摘要:
An apparatus for switching microwave signals includes a plurality of input lines, a plurality of output lines; and a plurality of thyristors. Each thyristor has a lower conducting surface that is electrically connected to one of the input lines and an upper conducting surface that is electrically connected to one of the output lines. A selected thyristor transmits a microwave signal between a selected input line and a selected output line in an ON state and blocks the microwave signal between the selected input line and the selected output line in an OFF state.
摘要:
A high frequency switch, has a transmitting terminal; a receiving terminal; an antenna terminal; a first diode having an anode electrically connected to the transmitting terminal and a cathode electrically connected to the antenna terminal; a second diode having an anode connected through a transmission line of ¼ wavelength to the antenna terminal which is electrically connected to the receiving terminal, and having the side of a cathode grounded; and a control terminal provided to a node between the transmitting terminal and the first anode, wherein the first and second diodes have a tradeoff relationship between ON resistance thereof and capacitance between the anode and the cathode, and the ON resistance of the first diode is lower than the ON resistance of the second diode, and the capacitance of the second diode in the OFF state is smaller than the capacitance of the first diode in the OFF state.
摘要:
A novel RF switch circuit and method for switching RF signals is described. The RF switch circuit is fabricated in a silicon-on-insulator (SOI) technology. The RF switch includes pairs of switching and shunting transistor groupings used to alternatively couple RF input signals to a common RF node. The switching and shunting transistor grouping pairs are controlled by a switching control voltage (SW) and its inverse (SW_). The switching and shunting transistor groupings comprise one or more MOSFET transistors connected together in a nullstackednull or serial configuration. The stacking of transistor grouping devices, and associated gate resistors, increase the breakdown voltage across the series connected switch transistors and operate to improve RF switch compression. A fully integrated RF switch is described including digital control logic and a negative voltage generator integrated together with the RF switch elements. In one embodiment, the fully integrated RF switch includes a built-in oscillator, a charge pump circuit, CMOS logic circuitry, level-shifting and voltage divider circuits, and an RF buffer circuit. Several embodiments of the charge pump, level shifting, voltage divider, and RF buffer circuits are described. The inventive RF switch provides improvements in insertion loss, switch isolation, and switch compression.
摘要:
A method and apparatus are disclosed for reducing crosstalk and dispersion in a crosspoint monolithic microwave integrated circuit (MMIC) switch array operating in a range between DC and microwave frequencies. In accordance with an exemplary embodiment, the crosspoint MMIC switch array includes a dielectric stack, a substrate, a first ground plane, a plurality of thyristor switches, a plurality of signal transmission lines arranged in rows; and a plurality of signal transmission lines arranged in columns. The plurality of signal transmission lines arranged in columns intersect the plurality of signal transmission lines arranged in rows at a plurality of intersection points. Each of the plurality of thyristor switches is associated with one of the plurality of intersection points. Each of the plurality of thyristor switches is in electrical contact with the signal transmission lines that intersect at the associated intersection point.
摘要:
A high-frequency switch includes: a high-frequency circuit board including an MIC substrate, a microstrip line disposed on a front surface of the MIC substrate, and a signal wiring layer and a front surface grounding conductor disposed along the microstrip line; bumps disposed on the microstrip line, the signal wiring layer, and the front surface grounding conductor; and a semiconductor chip disposed on the high-frequency circuit board through the bumps. A gate electrode of a transistor of the semiconductor chip is connected to the signal wiring layer of the high-frequency circuit board through at least one of the bumps; a source electrode is connected to the front surface grounding conductor through at least one of the bumps; and a drain electrode is connected to the microstrip line through at least one of the bumps.
摘要:
A high frequency circuit board comprising: a choke coil circuit element of a high frequency switching circuit; a dielectric laminated structure body comprising a plurality of dielectric layers which comprise a first dielectric layer and a second dielectric layer; a land formed on the first dielectric layer; and a circuit pattern formed on the second dielectric layer, wherein the choke coil circuit element is mounted on the land as a chip inductor, the first dielectric layer is located at the end of the body, the second dielectric layer is located nearest to the first board in at least one of the dielectric layers on which a circuit pattern is formed, and the land is positioned out of a region formed by projecting the circuit pattern formed on the second dielectric layer in the direction of laminating of the plurality of dielectric layers.
摘要:
An R.F. antenna switch (102) for coupling either a high-loss port (112) or a low-loss port (114) to a common port (110) includes an unequal power splitter (104) with the high-loss port (112), the low-loss port (114), and the common port (110). The unequal power splitter (104) further has at least one high-loss path (120) coupled between the common port (110) and the high-loss port (112) and a low-loss path (122) coupled between the common port (110) and the low-loss port (114). The R.F. antenna switch (102) further comprises a switching element (106) having an input (106A) coupled to the low-loss port (114) and an output (106B) coupled to a terminating element (108). The low-loss port (114) is terminated with the characteristic impedance of the unequal power splitter (104) when the switching element (106) is switched on.
摘要:
A high-frequency module includes first to fifth terminals, a high-pass filter, a high-frequency switch, a transmitter-side balun, and a receiver-side balun. The high-pass filter is connected to the high-frequency switch, and the high-frequency switch is also connected to the transmitter-side balun and to the receiver-side balun. The first terminal is connected to an antenna, the second and third terminals are connected to a transmitter circuit, and the fourth and fifth terminals are connected to a receiver circuit.
摘要:
An antenna switch includes at least one signal path, including an amplifier device and a switch. The amplifier device includes an amplifier connected to a first inductor and to a first capacitor, which is grounded. The amplifier is voltage supplied via a second inductor. The switch includes a receiving isolation device, which is connected to a bypass capacitor connected to an antenna via a low pass filter. A first microstrip is connected to the bypass capacitor and to a DC switch. The first inductor and the first capacitor together with a shorted output transistor of the amplifier form a high impedance in receiving mode, thereby not affecting the receiving signal. The receiving isolation device is a signal wire.
摘要:
An antenna switch circuit which suppresses production of a cross modulation distortion includes an input terminal and an output terminal, a field effect transistor connected at a first one of a source electrode and a drain electrode thereof to the input terminal and connected at a second one of the source electrode and the drain electrode to the output terminal, a first controlling power supply to which the drain electrode and the source electrode of the field effect transistor are connected through first and second biasing elements, respectively, a second controlling power supply to which a gate electrode of the field effect transistor is connected through a third biasing element, and a phase shifting element and a feedback resistor connected in series between the second electrode and the gate electrode of the field effect transistor. The field effect transistor is controlled between on and off by varying a voltage of at least one of the first and second controlling power supplies.