摘要:
To reduce a signal variation of a bridge circuit connected with a temperature sensing resistor that is caused by a strain even when the strain is generated at a diaphragm portion of a substrate installed with a heater resistor and the temperature sensing resistor. In a thermal type flow rate resistor including a substrate, a diaphragm 13 formed at the substrate, and a heat generating resistor 2 and temperature detecting resistors 7 through 10 formed on the diaphragm for detecting a flow rate of a measured fluid by heating the heat generating resistor, strain detecting resistors 11 and 12 are formed on an upstream side and on a downstream side of a flow of the measured fluid relative to the heat generating resistor on the diaphragm, an amount of a strain generated on the diaphragm is detected by the strain detecting resistors, and a flow rate signal detected by the heat generating resistor and the temperature detecting resistors is compensated for the strain based on the detected amount of the strain.
摘要:
A measurement element includes a semiconductor substrate with electrical insulating film formed thereon. A resistor formed on the electrical insulating film constitutes a heater; and a cavity is formed by removing a portion of the semiconductor substrate that corresponds to a region where a body part of the resistor is formed. The region where the body part of the resistor is formed is formed into a thin wall part by the cavity, and an opening and a slit is formed in a portion of the thin wall part in such a manner as to penetrate the thin wall part in the thickness direction. The measurement element has a film formed covering the region of the opening or slit.
摘要:
The invention provides a flow sensor structure for sealing the surface of an electric control circuit and a part of a semiconductor device via a manufacturing method capable of preventing occurrence of flash or chip crack when clamping the semiconductor device via a mold. The invention provides a flow sensor structure comprising a semiconductor device having an air flow sensing unit and a diaphragm formed thereto, and a board or a lead frame having an electric control circuit for controlling the semiconductor device disposed thereto, wherein a surface of the electric control circuit and a part of a surface of the semiconductor device is covered with resin while having the air flow sensing unit portion exposed. The invention further provides flow sensor structure in which surfaces of a resin mold, a board or a pre-mold component surrounding the semiconductor device are continuously not in contact with three walls of the semiconductor device orthogonal to a side on which the air flow sensing unit portion is disposed, or a manufacturing method for absorbing the dimensional variation of the semiconductor device by the deformation of springs or deformation of an elastic film in the thickness direction.
摘要:
In a structure in which peripheral part of a diaphragm section of an electrical insulating film is covered with a protective film made of an organic material, the resistor wire on the diaphragm section crosses the peripheral part of the diaphragm section. At a place where a narrow wire of a resistance temperature detector and the like crosses the peripheral part of the diaphragm section, the protective film is thinner than the other part, and the dust impact resistance is reduced. At a place where a heating resistor wire connected to a heating resistor body or resistance temperature detector wires connected to resistance temperature detector bodies cross a periphery of the diaphragm section, a film component protruding from an electrical insulating film is arranged side by side with the heating resistor wire or the resistance temperature detector wires.
摘要:
In a gas flowmeter in which a rod and a sensor element are formed as a single body, for preventing heat of the sensor element from flowing into a sensor probe through a substrate (rod) so as to suppress considerable power consumption, and for obtaining a necessary response speed with respect to a flow rate of gas to be measured or a change in temperature, the gas column (rod) is made of an insulating material on a center axis of the sensing probe and is formed with a conductor pattern on its surface, and the sensing probe connects the sensor element disposed in a pipe through which the gas to be measured flows and a harness terminal through the conductor on the surface of the rod, so as to measure a gas flow rate by using the sensing prove.
摘要:
An air flow measuring instrument, comprising: an auxiliary passage 8 arranged inside a main passage through which fluid flows, a tabular member 5 on which a pattern of a heating resistor for measuring an air flow is provided on one face 5a, the tabular member being disposed inside the auxiliary passage so that the one face 5a on which the heating resistor pattern of the tabular member is provided is disposed along a flow of fluid inside the auxiliary passage 8, a heating resistor pattern-side fluid passage 8a portion formed so that the fluid flows between the face 5a and a passage-forming surface 8d of the auxiliary passage, and a back-surface 8b side fluid passage portion formed so that fluid flows between a face 5b on a side opposite to the face of the tabular member and the passage-forming surface of the auxiliary passage. Guidance portion 13 guiding dust that collides against the end portion to back-surface side fluid passage portion 8b side is provided on upstream-side end of tabular member.
摘要:
A gas flow measuring apparatus includes a detecting element including a heating resistor and a thermo-sensitive resistor disposed on a diaphragm and external terminals connected to the heating resistor and the thermo-sensitive resistor, and a flow rate detecting unit which controls heating temperature of the heating resistor and which detects a flow rate of gas according to a change in a resistance value of the heating resistor or the thermo-sensitive resistor. The detecting element includes a resistor area in which the heating resistor and the thermo-sensitive resistor are formed and a fixed section area in which the external terminals are formed. A stress mitigating unit is formed between the resistor area and the fixed section area.