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公开(公告)号：US20220369520A1
公开(公告)日：2022-11-17
申请号：US17318865
申请日：2021-05-12
Applicant: Nvidia Corporation
Inventor： Ali Heydari
Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a sensor string is associated with a first fluid line having a first flow controller and with a second fluid line having a second flow controller, so that sections of such a sensor string are enabled to maintain electrical connectivity there through by a mechanical coupling of a first flow controller and a second flow controller.
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公开(公告)号：US20220264772A1
公开(公告)日：2022-08-18
申请号：US17178657
申请日：2021-02-18
Applicant: Nvidia Corporation
Inventor： Ali Heydari
IPC: H05K7/20
Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, fins are provided within a cold plate and are adjustable to control an amount of surface area of the fins to be exposed to a fluid and to be cooled by the fluid based, at least in part, upon a temperature associated with the fluid or with at least one computing device.
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123.发明申请公开(公告)号：US20220240422A1
公开(公告)日：2022-07-28
申请号：US17160111
申请日：2021-01-27
Applicant: Nvidia Corporation
Inventor： Ali Heydari
Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a liquid-to-air heat exchanger is associated with a fan wall and a refrigerant-based cooling system to provide air cooling and refrigerant-based cooling to cool secondary coolant or fluid received from at least one cold plate.
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公开(公告)号：US20220225545A1
公开(公告)日：2022-07-14
申请号：US17149171
申请日：2021-01-14
Applicant: Nvidia Corporation
Inventor： Ali Heydari
IPC: H05K7/20
Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a liquid-to-air heat exchanger is associated with a fan wall of a rack and enables a datacenter cooling system to address a first cooling requirement of the rack in a first mode by air through the rack from the fan wall and to address a second cooling requirement of a fluid from at least one cold plate in the rack using the air through the liquid-to-air heat exchanger.
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公开(公告)号：US11343940B2
公开(公告)日：2022-05-24
申请号：US17004963
申请日：2020-08-27
Applicant: Nvidia Corporation
Inventor： Ali Heydari
Abstract: A cold plate that is configurable and for a datacenter liquid cooling system is disclosed. The cold plate includes a first section, a second section, and an intermediate layer, which is changeable and has first channels to enable flow of a coolant through the intermediate layer, and has second channels or at least one adapted second channel to concentrate the coolant or the flow of the coolant to at least one area within the configurable cold plate corresponding to at least a heat generating feature of an associated computing device.
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Patent Agency Ranking
公开(公告)号：US20220110223A1
公开(公告)日：2022-04-07
申请号：US17061320
申请日：2020-10-01
Applicant: Nvidia Corporation
Inventor： Ali Heydari
IPC: H05K7/20
Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a fluid reservoir in a form-factor of at least one rack is provided, the fluid reservoir to store fluid, the fluid to be passed to a cold plate or an immersive-cooled server, and the fluid to be cooled by a secondary cooling loop or an air-cooling system.
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公开(公告)号：US20220071049A1
公开(公告)日：2022-03-03
申请号：US17005017
申请日：2020-08-27
Applicant: Nvidia Corporation
Inventor： Ali Heydari , Mike Sabotta , Harold Miyamura
IPC: H05K7/20
Abstract: A remediation system for threshold leaks in a datacenter liquid cooling system is disclosed. The system includes a fluid controller and a power controller that are adapted to receive input from a learning subsystem that can determine that a threshold leak has occurred even though a computing component is functioning normally, so that a change in power state to reduce reliance on the coolant and so that a change of flow of the coolant may be effected.
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公开(公告)号：US20220011835A1
公开(公告)日：2022-01-13
申请号：US16925082
申请日：2020-07-09
Applicant: Nvidia Corporation
Inventor： Ali Heydari
Abstract: A cooling system for a datacenter is disclosed. A multiple mode cooling subsystem of the cooling system has a form factor for one or more racks of the datacenter, has two or more different cooling systems, and is adjustable to different cooling requirements of the datacenter within different cooling capacities offered by the two or more different cooling systems.
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公开(公告)号：US20220011834A1
公开(公告)日：2022-01-13
申请号：US16923971
申请日：2020-07-08
Applicant: Nvidia Corporation
Inventor： Ali Heydari
IPC: G06F1/20 , G05B19/042 , G06N20/00
Abstract: A cooling system for a datacenter is disclosed. An evaporative cooling subsystem provides blown air for cooling the datacenter and a repurposable refrigerant cooling subsystem controls moisture of the blown air in a first configuration and independently cools the datacenter in a second configuration.
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公开(公告)号：US20210382533A1
公开(公告)日：2021-12-09
申请号：US16891999
申请日：2020-06-03
Applicant: Nvidia Corporation
Inventor： Ali Heydari
Abstract: A mobile datacenter cooling system is disclosed. The mobile datacenter cooling system includes at least one container that in turn includes a container manifold to circulate coolant associated with a cooling tower to one or more liquid-cooled racks within the at least one container and to enable fluid coupling of the container manifold with a second container manifold of a second container.
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