公开(公告)号：US20220217872A1

公开(公告)日：2022-07-07

申请号：US17142690

申请日：2021-01-06

Applicant: Nvidia Corporation

Inventor： Ali Heydari

IPC: H05K7/20 ,  H05K7/14

Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a first flow controller within a cooling manifold is associated with a second flow controller and with a tube there between; and the first flow controller is movable in at least one direction relative to dimensions of the cooling manifold so that it can be positioned for mating with a server tray or box and so that the second flow controller can be mated with a rack manifold.

公开(公告)号：US20220142006A1

公开(公告)日：2022-05-05

申请号：US17083597

申请日：2020-10-29

Applicant: Nvidia Corporation

Inventor： Ali Heydari

IPC: H05K7/20

Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, an integrated power and coolant distribution unit (PCDU) is provided to determine a change in a power state or a coolant state of at least one server and to enable a coolant response from an overhead cooling unit (OCU) to dissipate heat from secondary coolant of a secondary cooling loop.

公开(公告)号：US20220117119A1

公开(公告)日：2022-04-14

申请号：US17066293

申请日：2020-10-08

Applicant: Nvidia Corporation

Inventor： Ali Heydari

IPC: H05K7/20 ,  A61L2/10

Abstract: Systems and methods for cooling a computer environment are disclosed. In at least one embodiment, a cooling assembly can be used to monitor and control fluid quality associated with one or more servers.

公开(公告)号：US20220087054A1

公开(公告)日：2022-03-17

申请号：US17020145

申请日：2020-09-14

Applicant: Nvidia Corporation

Inventor： Ali Heydari

IPC: H05K7/20

Abstract: Systems and methods for cooling a data center are disclosed. In at least one embodiment, a radiator is associated with one or more racks of a datacenter and has a first portion to function as an air-to-liquid heat exchanger having a primary cooling loop to absorb first heat away from the one or more racks and has a second portion to function as a liquid-to-liquid heat exchanger to enable at least one secondary cooling loop to exchange second heat with the primary cooling loop.

公开(公告)号：US11212943B2

公开(公告)日：2021-12-28

申请号：US16798214

申请日：2020-02-21

Applicant: Nvidia Corporation

Inventor： Ali Heydari

IPC: H05K7/20 ,  H05K7/14

Abstract: A datacenter cooling system is disclosed. The system includes a first cooling loop with a heat exchanger to exchange heat with a second cooling loop. The second cooling loop includes a cooling distribution unit (CDU) to exchange heat between the second cooling loop and a primary cooling loop.

公开(公告)号：US12245405B2

公开(公告)日：2025-03-04

申请号：US18325915

申请日：2023-05-30

Applicant: NVIDIA Corporation

Inventor： Harold Miyamura ,  Jeremy Rodriguez ,  Ali Heydari

IPC: H05K7/20 ,  F16M13/02 ,  H05K7/14

Abstract: A system comprising an adapter plate to couple a plurality of different types of cooling manifolds to one or more racks in a datacenter is disclosed. Additionally, a system comprising an adapter plate to adaptively couple a cooling manifold to a plurality of different types of server racks is disclosed.

公开(公告)号：US12156384B2

公开(公告)日：2024-11-26

申请号：US17314184

申请日：2021-05-07

Applicant: Nvidia Corporation

Inventor： Ali Heydari

IPC: H05K7/20 ,  G06F1/20

Abstract: Systems and methods for evaluating cooling characteristics are disclosed. In at least one embodiment, a thermal testing rig for a data center can include one or more pluggable heat-generating elements to direct a heat flux in an upward direction towards one or more thermal distribution elements.

公开(公告)号：US12127381B2

公开(公告)日：2024-10-22

申请号：US17688319

申请日：2022-03-07

Applicant: Nvidia Corporation

Inventor： Ali Heydari

IPC: H05K7/20

CPC classification number: H05K7/20836 ,  H05K7/20327 ,  H05K7/20509 ,  H05K7/20827

Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, one or more outlet reservoirs are associated with a stabilizing subsystem and a rack so that one or more outlet reservoirs can receive two-phase fluid that is outlet from a plurality of cold plates of a rack and so that a stabilizing subsystem can stabilize a quality factor of a two-phase fluid to a predetermined quality factor before heat is removed from a two-phase fluid and it is cycled to such cold plates.

公开(公告)号：US12069836B2

公开(公告)日：2024-08-20

申请号：US17224890

申请日：2021-04-07

Applicant: Nvidia Corporation

Inventor： Ali Heydari

IPC: H05K7/20 ,  G05B15/02

CPC classification number: H05K7/20381 ,  G05B15/02 ,  H05K7/20309 ,  H05K7/20336 ,  H05K7/20818

Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a cold plate is coupled to a condenser section of a heat pipe and to a primary computing device, with the heat pipe coupled to an auxiliary computing device at an evaporator section of the heat pipe, so that the cold plate draws heat from the primary computing device and from the heat pipe.

公开(公告)号：US20240260238A1

公开(公告)日：2024-08-01

申请号：US18623945

申请日：2024-04-01

Applicant: Nvidia Corporation

Inventor： Ali Heydari

IPC: H05K7/20

CPC classification number: H05K7/20836 ,  H05K7/20254 ,  H05K7/20781

Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a modular unit is swappable or hot-swappable and has a heat exchanger, a variable speed fan, and at least one flow controller to pass fluid through microchannels of a cold plate, so that the fluid extracts heat from at least one computing device and so that fluid through a heat exchanger enables dissipation of heat by forced air from a variable speed fan.