-
公开(公告)号:US20230306173A1
公开(公告)日:2023-09-28
申请号:US18327045
申请日:2023-05-31
申请人: Intel Corporation
发明人: Chee Hak Teh , Ankireddy Nalamalpu , MD Altaf Hossain , Dheeraj Subbareddy , Sean R. Atsatt , Lai Guan Tang
IPC分类号: G06F30/34 , H03K19/17736 , H04L12/43 , G06F15/78 , H03K19/17796
CPC分类号: G06F30/34 , H03K19/17744 , H04L12/43 , G06F15/7825 , H03K19/17796
摘要: Systems or methods of the present disclosure may improve scalability (e.g., component scalability, product variation scalability) of integrated circuit systems by disaggregating periphery intellectual property (IP) circuitry into modular periphery IP tiles that can be installed as modules. Such an integrated circuit system may include a first die that includes programmable fabric circuitry and a second die that includes a periphery IP tile. The periphery IP tile may be disaggregated from the programmable fabric die and may be communicatively coupled to the first die via a modular interface.
-
公开(公告)号:US11700002B2
公开(公告)日:2023-07-11
申请号:US17556917
申请日:2021-12-20
申请人: Intel Corporation
发明人: Sharath Raghava , Ankireddy Nalamalpu , Dheeraj Subbareddy , Harsha Gupta , James Ball , Kavitha Prasad , Sean R. Atsatt
IPC分类号: H04L12/28 , H03K19/17736 , H03K19/17796 , H04L41/5019 , H04L41/5003
CPC分类号: H03K19/17736 , H03K19/17796 , H04L41/5019 , H04L41/5003
摘要: Techniques described herein may relate to providing a programmable interconnect network (e.g., a programmable network-on-chip (NOC)). A method may include determining a transmission parameter, bonding one or more channels of an interconnect network based at least in part on the transmission parameter, and power-gating any unused channels after the bonding.
-
公开(公告)号:US20180350689A1
公开(公告)日:2018-12-06
申请号:US16101478
申请日:2018-08-12
申请人: Monolithic 3D Inc.
发明人: Zvi Or-Bach , Deepak C. Sekar , Brian Cronquist
IPC分类号: H01L21/822 , H03K19/177 , H03K19/0948 , H03K17/687 , H01L29/786 , H01L29/78 , H01L27/118 , H01L27/112 , H01L27/11 , H01L27/108 , H01L27/105 , H01L27/092 , H01L27/06 , H01L27/02 , H01L25/18 , H01L25/065 , H01L23/544 , H01L23/525 , H01L23/36 , H01L21/84 , H01L21/8238 , H01L21/762 , H01L21/683 , G11C29/00 , G11C17/14 , G11C17/06 , G11C16/04 , H01L23/48 , H01L23/00
CPC分类号: H01L21/8221 , G11C5/025 , G11C5/063 , G11C16/0483 , G11C29/82 , H01L21/6835 , H01L21/76254 , H01L21/8238 , H01L21/84 , H01L21/845 , H01L23/481 , H01L23/5252 , H01L23/544 , H01L24/16 , H01L24/32 , H01L24/48 , H01L25/0655 , H01L25/0657 , H01L25/18 , H01L27/0688 , H01L27/0694 , H01L27/092 , H01L27/1157 , H01L27/11578 , H01L27/2436 , H01L27/249 , H01L29/785 , H01L29/78696 , H01L45/04 , H01L45/1226 , H01L45/146 , H01L2223/5442 , H01L2223/54426 , H01L2223/54453 , H01L2224/16145 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/45015 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2225/06513 , H01L2225/06517 , H01L2225/06527 , H01L2225/06541 , H01L2225/06589 , H01L2924/00 , H01L2924/00012 , H01L2924/00014 , H01L2924/01019 , H01L2924/01066 , H01L2924/01322 , H01L2924/10253 , H01L2924/12032 , H01L2924/12042 , H01L2924/1305 , H01L2924/13062 , H01L2924/13091 , H01L2924/14 , H01L2924/1433 , H01L2924/1436 , H01L2924/1437 , H01L2924/1461 , H01L2924/15311 , H01L2924/181 , H01L2924/19107 , H01L2924/207 , H01L2924/3011 , H01L2924/3025 , H03K19/0948 , H03K19/17704 , H03K19/17756 , H03K19/17764 , H03K19/17796
摘要: A 3D semiconductor device, the device including: a first single crystal layer including a plurality of first transistors; at least one metal layer interconnecting the first transistors and forming a plurality of logic gates; a first intermediate metal layer overlaying the at least one metal layer; a second intermediate metal layer overlaying the first intermediate metal layer; where the first intermediate metal layer has a first current carrying capacity, where the second intermediate metal layer has a second current carrying capacity, and where the first current carrying capacity is significantly greater than the second current carrying capacity; a plurality of second transistors overlaying the second intermediate metal layer; and a top metal layer overlaying the second transistors; and a memory cell, where at least one of the second transistors includes a polysilicon transistor channel, where the second transistors are precisely aligned to the first transistors.
-
公开(公告)号:US20180247187A1
公开(公告)日:2018-08-30
申请号:US15637543
申请日:2017-06-29
发明人: Eric S. Chung , Douglas C. Burger , Jeremy Fowers
CPC分类号: G06F17/16 , G06F9/265 , G06F9/30036 , G06F9/30141 , G06F9/3836 , G06F9/3867 , G06F9/3885 , G06F9/3891 , G06N3/02 , G06N3/04 , G06N3/0445 , G06N3/0454 , G06N3/0481 , G06N3/063 , G06N3/08 , H03K19/17796
摘要: Processors and methods for neural network processing are provided. A method in a processor including a pipeline having a matrix vector unit (MVU), a first multifunction unit connected to receive an input from the MVU, a second multifunction unit connected to receive an output from the first multifunction unit, and a third multifunction unit connected to receive an output from the second multifunction unit is provided. The method includes decoding instructions including a first type of instruction for processing by only the MVU and a second type of instruction for processing by only one of the multifunction units. The method includes mapping a first instruction for processing by the matrix vector unit or to any one of the first multifunction unit, the second multifunction unit, or the third multifunction unit depending on whether the first instruction is the first type of instruction or the second type of instruction.
-
公开(公告)号:US09940422B2
公开(公告)日:2018-04-10
申请号:US14743099
申请日:2015-06-18
申请人: MediaTek Inc.
发明人: Chin-Hsiung Hsu , Chun-Chih Yang
IPC分类号: G06F17/50 , H03K19/177
CPC分类号: G06F17/5072 , G06F17/50 , G06F17/5054 , G06F17/5077 , G06F17/5081 , G06F2217/08 , G06F2217/78 , H03K19/17728 , H03K19/17736 , H03K19/17756 , H03K19/17796
摘要: A method for reducing congestion regions of an integrated circuit is provided. A placement of the IC is obtained, wherein the placement includes a signal path between a first macro module and a second macro module. The signal path passes through a routing area of the placement for transmitting a specific signal. A congestion region of the routing area is identified. The signal path includes at least one cell or routing path in the congestion region. A cost evaluation is obtained for each candidate position of the routing area by moving the cell or the routing path out of the congestion region. The cell is moved to the candidate position having a minimum cost evaluation among the cost evaluations. The placement and the routing paths are simultaneously updated according to the cell moved to the candidate position having the minimum cost evaluation.
-
公开(公告)号:US20170124241A1
公开(公告)日:2017-05-04
申请号:US15407242
申请日:2017-01-16
IPC分类号: G06F17/50
CPC分类号: G06F17/5054 , G06F17/5045 , G06F17/5077 , G06F2217/06 , G11C16/0433 , G11C17/16 , H01L27/1052 , H03K19/17796
摘要: A device having a design conversion from a field programmable gate array (FPGA) to an application specific integrated circuit (ASIC), comprising: a user configurable element in the FPGA replaced by a mask configurable element in the ASIC, wherein the FPGA and the ASIC have identical die size and identical transistor layouts.
-
7.
公开(公告)号:US09300298B2
公开(公告)日:2016-03-29
申请号:US13914720
申请日:2013-06-11
IPC分类号: H03K19/08 , G11C29/08 , H03K19/177
CPC分类号: H03K19/08 , G11C29/08 , H03K19/17752 , H03K19/17796
摘要: A method of configuring a plurality of configurable integrated circuit dies including receiving a configuration data stream at a die stack. The configuration data stream includes configuration memory data for logic devices located on dies in the die stack. At least two of the dies are located on different substrates. The method also includes, performing for each of the dies in the die stack: receiving the configuration memory data for the die, storing the configuration memory data for the die in a configuration memory on the die, determining whether the configuration data stream includes configuration memory data for an additional die in the die stack, and transmitting the configuration data stream to the additional die in the die stack in response to the configuration data stream including configuration memory data for the additional die in the die stack.
摘要翻译: 一种配置多个可配置集成电路管芯的方法,包括在管芯堆叠处接收配置数据流。 配置数据流包括位于管芯堆叠中的管芯上的逻辑器件的配置存储器数据。 至少两个模具位于不同的基板上。 该方法还包括:对芯片堆叠中的每个裸片执行:接收芯片的配置存储器数据,将芯片的配置存储器数据存储在芯片上的配置存储器中,确定配置数据流是否包括配置存储器 用于在管芯堆叠中的附加管芯的数据,以及响应于包括管芯堆叠中的附加管芯的配置存储器数据的配置数据流,将配置数据流传输到管芯堆叠中的附加管芯。
-
公开(公告)号:US09240790B2
公开(公告)日:2016-01-19
申请号:US14458939
申请日:2014-08-13
IPC分类号: H01L23/02 , H03K19/177 , H03K19/173 , H01L21/822 , H01L27/06
CPC分类号: H03K19/17724 , H01L21/8221 , H01L27/0688 , H03K19/1735 , H03K19/177 , H03K19/17736 , H03K19/17748 , H03K19/17796
摘要: A three-dimensional semiconductor device, comprising: a first module layer having a plurality of circuit blocks; and a second module layer positioned substantially above the first module layer, including a plurality of configuration circuits; and a third module layer positioned substantially above the second module layer, including a plurality of circuit blocks; wherein, the configuration circuits in the second module control a portion of the circuit blocks in the first and third module layers.
摘要翻译: 一种三维半导体器件,包括:具有多个电路块的第一模块层; 以及第二模块层,其基本上位于所述第一模块层的上方,包括多个配置电路; 以及第三模块层,其基本上位于所述第二模块层的上方,包括多个电路块; 其中,第二模块中的配置电路控制第一和第三模块层中的电路块的一部分。
-
公开(公告)号:US09112500B2
公开(公告)日:2015-08-18
申请号:US14495000
申请日:2014-09-24
申请人: LSIS CO., LTD.
发明人: Jo Dong Park
IPC分类号: G05B11/01 , H03K19/177
CPC分类号: H03K19/17796 , G05B2219/25045
摘要: A method of outputting a positioning pulse by a programmable logic controller (PLC) is provided. The method includes setting up the desired cycle of a pulse to be output; determining a number of needed clocks based on a number of system clocks and a desired frequency according to the desired cycle; determining a total number of needed clocks based on the number of needed clocks and the desired frequency; determining a clock difference based on the number of system clocks and the total number of needed clocks; determining a first number of setup clocks corresponding to a first output pulse in a certain cycle; determining a second number of setup clocks corresponding to pulses except for the first output pulse; and outputting a pulse based on the first number of setup clocks and the second number of setup clocks.
摘要翻译: 提供了一种通过可编程逻辑控制器(PLC)输出定位脉冲的方法。 该方法包括设置要输出的脉冲的期望周期; 根据期望的周期,基于多个系统时钟和期望的频率来确定需要的时钟的数量; 基于所需时钟的数量和期望的频率确定所需时钟的总数; 基于系统时钟的数量和所需时钟的总数确定时钟差; 确定在一定周期内对应于第一输出脉冲的第一数量的设置时钟; 确定对应于除了第一输出脉冲之外的脉冲的第二数量的设置时钟; 并且基于第一数量的设置时钟和第二数量的设置时钟输出脉冲。
-
公开(公告)号:USRE45110E1
公开(公告)日:2014-09-02
申请号:US13411486
申请日:2012-03-02
IPC分类号: G06F17/50
CPC分类号: G06F17/5054 , G06F17/5045 , G11C16/0433 , G11C17/16 , H01L27/1052 , H03K19/17796
摘要: A smaller mask programmable gate array (MPGA) device derived from a larger field programmable gate array (FPGA), comprising: a layout of transistors and a plurality of interconnect layers substantially identical to a smaller region of the FPGA; and input/output pads matching a subset of the input/output pads of the FPGA; wherein, a design that is mapped to said smaller region of the FPGA device using said subset of input/output pads by a user programmable means can be identically mapped to the MPGA by a hard-wire circuit. Such a gate array further comprises a mask programmable metal-circuit in lieu of a user programmable configuration circuit of the FPGA; and a logic block to input/output pad connection in lieu of a logic block to a register at the boundary of said smaller region to an input/output pad connection of the FPGA.
摘要翻译: 从较大的现场可编程门阵列(FPGA)导出的较小的掩模可编程门阵列(MPGA)器件,包括:晶体管的布局和与FPGA的较小区域基本相同的多个互连层; 以及与FPGA的输入/输出焊盘的子集匹配的输入/输出焊盘; 其中,使用用户可编程装置的所述输入/输出焊盘子集映射到所述FPGA器件的所述较小区域的设计可以通过硬线电路被相同地映射到MPGA。 这种门阵列还包括代替FPGA的用户可编程配置电路的掩模可编程金属电路; 以及逻辑块,以将代替逻辑块的输入/输出焊盘连接输入到所述较小区域的边界处的寄存器到FPGA的输入/输出焊盘连接。
-
-
-
-
-
-
-
-
-