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公开(公告)号：US20220286638A1
公开(公告)日：2022-09-08
申请号：US17684769
申请日：2022-03-02
发明人： Eiji Aizawa , Eiki Aoyama
摘要： A semiconductor device in which a plurality of substrates including a first substrate and a second substrate are stacked, wherein the first substrate includes a pixel unit in which a plurality of pixels are arranged, the second substrate includes a control circuit configured to control the semiconductor device, and the first substrate further includes a detection circuit configured to detect a connection state of a connection portion between the first substrate and the second substrate.
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公开(公告)号：US11438533B2
公开(公告)日：2022-09-06
申请号：US17250693
申请日：2019-08-16
发明人： Kazuya Yonemoto
摘要： The present technology relates to a solid-state imaging device, a method of driving the same, and an electronic apparatus. The solid-state imaging device includes a pixel having a photodiode that performs photoelectric conversion on incident light, and a driving control unit configured to control driving of the pixel. The pixel stores a first charge generated by the photoelectric conversion in the photodiode and stores a second charge generated by the photoelectric conversion in a first capacitor provided in a pixel separation portion. The driving control unit causes a pixel signal due to the second charge stored in the first capacitor to be output and then a pixel signal due to the first charge stored in the photodiode to be output. The present technology may be applied, for example, to a solid-state imaging device or the like that detects both electrons and holes to perform high dynamic range imaging.
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公开(公告)号：US11431935B2
公开(公告)日：2022-08-30
申请号：US17383318
申请日：2021-07-22
发明人： Kunihiko Izuhara , Yuuko Sonoda
摘要： There is provided a solid-state imaging element in which a first substrate in which a pixel circuit including a pixel array unit is formed and a second substrate in which a plurality of signal processing circuits are formed are laminated, and a common reference clock is supplied to the plurality of signal processing circuits that are formed on the second substrate.
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公开(公告)号：US11431927B2
公开(公告)日：2022-08-30
申请号：US16996745
申请日：2020-08-18
IPC分类号： H04N5/357 , H04N5/378 , H04N5/369 , H01L27/146 , H04N5/374 , H04N5/3745
摘要： The present technology relates to an imaging element that can reduce noise. The imaging element includes: a photoelectric conversion element; a first amplification element that amplifies a signal from the photoelectric conversion element; a second amplification element that amplifies an output from the first amplification element; an offset element provided between the first amplification element and the second amplification element; a first reset element that resets the first amplification element; and a second reset element that resets the second amplification element. The offset element is a capacitor. A charge is accumulated in the offset element via a feedback loop of an output from the second amplification element, and an offset bias is generated. The present technology can be applied to an imaging element.
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公开(公告)号：US11431926B2
公开(公告)日：2022-08-30
申请号：US16185139
申请日：2018-11-09
IPC分类号： H04N5/355 , H01L27/146 , H04N5/3745 , H04N5/225 , H04N5/235 , H04N5/359 , H04N5/372 , H04N5/376 , H04N5/369
摘要： A high dynamic range imaging pixel may include a photodiode that generates charge in response to incident light. When the generated charge exceeds a first charge level, the charge may overflow through a first transistor to a first storage capacitor. When the generated charge exceeds a second charge level that is higher than the first charge level, the charge may overflow through a second transistor. The charge that overflows through the second transistor may alternately be coupled to a voltage supply and drained or transferred to a second storage capacitor for subsequent readout. Diverting more overflow charge to the voltage supply may increase the dynamic range of the pixel. The amount of charge diverted to the voltage supply may therefore be updated to control the dynamic range of the imaging pixel.
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公开(公告)号：US11431911B2
公开(公告)日：2022-08-30
申请号：US16754586
申请日：2018-10-19
申请人： SONY CORPORATION
发明人： Mitsuaki Kita , Yoshitaka Miyatani
摘要： The present disclosure relates to an imaging device and a signal processing device capable of expanding an application range of the imaging device. An imaging device includes an imaging element that includes one or more pixel output units that receive incident light from a subject incident without an intervention of an imaging lens or a pinhole and output one detection signal indicating an output pixel value modulated by an incident angle of the incident light, and outputs a detection signal set including one or more detection signals, and a communication unit that transmits imaging data including the detection signal set and position attitude data indicating at least one of a position or an attitude to a communication device by wireless communication. The present disclosure is applicable to, for example, a monitoring system and the like.
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公开(公告)号：US20220272297A1
公开(公告)日：2022-08-25
申请号：US17740682
申请日：2022-05-10
发明人： Tatsuki Nishino
IPC分类号： H04N5/3745 , H04N5/369 , G01S17/931 , G01S17/89 , H01L27/146 , H01L31/107 , H01L31/02
摘要： This technology relates to an imaging apparatus and an imaging system for improving the accuracy of distance measurement performed by use of SPADs.
The imaging apparatus includes a pixel array section having pixel sections arrayed therein. Each pixel section includes: an SPAD (single photon avalanche photodiode); a resistance component configured to be connected serially with the SPAD; an output section configured to output a light reception signal indicating photon incidence on the SPAD; and a pulse generation section configured to output a pulse signal in synchronism with the output of the light reception signal. Each pixel sections further includes at least one of: a switch configured to be connected interposingly between the SPAD and the resistance component and turned off in synchronism with the pulse signal; or a pull-in section configured to pull in an input current flowing through the SPAD via the resistance component in synchronism with the pulse signal, thereby suppressing the input current flowing through the SPAD. This technology may be applied to cameras that capture range images, for example.-
98.发明申请公开(公告)号：US20220272270A1
公开(公告)日：2022-08-25
申请号：US17743255
申请日：2022-05-12
发明人： Kyohei YOSHIMURA , Toshifumi WAKANO , Yusuke OTAKE
摘要： The present disclosure relates to an image pickup device that enables inhibition of occurrence of color mixture or noise, and an electronic apparatus. The image pickup device of the present disclosure includes an image plane phase difference detection pixel for obtaining a phase difference signal for image plane phase difference AF. The image plane phase difference detection pixel includes: a first photoelectric conversion section that generates an electric charge in response to incident light; an upper electrode section that is one of electrodes disposed facing each other across the first photoelectric conversion section, the upper electrode section being formed on an incident side of the incident light on the first photoelectric conversion section; and a lower electrode section that is another of the electrodes disposed facing each other across the first photoelectric conversion section, the lower electrode section being formed on an opposite side of the incident side of the incident light on the first photoelectric conversion section, the lower electrode section being multiple-divided at a position that avoids a center of the incident light. The present disclosure is applicable to image sensors.
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公开(公告)号：US11425365B2
公开(公告)日：2022-08-23
申请号：US16703144
申请日：2019-12-04
发明人： Ryunosuke Ishii , Akira Oseto , Tatsunori Kato , Takanori Watanabe , Nobuaki Kakinuma , Hiroaki Kobayashi , Katsuhito Sakurai
摘要： A photoelectric conversion device comprising: a first substrate that includes a pixel circuit including a photoelectric conversion element; a second substrate having a signal processing circuit that drives the pixel circuit or processes a signal from the pixel circuit; a connection part electrically connecting the first substrate and the second substrate; and an inspection circuit, wherein the inspection circuit is formed in one of the first and second substrates and is connected to a wire supplying a first potential and being provided in the one of the first and second substrates, and the inspection circuit is connected via the connection part to a wire supplying a second potential and being provided in the other of the first and second substrates.
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公开(公告)号：US11425323B2
公开(公告)日：2022-08-23
申请号：US17402179
申请日：2021-08-13
发明人： Mooyoung Kim , Seonghyeon Park
IPC分类号： H04N5/369 , H04N5/3745 , H04N5/376 , H04N5/341 , H04N5/378
摘要： An image sensor includes a pixel array including a plurality of pixels arranged in a matrix, each of the pixels including a microlens, a first photoelectric conversion element, and a second photoelectric conversion element, the first and second photoelectric conversion elements being arranged parallel with each other in a first direction below the microlens; and a row decoder configured to control a first image signal generated by the first photoelectric conversion element and a sum image signal generated by the first and second photoelectric conversion elements to be sequentially output from a first pixel in a first row of the pixel array during a first readout period, and to control a second image signal generated by the second photoelectric conversion element and the sum image signal to be sequentially output from a second pixel in a second row of the pixel array during a second readout period.
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