BACKLIGHT SUBSTRATE, MANUFACTURING METHOD THEREOF AND DISPLAY DEVICE

    公开(公告)号:US20230093943A1

    公开(公告)日:2023-03-30

    申请号:US16966581

    申请日:2019-08-05

    Abstract: The present disclosure provides a backlight substrate, a manufacturing method thereof, and a display device. The backlight substrate includes: a base substrate; a plurality of first light emitting elements on the base substrate and configured to emit first light; a plurality of second light emitting elements on the base substrate and configured to emit second light having a different wavelength from the first light; a plurality of depth sensors on the base substrate and configured to receive the second light emitted from the plurality of second light emitting elements and reflected by an object and determine depth information of the object based on the received second light; and a diffusion layer in direct contact with light emitting surfaces of the plurality of first light emitting elements and configured to diffuse the first light emitted from the plurality of first light emitting elements.

    LINE RECOGNITION MODULE, FABRICATING METHOD THEREOF AND DISPLAY DEVICE

    公开(公告)号:US20220336510A1

    公开(公告)日:2022-10-20

    申请号:US17417918

    申请日:2020-09-24

    Abstract: The present disclosure provides a line recognition module, a fabricating method thereof and a display device. A better collimating effect may be achieved only by fabricating an optical sensing structure on a substrate in the line recognition module and then directly fabricating at least two light shading layers and a light transmitting layer with relatively simple structures, and the device structure is light and thin, which can reduce the difficulty of processing the device. The problem that the yield is affected due to blistering caused by attaching a collimating structure to the line recognition module with use of an optically clear adhesive (OCA) is avoided. Moreover, since film layers are fabricated directly on the optical sensing structure to form the collimating structure, fabrication of the collimating structure may be accomplished by using a generic device for fabrication of the film layers on an array substrate without adding new fabrication equipment.

    ELECTRONIC DEVICE AND IMAGING METHOD THEREOF

    公开(公告)号:US20220086378A1

    公开(公告)日:2022-03-17

    申请号:US17297663

    申请日:2020-07-24

    Abstract: An electronic device includes a pixel layer, an image display control apparatus, a photosensitive layer, and a processor. The pixel layer includes a plurality of pixel units configured to display an image. The image display control apparatus is configured to control the plurality of pixel units to sequentially display at least one corresponding first image according to at least one first image signal. The photosensitive layer is configured to receive a reflected light formed after an emergent light emitted from the pixel layer when displaying one first image at each time is reflected by an object to be photographed, and to convert the reflected light received at each time into a second image signal. The processor is configured to determine an image of the object to be photographed according to the at least one first image signal and second image signals corresponding to the at least one first image signal.

    ULTRASONIC FINGERPRINT IDENTIFICATION COMPONENT, FINGERPRINT IDENTIFICATION DEVICE AND FINGERPRINT IDENTIFICATION DRIVING METHOD

    公开(公告)号:US20210365655A1

    公开(公告)日:2021-11-25

    申请号:US17054845

    申请日:2019-12-06

    Abstract: There is provided an ultrasonic fingerprint identification component, including an ultrasonic fingerprint identification circuit, which includes a detection circuit and a source follower circuit, and a current supply circuit, where an output terminal of the source follower circuit is coupled to the current supply circuit through a signal reading line; the current supply circuit is configured to provide a constant current to the output terminal of the source follower circuit during an operation of the ultrasonic fingerprint identification circuit; the detection circuit is coupled to a receiving electrode of an ultrasonic sensor and is configured to output a sensing voltage to a sampling node according to an electric signal output by the receiving electrode of the ultrasonic sensor; and the source follower circuit is configured to output a corresponding source follower voltage to the signal reading line according to the sensing voltage under control of the constant current.

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