具有导热结构的散热器和导热结构的制造方法。 该制造方法包括以下步骤：使用第一模具（20）逐渐压缩热管（10），从而提供具有不同的凹形弯曲部（211,211a，221,221a）的第一模具（20）和第二模具（30） ），并且在蒸发部分（11）处形成弯度（112），使用所述第二模具（30）压缩所述外倾角（112）以形成垂直于每个的所述接触平面（112'）和附接平面（113'） 另一方面，在接触平面（112'）上涂覆粘合剂（50），连接接触平面以使附着平面共面。

公开(公告)号：US08464547B2

公开(公告)日：2013-06-18

申请号：US12711341

申请日：2010-02-24

Applicant: Ken Hsu ,  Chih-Hung Cheng ,  Chen-Hsiang Lin ,  Kuo-Len Lin

Inventor： Ken Hsu ,  Chih-Hung Cheng ,  Chen-Hsiang Lin ,  Kuo-Len Lin

IPC: F25D23/12 ,  F25B21/00 ,  F24H3/06 ,  F28F7/00 ,  F28D15/00 ,  G06F1/20 ,  H05K7/20

CPC classification number: F25B21/02 ,  F25B25/00 ,  F25B2321/0251 ,  G06F1/1632 ,  G06F1/203

Abstract: A cooling rack structure includes a cooling plate (1), a temperature conductor (2), a centrifugal fan (3), a cooling body (4) and a thermoelectric cooling component (5). A temperature-super-conducting component (13) is disposed on an inner surface (11) of the cooling plate (1). The temperature conductor (2) is arranged on the temperature-super-conducting component (13). In addition, a heat-exhausting hole (120) is arranged on an upper side of the cooling plate (1). The centrifugal fan (3) is disposed between the temperature conductor (2) and the heat-exhausting hole (120) while the cooling body (4) is disposed between the fan (3) and the heat-exhausting hole (120). A hot side face (501) of the thermoelectric cooling component (5) closely contacts the cooling body (4) while a cold side face (500) is arranged on the temperature-super-conducting component (13). By quickly conducting the low temperature generated from the thermoelectric cooling component (5) onto the cooling plate (1) through the temperature-super-conducting component (13), a low temperature surface can be uniformly provided to obtain a cooling effect.

Abstract translation: 冷却架结构包括冷却板（1），温度导体（2），离心风扇（3），冷却体（4）和热电冷却组件（5）。 温度超导部件（13）设置在冷却板（1）的内表面（11）上。 温度导体（2）布置在温度超导部件（13）上。 另外，在冷却板（1）的上侧配置有排热孔（120）。 离心风扇（3）设置在温度导体（2）和排热孔（120）之间，同时冷却体（4）设置在风扇（3）和排热孔（120）之间。 热电冷却部件（5）的热侧面（501）与冷却体（4）紧密接触，而冷侧面（500）配置在温度超导部件（13）上。 通过将热电冷却部件（5）产生的低温通过温度超导部件（13）快速地导通到冷却板（1）上，可以均匀地设置低温表面以获得冷却效果。

公开(公告)号：US08328601B2

公开(公告)日：2012-12-11

申请号：US13409575

申请日：2012-03-01

Applicant: Kuo-Len Lin ,  Chen-Hsiang Lin ,  Jui-Ho Liu ,  Chih-Hung Cheng ,  Ken Hsu

Inventor： Kuo-Len Lin ,  Chen-Hsiang Lin ,  Jui-Ho Liu ,  Chih-Hung Cheng ,  Ken Hsu

IPC: B24B1/00

CPC classification number: F28D15/0275 ,  B24B37/04 ,  B24B37/12 ,  B24B37/30 ,  B24B57/02 ,  F28D15/0233 ,  F28F13/182 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method for making heated plane of a cooler to obtain better flatness and roughness includes a grinder with a grinding plate and a fixture. Then, the cooler is arranged onto the fixture. Next, the abrasive is injected into the gap between the grinding plate and the heated plane, making the fixture press and clamp the cooler in a way, such that the heated plane of the cooler contacts the abrasive closely. Finally, the grinding plate is rotated to make at least one grinding process to the heated plane, making the heated plane obtain a surface with better roughness and flatness, further enhancing the contact tightness between the heated plane and a heating element, and therefore promoting the thermally conductive efficiency between the cooler and the heating element.

Abstract translation: 用于制造冷却器的加热平面以获得更好的平坦度和粗糙度的方法包括具有研磨板和夹具的研磨机。 然后，将冷却器布置在固定装置上。 接下来，研磨剂被注入到研磨板和加热平面之间的间隙中，使夹具以一定的方式压紧并夹紧冷却器，使得冷却器的加热平面与磨料紧密接触。 最后，研磨板旋转，对被加热面进行至少一次研磨处理，使得加热面得到更好的粗糙度和平坦度的表面，进一步增强了加热面与加热元件之间的接触紧密度，从而促进了 冷却器和加热元件之间的导热效率。

公开(公告)号：US20120276822A1

公开(公告)日：2012-11-01

申请号：US13409575

申请日：2012-03-01

Applicant: Kuo-Len LIN ,  Chen-Hsiang Lin ,  Jui-Ho Liu ,  Chih-Hung Cheng ,  Ken Hsu

Inventor： Kuo-Len LIN ,  Chen-Hsiang Lin ,  Jui-Ho Liu ,  Chih-Hung Cheng ,  Ken Hsu

IPC: B24B19/00

CPC classification number: F28D15/0275 ,  B24B37/04 ,  B24B37/12 ,  B24B37/30 ,  B24B57/02 ,  F28D15/0233 ,  F28F13/182 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method for making heated plane of a cooler to obtain better flatness and roughness includes a grinder with a grinding plate and a fixture. Then, the cooler is arranged onto the fixture. Next, the abrasive is injected into the gap between the grinding plate and the heated plane, making the fixture press and clamp the cooler in a way, such that the heated plane of the cooler contacts the abrasive closely. Finally, the grinding plate is rotated to make at least one grinding process to the heated plane, making the heated plane obtain a surface with better roughness and flatness, further enhancing the contact tightness between the heated plane and a heating element, and therefore promoting the thermally conductive efficiency between the cooler and the heating element.

Abstract translation: 用于制造冷却器的加热平面以获得更好的平坦度和粗糙度的方法包括具有研磨板和夹具的研磨机。 然后，将冷却器布置在固定装置上。 接下来，研磨剂被注入到研磨板和加热平面之间的间隙中，使夹具以一定的方式压紧并夹紧冷却器，使得冷却器的加热平面与磨料紧密接触。 最后，研磨板旋转，对被加热面进行至少一次研磨处理，使得加热面得到更好的粗糙度和平坦度的表面，进一步增强了加热面与加热元件之间的接触紧密度，从而促进了 冷却器和加热元件之间的导热效率。

公开(公告)号：US08291590B2

公开(公告)日：2012-10-23

申请号：US13278162

申请日：2011-10-20

Applicant: Kuo-Len Lin ,  Chen-Hsiang Lin ,  Chiao-Li Huang ,  Ken Hsu ,  Chih-Hung Cheng

Inventor： Kuo-Len Lin ,  Chen-Hsiang Lin ,  Chiao-Li Huang ,  Ken Hsu ,  Chih-Hung Cheng

IPC: B21D53/02 ,  F28D15/02

CPC classification number: F28D15/0266 ,  F28F1/32 ,  F28F2220/00 ,  H01L23/3672 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  Y10T29/49345 ,  Y10T29/4935 ,  Y10T29/49353 ,  Y10T29/49826 ,  H01L2924/00

Abstract: A method for assembling a fins-type heat sink includes providing a heat sink, a presser and a plurality of caps, the heat sink having a heat pipe and a plurality of fins disposed on the heat pipe, the presser being provided with through-holes allowing the distal ends of the heat pipe to be inserted therein, a periphery of each through-hole being provided with an annular neck, the presser being provided with notches that are arranged circumferentially outside the annular neck; (b) covering the caps on the annular necks of the presser respectively, each caps extending downwards to form protruding flaps penetrating the notches; (c) disposing a plate-like die on the topmost fin of the heat sink; (d) inserting a distal end of the heat pipe through the through-hole of the presser to abut inside the cap, while folding the flaps outwards via the plate-like die.

Abstract translation: 翅片式散热器的组装方法包括设置散热器，压脚和多个盖，所述散热器具有热管和设置在所述热管上的多个散热片，所述按压器设置有通孔 允许热管的远端插入其中，每个通孔的周边设置有环形颈部，压脚设置有周向设置在环形颈部周围的凹口; （b）分别覆盖按压器的环形颈部上的盖，每个盖向下延伸以形成穿过凹口的突出的翼片; （c）将板状模具设置在散热器的最上面的翅片上; （d）将热管的远端穿过压脚的通孔插入盖中，同时通过板状模具向外折叠翼片。

公开(公告)号：US08270168B2

公开(公告)日：2012-09-18

申请号：US12779070

申请日：2010-05-13

Applicant: Kuo-Len Lin ,  Mong-Hua Hung ,  Tien-Chih Tseng ,  Chen-Hsiang Lin ,  Chih-Hung Cheng

Inventor： Kuo-Len Lin ,  Mong-Hua Hung ,  Tien-Chih Tseng ,  Chen-Hsiang Lin ,  Chih-Hung Cheng

IPC: H05K7/20

CPC classification number: G06F1/203 ,  G06F1/1632 ,  G06F1/206 ,  Y02D10/16

Abstract: A heat sink having auto switching function, a heat sink system and a heat sinking method are disclosed. The heat sink receives a control command sent by an external device. An internal heat sink device is controlled according to content of the control command to control power ON or power OFF of a thermoelectric cooler of the heat sink device or to control power ON, power OFF, or change rotation speed setting of a heat sink fan in the heat sink device. Thus, the heat sink auto switches operations of the heat sink device correspondingly according to temperature changes of the external device.

Abstract translation: 公开了具有自动切换功能的散热器，散热器系统和散热方法。 散热器接收外部设备发送的控制命令。 根据控制命令的内容控制内部散热装置，以控制散热装置的热电冷却器的电源接通或断电，或者控制散热风扇的电源接通，断电或改变转速设定 散热器设备。 因此，根据外部设备的温度变化，散热器自动切换散热器设备的操作。

公开(公告)号：US08235768B2

公开(公告)日：2012-08-07

申请号：US12482000

申请日：2009-06-10

Applicant: Kuo-Len Lin ,  Chen-Hsiang Lin ,  Jui-Ho Liu ,  Chih-Hung Cheng ,  Ken Hsu

Inventor： Kuo-Len Lin ,  Chen-Hsiang Lin ,  Jui-Ho Liu ,  Chih-Hung Cheng ,  Ken Hsu

IPC: B24B1/00

CPC classification number: F28D15/0275 ,  B24B37/04 ,  B24B37/12 ,  B24B37/30 ,  B24B57/02 ,  F28D15/0233 ,  F28F13/182 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method for making heated plane of a cooler obtain better flatness and roughness includes a grinder with a grinding plate and a fixture. Then, the cooler is arranged onto the fixture. Next, the abrasive is injected into the gap between the grinding plate and the heated plane, making the fixture press and clamp the cooler in a way, such that the heated plane of the cooler contacts the abrasive closely. Finally, the grinding plate is rotated to make at least one grinding process to the heated plane, making the heated plane obtain a surface with better roughness and flatness, further enhancing the contact tightness between the heated plane and a heating element, and therefore promoting the thermally conductive efficiency between the cooler and the heating element.

Abstract translation: 制造冷却器的加热平面的方法获得更好的平整度和粗糙度的方法包括具有研磨板和夹具的研磨机。 然后，将冷却器布置在固定装置上。 接下来，研磨剂被注入到研磨板和加热平面之间的间隙中，使夹具以一定的方式压紧并夹紧冷却器，使得冷却器的加热平面与磨料紧密接触。 最后，研磨板旋转，对被加热面进行至少一次研磨处理，使得加热面得到更好的粗糙度和平坦度的表面，进一步增强了加热面与加热元件之间的接触紧密度，从而促进了 冷却器和加热元件之间的导热效率。

公开(公告)号：US20120153392A1

公开(公告)日：2012-06-21

申请号：US13053691

申请日：2011-03-22

Applicant: Chih-Hung CHENG ,  Isaac Wing-Tak Chan

Inventor： Chih-Hung CHENG ,  Isaac Wing-Tak Chan

IPC: H01L29/786 ,  H01L21/336 ,  H01L21/20

CPC classification number: H01L27/1288 ,  H01L27/1251 ,  H01L27/14658 ,  H01L27/3244

Abstract: A manufacturing method for a semiconductor structure, and a pixel structure and a manufacturing method for the same are provided. The manufacturing method for the semiconductor structure includes following steps. A substrate is provided. A first conductive layer is formed and patterned by using a first mask patterned. A first material film, including a first semiconductor layer, is formed and patterned by using a second mask. A second conductive layer is formed and patterned by using a third mask. A second material film, including a first dielectric layer, a second semiconductor layer and a second dielectric layer, is formed and patterned with using a fourth mask. The second dielectric layer is pattern by using a fifth mask. A third material film, including a third conductive layer, is formed and patterned by using a sixth mask.

Abstract translation: 提供了半导体结构的制造方法以及像素结构及其制造方法。 半导体结构的制造方法包括以下步骤。 提供基板。 通过使用图案化的第一掩模来形成和图案化第一导电层。 通过使用第二掩模形成包括第一半导体层的第一材料膜并构图。 通过使用第三掩模形成并图案化第二导电层。 使用第四掩模形成并图案化包括第一介电层，第二半导体层和第二介电层的第二材料膜。 第二介电层通过使用第五掩模进行图案化。 通过使用第六掩模，形成并图案化包括第三导电层的第三材料膜。

公开(公告)号：US20110309734A1

公开(公告)日：2011-12-22

申请号：US12820453

申请日：2010-06-22

Applicant: Kuo-Len LIN ,  Chen-Hsiang LIN ,  Chih-Hung CHENG

Inventor： Kuo-Len LIN ,  Chen-Hsiang LIN ,  Chih-Hung CHENG

IPC: H01J61/52 ,  F28D15/04

CPC classification number: F21V29/51 ,  F21K9/23 ,  F21K9/233 ,  F21V29/004 ,  F21V29/773 ,  F21V29/78 ,  F21Y2115/10 ,  F28D15/0275

Abstract: The present invention relates to a LED lamp and a heat sink thereof having a wound heat pipe. The LED lamp includes the heat sink, a LED module and a lamp base electrically connected to the LED module. The heat sink includes a heat-conducting base, a heat-dissipating fin set and a wound heat pipe. The heat-dissipating fin set includes a plurality of heat-dissipating fins arranged at the outer periphery of the heat-conducting base. The heat-dissipating fins form an accommodating space. The wound heat pipe includes an evaporating section brought into thermal contact with the heat-conducting base and a condensing section brought into thermal contact with the heat-dissipating fins. The LED module abuts against the heat-conducting base and the evaporating section. By this structure, the heat-conducting path is shortened, the heat-conducting speed is accelerated, and the heat is rapidly and uniformly distributed to the heat-dissipating fins to improve the heat-dissipating efficiency.

Abstract translation: 本发明涉及具有卷绕热管的LED灯及其散热器。 LED灯包括散热器，LED模块和与LED模块电连接的灯座。 散热器包括导热基座，散热翅片组和绕线热管。 散热片组包括布置在导热基底的外周的多个散热片。 散热片形成容纳空间。 卷绕的热管包括与导热基体热接触的蒸发部和与散热翅片热接触的冷凝部。 LED模块抵靠导热基座和蒸发部分。 通过这种结构，导热路径缩短，导热速度加快，热量迅速均匀地分布到散热翅片，提高了散热效率。