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公开(公告)号：US20210216876A1
公开(公告)日：2021-07-15
申请号：US16743578
申请日：2020-01-15
Inventor： Donald McMenemy , John Kaminski , Shailesh N. Joshi , Ali M. Bazzi , Krishna Pattipati
IPC: G06N3/08
Abstract: Systems and methods of auto-encoder behavior modelling of vehicle components are described herein. A method for electronic device health prediction may include encoding input data into a reduced feature set via an auto-encoder as part of an artificial neural network. The method may further include decoding the reduced feature set. The method may also include reading the reduced feature set as output. The method may still further include encoding features of a subject device and other devices, wherein at least one of the other devices is designated as a healthy device. The method may additionally include associating the features of the other devices with a healthy device cluster based on a threshold distance. The method may also additionally include associating the features of the subject device with the healthy device cluster, wherein the subject device is flagged as faulty based upon exceeding the threshold distance from the healthy device cluster.
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公开(公告)号：US20210194323A1
公开(公告)日：2021-06-24
申请号：US16719264
申请日：2019-12-18
Inventor： Shailesh N. Joshi , Shohei Suenaga
IPC: H02K9/00 , H01L23/373 , H01L23/367 , H05K1/11 , H05K7/20
Abstract: An electronic assembly includes a flexible printed circuit board (PCB) circumferentially disposed around a motor and a thermal management assembly (TMA) thermally connected to the flexible PCB. One or more switching semiconductor devices are disposed on a first surface of the flexible PCB. The TMA includes a cooling jacket, at least one jacket manifold formed through the cooling jacket and a thermal compensation base layer thermally coupled to the cooling jacket. The cooling jacket is mounted around a circumference of the motor and has a mounting surface concentric with the circumference of the motor. The mounting surface is coupled to the first surface of the flexible PCB. The at least one jacket manifold has a fluid inlet and a fluid outlet defining a fluid flow area therebetween. The thermal compensation base layer is thermally coupled to the cooling jacket and the one or more switching semiconductor devices.
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公开(公告)号：US11031318B2
公开(公告)日：2021-06-08
申请号：US16864383
申请日：2020-05-01
Inventor： Shailesh N. Joshi
IPC: H01L23/427 , H01L21/48 , H05K7/20 , F28F13/00 , F28F21/08
Abstract: A cooling device including an encapsulated phase change porous layer that exhibits an increased heat capacity is disclosed. The encapsulated phase change porous layer may include a sintered porous layer, a phase change material formed over the sintered porous layer, and an encapsulation material formed over the phase change material. The encapsulation material may encapsulate the phase change material between the encapsulation material and the sintered porous layer and retain the phase change material between the encapsulation material and the sintered porous layer when a fluid is flowed through or in contact with the encapsulated phase change porous layer.
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公开(公告)号：US11031317B2
公开(公告)日：2021-06-08
申请号：US16597133
申请日：2019-10-09
Inventor： Shailesh N. Joshi , Yanghe Liu
IPC: H01L23/427 , H01L21/48 , H01L23/373 , H01L23/367 , H05K7/20 , H01L23/42 , H01L23/40
Abstract: Direct-bonded metal substrates of electronic assemblies are disclosed. For example, the direct-bonded metal substrate includes a ceramic substrate and a first conductive layer. The first conductive layer is bonded to a first surface of the ceramic substrate, and the first conductive layer includes a first core and a first encapsulating layer that encapsulates the first core. The first core includes a phase change material having a first melting temperature, the first encapsulating layer includes an encapsulating material having a second melting temperature, and the second temperature is greater than the first melting temperature.
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公开(公告)号：US11024921B2
公开(公告)日：2021-06-01
申请号：US15165228
申请日：2016-05-26
Inventor： Shailesh N. Joshi , Ercan M. Dede
IPC: H01M50/24 , H01M10/66 , H01M50/30 , H01M10/617 , H01M10/625 , B60R13/08
Abstract: An insulation system for a vehicle includes a vehicle component that operates at an operating temperature that is higher than an initial temperature, an insulation member thermally coupled to the vehicle component and thermally coupled to an ambient medium, the insulation member including an enclosed chamber, the enclosed chamber including a chamber wall that defines an interior volume, and carbon dioxide positioned within the interior volume of the enclosed chamber, where the chamber wall prevents flow of the carbon dioxide out of the enclosed chamber.
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Patent Agency Ranking
126.发明授权公开(公告)号：US10903186B2
公开(公告)日：2021-01-26
申请号：US16165563
申请日：2018-10-19
Inventor： Shailesh N. Joshi , Naoya Take
Abstract: An assembly that includes a first substrate, a second substrate, and a pair of bonding layers disposed between and bonded to the first and second substrates. The assembly further includes a solder layer disposed between the pair of bonding layers such that the solder layer is isolated from contacting the first substrate and the second substrate. The solder layer has a low melting temperature relative to a high melting temperature of the bonding layers. A coating is disposed over at least the pair of bonding layers and the solder layer such that the coating encapsulates the solder layer between the pair of bonding layers. The solder layer melts into a liquid form when the assembly operates at a temperature above the low melting temperature of the solder layer and the coating maintains the liquid form of the solder layer between the pair of bonding layers.
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127.发明授权公开(公告)号：US10818576B2
公开(公告)日：2020-10-27
申请号：US16243751
申请日：2019-01-09
Applicant: Toyota Motor Engineering & Manufacturing North America, Inc. , The Board of Trustees of the University of Illinois
Inventor： Shailesh N. Joshi , Naoya Take , Paul Braun , Julia Kohanek , Gaurav Singhal
IPC: H01L23/473 , H01L21/48 , H01L21/683 , H01L23/00
Abstract: Methods for forming bonded assemblies using metal inverse opal and cap structures are disclosed. In one embodiment, a method for forming a bonded assembly includes positioning a substrate against a polymer support that is porous, depositing a metal onto and within the polymer support, disposing a cap layer to the polymer support opposite of the substrate to form a bottom electrode, and removing the polymer support from between the substrate and the cap layer to form a metal inverse opal structure disposed therebetween.
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公开(公告)号：US10807629B2
公开(公告)日：2020-10-20
申请号：US16458884
申请日：2019-07-01
Inventor： Brian J. Pinkelman , Umesh N. Gandhi , Shailesh N. Joshi
Abstract: A vehicle steering wheel includes a first volume of phase change material and a second volume of phase change material spaced apart from the first volume of phase change material. The first volume of phase change material contains a greater mass of phase change material than the second volume of phase change material. A first wall forms a rim of the steering wheel. The first wall is in direct contact with both the first volume of phase change material and the second volume of phase change material, so as to facilitate heat transfer between the first volume of phase change material and the second volume of phase change material.
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公开(公告)号：US20200318651A1
公开(公告)日：2020-10-08
申请号：US16375436
申请日：2019-04-04
Inventor： Shailesh N. Joshi , Ercan Mehmet Dede , Umesh N. Gandhi
Abstract: Fan performance can be adjusted based on real-time operating conditions. The fan can include a plurality of blades operatively connected to a rotor. The blades can extend radially outward from the rotor to a tip. A housing can substantially surround the fan. The housing can have an inner peripheral surface that defines an inner diameter. The inner peripheral surface can include a first portion and a second portion downstream of the first portion. The first portion can be adjacently upstream of the plurality of blades, and the second portion can be substantially aligned with the plurality of blades. A plurality of actuators being distributed in a circumferential direction of the housing. The actuators can be operatively positioned to cause the inner diameter of the first portion or the second portion to be altered. As a result, one or more performance characteristics of the fan can be changed.
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公开(公告)号：US20200301772A1
公开(公告)日：2020-09-24
申请号：US16361780
申请日：2019-03-22
Inventor： Donald McMenemy , Weiqiang Chen , Ali M. Bazzi , Krishna R. Pattipati , Shailesh N. Joshi
IPC: G06F11/07
Abstract: Systems and methods for detecting a fault or model mismatch are disclosed. A system includes a processor, a memory, and one or more sensors. The sensors may detect data associated with an electronic device. The memory may store processor executable instructions to: compute T2 and Q statistics, over a time period, and apply a model mismatch and fault detection logic based on the T2 and Q statistics. The model mismatch and fault detection logic may: count consecutive instances where a T2 statistic exceeds a T2 threshold via a T2 counter, update a probability of fault based on the T2 counter, count consecutive instances where a Q statistic exceeds a Q threshold via a Q counter, update a probability of model mismatch based on the Q counter, and detect one of a fault or a model mismatch based on a probability of fault threshold and a probability of model mismatch threshold.
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