公开(公告)号：US11341904B2

公开(公告)日：2022-05-24

申请号：US17138772

申请日：2020-12-30

Applicant: Novatek Microelectronics Corp.

Inventor： Che-Wei Yeh ,  Keko-Chun Liang ,  Yu-Hsiang Wang ,  Yong-Ren Fang ,  Yi-Chuan Liu

IPC: G09G3/32

Abstract: A LED driving apparatus with clock embedded cascaded LED drivers is introduced, including: a plurality of LED drivers, wherein the first stage LED driver receives an original data signal and outputs a first data signal, the Nth stage LED driver receives a (N−1)th data signal and outputs a Nth data signal. The Nth stage LED driver includes a clock data recovery circuit generating a recovery clock signal and a recovery data signal according to the (N−1)th data signal; and a first transmitter outputting the Nth data signal according to the recovery clock signal and the recovery data signal.

公开(公告)号：US11340738B2

公开(公告)日：2022-05-24

申请号：US16996197

申请日：2020-08-18

Applicant: NOVATEK MICROELECTRONICS CORP.

Inventor： Chun-Yi Chou

IPC: G06F3/044 ,  G06F3/041 ,  G06V40/13

Abstract: A method for force sensing using information from a display panel with a touch sensor and a fingerprint sensor is introduced. The method includes: obtaining, based on touch sensing data from a touch sensing circuit coupled to the touch sensor, first sensing information indicating capacitance value distribution over a touch sensing area due to pressing of an object on the display panel; obtaining, based on fingerprint sensing data from a fingerprint sensing circuit coupled to the fingerprint sensor, second sensing information indicating an effective pressing area due to the pressing of the object; and generating third sensing information indicating a force corresponding to the pressing of the object, based on the first sensing information and the second sensing information. An electronic module capable of facilitating force sensing and computing apparatus capable of force sensing are also provided.

公开(公告)号：US20220159226A1

公开(公告)日：2022-05-19

申请号：US17179440

申请日：2021-02-19

Applicant: NOVATEK MICROELECTRONICS CORP.

Inventor： HUNG-MING WANG ,  YUAN-PO CHENG

IPC: H04N9/76 ,  H04N19/44 ,  H04N9/64

Abstract: A device and method for blending image data and the alpha channel and reconstructing to obtain the image again after transmission. An encoder blends the alpha channel and the red-green-blue (RGB) image data through a layer blending method that is supported by the general application processor (AP). Transporter image data, such as a checkerboard pattern, is blended with 1-alpha channel data to obtain a transporter. The blended image data (RGB+alpha) is mixed with the transporter to obtain mixed image data. The mixed image data is then transmitted through the existing transmission interface. After receiving the mixed image data, reconstruction processing is performed by a decoder to obtain the original RGB image data and the alpha channel again.

公开(公告)号：US20220149006A1

公开(公告)日：2022-05-12

申请号：US17152806

申请日：2021-01-20

Applicant: NOVATEK Microelectronics Corp.

Inventor： Chien-Chen KO ,  Teng-Jui YU ,  Wei-Kang TSAI

IPC: H01L25/065 ,  H01L23/544 ,  H01L23/528

Abstract: A package structure includes a first chip and a second chip. The first chip is connected to a pair of first signal lines and a plurality of first power lines. The second chip is connected to a pair of second signal lines and a plurality of second power lines. The first chip and the second chip belong to a common wafer. A separated street is between the first chip and the second chip.

公开(公告)号：US11322427B2

公开(公告)日：2022-05-03

申请号：US16508333

申请日：2019-07-11

Applicant: Novatek Microelectronics Corp.

Inventor： Hsien-Wen Lo ,  Wen-Ching Huang

IPC: H01L23/48 ,  H01L23/00 ,  H01L27/12

Abstract: A chip on film package including a chip and a flexible film. The chip includes bumps disposed on the chip and is mounted on the flexible film. The flexible film includes first vias, second vias, upper leads and lower leads. The first vias and the second vias penetrate the flexible film and are arranged on two opposite sides of a reference line respectively. A distance between one of the first vias and one of the second vias, which are closer to a first side of the chip, is longer than that between another one of the first vias and another one of the second, which are further from the first side. The upper leads are disposed on the upper surface connected between the vias and the bumps. The lower leads are disposed on the lower surface and connected to the vias.

公开(公告)号：US20220122552A1

公开(公告)日：2022-04-21

申请号：US17467443

申请日：2021-09-06

Applicant: NOVATEK Microelectronics Corp.

Inventor： Chun-Fu Lin ,  Hsing-Kuo Chao ,  Jhih-Siou Cheng ,  Ju-Lin Huang ,  Wen-Hsin Cheng

IPC: G09G3/34 ,  G02F1/1335 ,  G02F1/13357

Abstract: An LED backlight driver includes at least one driving chip configured to drive a backlight module. The at least one driving chip is disposed on at least one chip-on-film package, and not in direct contact with the backlight module to reduce heat transfer to the backlight module.

公开(公告)号：US20220122521A1

公开(公告)日：2022-04-21

申请号：US17074639

申请日：2020-10-20

Applicant: Novatek Microelectronics Corp.

Inventor： Yi-Yang Tsai ,  Chun-Fu Lin ,  Po-Hsiang Fang ,  Jhih-Siou Cheng

IPC: G09G3/32 ,  H05B45/325

Abstract: A driving device and a driving method of a display panel are provided. The driving device includes a current source and a control circuit. The current source makes a driving current flow through a light-emitting element path of a sub-pixel circuit of the display panel. During a display line period, the driving current has a normal current amount, and the control circuit controls a first switch in the light-emitting element path to adjust a duty cycle of the driving current in the light-emitting element path. During a sensing period, the driving current has a sensing current amount less than the normal current amount, the control circuit turns on the first switch, and the control circuit checks a voltage in the light-emitting element path to determine whether a light-emitting element in the light-emitting element path is open (or whether the light-emitting element is provided in the light-emitting element path).

公开(公告)号：US11302279B2

公开(公告)日：2022-04-12

申请号：US16788239

申请日：2020-02-11

Applicant: NOVATEK Microelectronics Corp.

Inventor： Shun-Hsun Yang ,  Tse-Hung Wu

IPC: G09G5/00 ,  H03K19/0185 ,  G06F3/14 ,  H04L25/02 ,  G09G5/12 ,  H04L25/14 ,  G09G5/18

Abstract: A method of handling signal transmission applicable to a display system includes a plurality of steps. The steps include transmitting a reset signal embedded in a first data signal to each of at least one source driver via a first data channel, generating a first control signal for setting the at least one source driver, and transmitting the first control signal embedded in a second data signal to each of the at least one source driver via a second data channel when the reset signal is transmitted via the first data channel.

公开(公告)号：US11301708B2

公开(公告)日：2022-04-12

申请号：US17015085

申请日：2020-09-09

Applicant: NOVATEK Microelectronics Corp.

Inventor： Jung-Chen Chung ,  Jen-Yi Lin ,  Min Huang

IPC: G06K9/20 ,  G06K9/00 ,  H04N5/378

Abstract: An image sensing circuit includes a plurality of readout circuits and a pre-charge control circuit. Each of the readout circuits is coupled to a sensing line among a plurality of sensing lines and configured to receive a sensing voltage among a plurality of sensing voltages through the corresponding sensing line, wherein at least one of the readout circuits is further configured to receive at least one first pre-scan voltage through the corresponding sensing line prior to reception of the sensing voltage. The pre-charge control circuit, coupled to the readout circuits, is configured to perform a plurality of steps. The steps include receiving the at least one first pre-scan voltage from the at least one readout circuit; calculating a first pre-charge voltage according to the at least one first pre-scan voltage; and pre-charging the sensing lines to the first pre-charge voltage before the readout circuits receive the sensing voltages.

公开(公告)号：US11301665B2

公开(公告)日：2022-04-12

申请号：US16531126

申请日：2019-08-05

Applicant: Novatek Microelectronics Corp.

Inventor： Jung-Chen Chung ,  Chi-Ting Chen

IPC: G06K9/00 ,  G06F21/32

Abstract: A fingerprint and proximity sensing apparatus for fingerprint recognizing and proximity sensing is provided. The fingerprint and proximity sensing apparatus includes a display panel, a fingerprint sensor, and at least one proximity sensing light emitting diode. The fingerprint sensor has an optical sensing array. The optical sensing array is configured to receive a first light emitted from the display panel and a second light emitted from the at least one proximity sensing light emitting diode at different time periods. The first light and the second light have different ranges of wave length. A sensing process is also provided.