公开(公告)号：US20230198058A1

公开(公告)日：2023-06-22

申请号：US17556784

申请日：2021-12-20

Applicant: Intel Corporation

Inventor： Veronica Strong ,  Telesphor Kamgaing ,  Neelam Prabhu Gaunkar ,  Georgios Dogiamis ,  Aleksandar Aleksov ,  Brandon Rawlings

IPC: H01M50/117 ,  H01L23/58

CPC classification number: H01M50/117 ,  H01L23/58

Abstract: Embedded batteries within glass cores are disclosed. Example apparatus include a glass core layer having opposing first and second surfaces, the glass core layer including a cavity extending from the first surface toward the second surface, and a battery including a first conductive material positioned in the cavity, a second conductive material positioned in the cavity, and an electrolyte to separate the first conductive material from the second conductive material.

公开(公告)号：US11525970B2

公开(公告)日：2022-12-13

申请号：US17083173

申请日：2020-10-28

Applicant: Intel Corporation

Inventor： Shawna Liff ,  Adel A. Elsherbini ,  Telesphor Kamgaing ,  Sasha N. Oster ,  Gaurav Chawla

IPC: G06F13/14 ,  G02B6/42 ,  H01P5/00 ,  H01Q13/10 ,  H04B1/40 ,  H04B7/00 ,  H04M9/06 ,  G06F13/00

Abstract: Microelectronic package communication is described using radio interfaces connected through wiring. One example includes a system board, an integrated circuit chip, and a package substrate mounted to the system board to carry the integrated circuit chip, the package substrate having conductive connectors to connect the integrated circuit chip to external components. A radio on the package substrate is coupled to the integrated circuit chip to modulate the data onto a carrier and to transmit the modulated data. A radio on the system board receives the transmitted modulated data and demodulates the received data, and a cable interface is coupled to the system board radio to couple the received demodulated data to a cable.

公开(公告)号：US11437693B2

公开(公告)日：2022-09-06

申请号：US16764600

申请日：2017-12-30

Applicant: Intel Corporation

Inventor： Georgios C. Dogiamis ,  Sasha N. Oster ,  Telesphor Kamgaing ,  Kenneth Shoemaker ,  Erich N. Ewy ,  Adel A. Elsherbini ,  Johanna M. Swan

IPC: H01P3/16 ,  H04B3/54

Abstract: Embodiments include a waveguide bundle, a dielectric waveguide, and a vehicle. The waveguide bundle includes dielectric waveguides, where each dielectric waveguide has a dielectric core and a conductive coating around the dielectric core. The waveguide bundle also has a power delivery layer formed around the dielectric waveguides, and an insulating jacket enclosing the waveguide bundle. The waveguide bundle may also include the power deliver layer as a braided shield, where the braided shield provides at least one of a DC and an AC power line. The waveguide bundle may further have one of the dielectric waveguides provide a DC ground over their conductive coatings, where the AC power line does not use the braided shield as reference or ground. The waveguide bundle may include that the power delivery layer is separated from the dielectric waveguides by a braided shield, where the power delivery layer is a power delivery braided foil.

公开(公告)号：US11367708B2

公开(公告)日：2022-06-21

申请号：US16714502

申请日：2019-12-13

Applicant: Intel Corporation

Inventor： Vijay K. Nair ,  Georgios C. Dogiamis ,  Telesphor Kamgaing

IPC: H01L25/065 ,  H01L23/66 ,  H01L25/10 ,  H01L23/538 ,  H01L23/552 ,  H01L23/64 ,  H01L23/00 ,  H01Q1/38

Abstract: Embodiments of the invention include a microelectronic device that includes a transceiver coupled to a first substrate and a second substrate coupled to the first substrate. The second substrate includes an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher. An interposer substrate can provide a spacing between the first and second substrates.

公开(公告)号：US20220173489A1

公开(公告)日：2022-06-02

申请号：US17672876

申请日：2022-02-16

Applicant: Intel Corporation

Inventor： Georgios Dogiamis ,  Adel A. Elsherbini ,  Telesphor Kamgaing ,  Henning Braunisch ,  Johanna M. Swan

IPC: H01P3/16 ,  H01L23/66 ,  H01P11/00

Abstract: Disclosed herein are various designs for dielectric waveguides, as well as methods of manufacturing such waveguides. One type of dielectric waveguides described herein includes waveguides with one or more cavities in the dielectric waveguide material. Another type of dielectric waveguides described herein includes waveguides with a conductive ridge in the dielectric waveguide material. Dielectric waveguides described herein may be dispersion reduced dielectric waveguides, compared to conventional dielectric waveguides, and may be designed to adjust the difference in the group delay between the lower frequencies and the higher frequencies of a chosen bandwidth.

公开(公告)号：US11335651B2

公开(公告)日：2022-05-17

申请号：US15773033

申请日：2015-12-22

Applicant: Intel Corporation

Inventor： Telesphor Kamgaing ,  Georgios C. Dogiamis ,  Vijay K. Nair ,  Javier A. Falcon ,  Shawna M. Liff ,  Yoshihiro Tomita

IPC: H01L23/66 ,  H01L23/48 ,  H01L23/538 ,  H01L23/00 ,  H01L23/498 ,  H01L23/552 ,  H01L25/10 ,  H01L25/16

Abstract: Embodiments of the invention include a microelectronic device that includes a first silicon based substrate having compound semiconductor components. The microelectronic device also includes a second substrate coupled to the first substrate. The second substrate includes an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher.

公开(公告)号：US20210408656A1

公开(公告)日：2021-12-30

申请号：US16912027

申请日：2020-06-25

Applicant: Intel Corporation

Inventor： Diego Correas-Serrano ,  Georgios Dogiamis ,  Henning Braunisch ,  Neelam Prabhu Gaunkar ,  Telesphor Kamgaing

IPC: H01P3/16

Abstract: Disclosed herein are components for millimeter-wave communication, as well as related methods and systems.

公开(公告)号：US11206008B2

公开(公告)日：2021-12-21

申请号：US16648115

申请日：2017-12-28

Applicant: Intel Corporation

Inventor： Georgios C. Dogiamis ,  Telesphor Kamgaing ,  Feras Eid ,  Vijay K. Nair ,  Johanna M. Swan

IPC: H03H9/05 ,  H03H9/10 ,  H03H9/13 ,  H03H9/52 ,  H03H9/54

Abstract: Embodiments of the invention include an acoustic wave resonator (AWR) module. In an embodiment, the AWR module may include a first AWR substrate and a second AWR substrate affixed to the first AWR substrate. In an embodiment, the first AWR substrate and the second AWR substrate define a hermetically sealed cavity. A first AWR device may be positioned in the cavity and formed on the first AWR substrate, and a second AWR device may be positioned in the cavity and formed on the second AWR substrate. In an embodiment, a center frequency of the first AWR device is different than a center frequency of the second AWR device. In additional embodiment of the invention, the AWR module may be integrated into a hybrid filter. The hybrid filter may include an AWR module and other RF passive devices embedded in a packaging substrate.

公开(公告)号：US11165129B2

公开(公告)日：2021-11-02

申请号：US16463329

申请日：2016-12-30

Applicant: Intel Corporation

Inventor： Georgios Dogiamis ,  Sasha Oster ,  Telesphor Kamgaing

IPC: H01P3/16 ,  H01P3/12 ,  H01P11/00 ,  H01P5/08

Abstract: Embodiments of the invention include a dispersion reduced dielectric waveguide and methods of forming such devices. In an embodiment, the dispersion reduced dielectric waveguide may include a first dielectric material that has a first Dk-value, and a second dielectric material that has a second Dk-value that is greater than the first Dk-value. In an embodiment, the dispersion reduced dielectric waveguide may also include a conductive layer formed around the first and second dielectric materials. According to an embodiment, a first portion of a bandwidth of a signal that is propagated along the dispersion reduced dielectric waveguide is primarily propagated along the first dielectric material, and a second portion of a bandwidth of the signal that is propagated along the dispersion reduced dielectric waveguide is primarily propagated along the second dielectric material.

公开(公告)号：US11158917B2

公开(公告)日：2021-10-26

申请号：US16577478

申请日：2019-09-20

Applicant: Intel Corporation

Inventor： Aleksandar Aleksov ,  Telesphor Kamgaing ,  Georgios Dogiamis ,  Feras Eid ,  Johanna M. Swan

IPC: H01P1/203 ,  H01P7/06 ,  H01P11/00 ,  H01P1/20 ,  H01P7/10

Abstract: Embodiments may relate to an assembly that includes a first package substrate with a first electromagnetic cavity. The assembly may further include a second package substrate with a second electromagnetic cavity that is adjacent to the first electromagnetic cavity. The first and second electromagnetic cavities may form a millimeter wave (mmWave) resonant cavity of a mmWave filter. Other embodiments may be described or claimed.