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154 条记录 (耗时 0.011 秒)

    Multi-layer backpanel including metal plate ground and voltage planes
    91.
    发明授权
    Multi-layer backpanel including metal plate ground and voltage planes 失效
    多层背板包括金属板接地和电压平面

    公开(公告)号：US4054939A

    公开(公告)日：1977-10-18

    申请号：US584264

    申请日：1975-06-06

    申请人： J. Preston Ammon

    发明人： J. Preston Ammon

    IPC分类号： H02B1/20 ,  H05K3/30 ,  H05K3/46 ,  H05K7/08 ,  H02B1/02

    CPC分类号： H05K3/4641 ,  H01R12/523 ,  H02B1/207 ,  H05K7/08 ,  H01R12/585 ,  H05K2201/044 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/09718 ,  H05K2201/09845 ,  H05K2201/10189 ,  H05K2201/1059 ,  H05K3/308 ,  H05K3/4611

    摘要： A metal voltage plate is drilled or punched first with alignment holes, placed upon a jig and drilled with contact clearance holes in preselected locations. A metal ground plate is also drilled or punched first with alignment holes, placed upon a jig and drilled with contact clearance holes in preselected locations. The clearance holes are preferably in the range of 80-90 mils in diameter and located in positions where contacts are to pass through a plate without making electrical connection therewith. Next, both the voltage and ground plates are coated, including the inner walls of the clearance holes, with a relatively thick layer of an insulative dielectric material, such as teflon, polyurethane, p.v.c., or the like. The coated voltage plate is then drilled or punched with an array of smaller connecting holes, on the order of 40 mils in diameter, through which contacts to be electrically connected with voltage will be pressed. Since the connecting holes are made after the plate has been coated with a dielectric, the insides of the connecting holes will comprise bare metal and, hence, make good electrical connection with a contact portion press fitted therein. The coated ground plate is similarly drilled or punched with an array of smaller connecting holes, also on the order of 40 mils in diameter, through which contacts to be electrically connected with ground potential will be pressed. Each connecting hole in the ground plate is in a different location, with respect to the alignment holes, than each connecting hole in the voltage plate.A pair of double-sided, glass-filled, epoxy resin printed circuit boards, with alignment holes corresponding to those in the metal plates, are placed one above and one below the pair of adjacent metal plates. The printed circuit boards include plated-through holes in each location where a contact is to be fitted and each corresponds to a connecting hole in either the ground or voltage plate or a clearance hole in either or both. When a contact is press fitted down through the axially aligned holes in the stacked layers, frictional engagement of the contacts with the plated walls of the holes in the top and the bottom printed circuit boards, as well as the connecting holes in the metal plates, mechanically joins the layers into a single unitary structure and electrically interconnects each point which is in interfering engagement with the contact.

    摘要翻译： 首先用对准孔钻出或冲压金属电压板，放置在夹具上，并在预选位置钻出接触间隙孔。 金属接地板也首先用对准孔钻孔或冲孔，放置在夹具上，并在预选位置钻出接触间隙孔。 间隙孔的直径优选在80-90密耳的范围内，并且位于接触件穿过板而不与其电连接的位置。 接下来，电压和接地板均包括间隙孔的内壁，并具有相对较厚的绝缘介电材料层，例如聚四氟乙烯，聚氨酯，直流等。 然后将涂覆的电压板用直径为40密耳的数量级的更小的连接孔阵列冲压或冲压，通过该电极与电压电连接的触点将被按压。 由于连接孔是在板已经被电介质涂覆之后制成的，所以连接孔的内部将包括裸露的金属，因此与装配在其中的接触部分进行良好的电连接。 涂覆的接地板类似地用较小的连接孔钻出或冲孔，其直径也大约为40密耳，通过该接地孔将与地电位电连接的触点将被按压。 接地板中的每个连接孔与电压板中的每个连接孔相对于对准孔处于不同的位置。

    92.
    发明授权
    失效

    公开(公告)号：UST941006I4

    公开(公告)日：1975-12-02

    申请号：US50015774

    申请日：1974-08-23

    IPC分类号： H02B1/20

    CPC分类号： H02B1/207

    Coordinate selector switch with tape indicator and cover
    93.
    发明授权
    Coordinate selector switch with tape indicator and cover 失效
    协调选择开关，带带指示器和盖子

    公开(公告)号：US3582578A

    公开(公告)日：1971-06-01

    申请号：US3582578D

    申请日：1969-02-28

    申请人： AMP INC

    发明人： LOCKARD JOSEPH LARUE

    IPC分类号： H01H1/36 ,  H01H1/40 ,  H01H13/70 ,  H01H15/06 ,  H01H15/16 ,  H02B1/20 ,  H01H15/00

    CPC分类号： H01H13/70 ,  H01H1/403 ,  H01H15/06 ,  H02B1/207

    摘要： An selector switch is disclosed which features conductive strips mounted on interior surfaces of spaced insulating boards. The strips are oriented in crossing relationship and a contact spring is slidably mounted between the boards so as to selectively contact a pair of crossing strips to provide an interconnection. The top board includes slots which define contact spring travel and allow a spring mounting element to extend above the top board for manipulation. A thin plastic grid is mounted over the lower board which serves a dual function by preventing conductive material of the strips thereon from being smeared to create a short between strips and also by providing an indexing action for each contact spring. The spring mounting elements are connected to thin flexible plastic tapes which follow the mounting elements in movement and cover the guide slots to minimize entry of foreign particles. Numerals printed on the tape are displayed through a window in the top board to provide symbolic indication of spring contact position.