摘要:
A cooling apparatus for a printed circuit board assembly is disclosed. The cooling apparatus comprises a main printed circuit (PC) board 202. The main PC board 202 has a plurality of connectors 210 mounted, in a parallel row, onto the top side of the main PC board 202. A first liquid cooling manifold 204 is positioned along one end of the parallel row of connectors 210 and a second liquid cooling manifold 206 is positioned along the other end of the parallel row of connectors 210. A plurality of heat sink devices 208, each having an elongated shape, run parallel to, and on each side of, the plurality of connectors 210. The plurality of heat sink devices 208 are coupled to the first and second liquid cooling manifolds.
摘要:
A data center is configured using alternating rows of racks containing heat-generating electronic devices and air conditioners. Fluid, such as water or a refrigerant, for the air conditioners is supplied through pluming below a raised floor, such as those commonly found in current data centers. Attached to this plumbing are standard fluid couplings configured to couple to either air conditioners or liquid cooling units. These air conditioners and liquid cooling units use the same fluid so that they may share the plumbing. As data center migrates to liquid-cooled racks, a fraction of the air conditioners are replaced with liquid conditioning units in such a way that the data center contains both air-cooled and liquid-cooled racks without substantial reduction in efficiency of the air-cooling system. Since the air conditioners and liquid conditioning units use the same couplings and the same fluid, no infrastructure change is required.
摘要:
A reporting tool is used to create reports for dimension based ERP (“Enterprise Resource Planning”) systems. The dimensions for the report may be selected manually and/or automatically. The reports are defined using the selected dimensions that are obtained directly from the ERP system without including the fully qualified account information. Additionally, dimension hierarchies may be imported directly from the ERP system.
摘要:
A cell configuration for a multi-processor system comprises: a first circuit board comprising: a single processor; a single processor agent coupled electrically to the single processor; and a plurality of memory modules coupled electrically to the single processor agent; a second circuit board comprising: a single processor; a single processor agent coupled electrically to the single processor; and a plurality of memory modules coupled electrically to the single processor agent; and wherein the first and second circuit boards are inter-connected in such a manner to form an electrical connection between the single processor of the first circuit board and the single processor agent of the second circuit board and an electrical connection between the single processor of the second circuit board and the single processor agent of the first circuit board.
摘要:
A fused power cable assembly and method of integrating a protective device with a power source connector retaining bracket. A bracket assembly having a bulkhead retaining element, a protective device element, and a retaining element operable to couple the protective device to the bracket allows for mounting of protective device(s) to the bracket instead of the bulkhead, thereby saving space. A power cabling assembly having a bracket assembly, a power connector, and a fastening element operable to couple the power connector to the bulkhead and the bulkhead to the bracket assembly, allowing assembly of the power cabling assembly prior to installation into target equipment.
摘要:
A system comprises an electronic module slidably mounted in the system, a first assembly including at least one wireless transceiver mounted in the system, and a second assembly including at least one wireless transceiver to communicate wirelessly with the wireless transceiver of the first assembly. The second assembly is attached to the electronic module, and the wireless transceivers of the first and second assemblies continue communicating as the electronic module is slidably moved in the system.
摘要:
In one embodiment, an airflow regulation device comprises a at least one base member configured to couple to a connector on a circuit board, a first segment connected to the at least one base member and extending a first height from the at least one base member, and a second segment removably connected to the first segment and extending a second height from the at least one base member, wherein the second height is different than the first height.
摘要:
A multi-processor system architecture comprises: a cabinet; a plurality of processor cell modules disposed within the cabinet; a plurality of link router modules disposed within the cabinet; and a plurality of cables connecting the plurality of processor cell modules through the plurality of link router modules.
摘要:
A flexible wirelike retainer clip is adapted to hold a plurality of disc-like rings in a stacked assembly. The retainer clip is resilient and can be selectively actuated to hold the rings in a stacked position to facilitate handling for various purposes such as processing the rings while stacked, shipping the rings while stacked and to facilitate release of the rings for assembly to other components. The resilience of the retainer clip facilitates accommodating stacks of rings within a range of varying lengths.
摘要:
A heat sink is constructed including at least one thermally conductive pedestal, allowing configuration of the heat sink to make contact with a plurality of heat-generating electronic devices where the devices may not be co-planar due to tolerance stack-up. The pedestals may be raised and lowered and tilted as needed to match the heights and tilts of the electronic devices. Within the heat sink is a cavity above the pedestal that may be filled with a thermally conductive material, such as solder, or a thermally conductive liquid, during construction to create a low thermal resistance contact between the pedestal and the heat sink fins. Also, thermally conductive material, such as thermal paste or a thermal pad, may be used between the heat generating device and the pedestal to create a low thermal resistance contact.