摘要:
The holding voltage (the minimum voltage required for operation) of a LVTSCR-like device is increased to a value that is greater than a dc bias on a to-be-protected node. The holding voltage is increased by reducing the size of the p+ emitter defined by the LVTSCR-like device. As a result, the LVTSCR can be utilized to provide ESD protection to power supply pins, having better current capabilities than a GGNMOS and better holding voltage characteristics than a LVTSCR.
摘要:
In an ESD protection circuit, diodes for shunting current through an ESD clamp include a third terminal in order to provide a dual current path through the diode structure and provide for a voltage drop to the input of the protected internal circuit. In another embodiment, where a bipolar junction transistor is used as an ESD clamp to shunt current to ground between an I/O pad and an input to a protected internal circuit, a lower voltage is provided to the internal circuit by providing a voltage drop across an internal resistive element of the bipolar junction transistor. This is achieved by making use of two base terminals, one connected to the I/O pad, and the other connected to the input of the internal circuit and spaced from the first contact by the base polysilicon region of the bipolar junction transistor.
摘要:
In a BSCR and method of making a BSCR, a npn BJT structure is created and a p+ region is provided that is connected to the collector of the BJT, and one or more of the NBL, sinker and n+ collector of the BJT are partially blocked. In this way the NBL is formed into a comb-like NBL with a plurality of tines in one embodiment. The sinker and n+ collector may also be formed into a plurality islands. Furthermore, the period of the tines and islands may be varied to provide the desired BSCR characteristics.
摘要:
In a Bi-CMOS ESD protection device, dual voltage capabilities are achieved by providing two laterally spaced p-regions in a n-material and defining a n+ region and a p+ region in each of the p-regions to define I-V characteristics that are similar to those defined by a SCR device in a positive direction, but, in this case, having those characteristics in both directions. The device may be asymmetrical to accommodate different voltage amplitudes in the positive and negative directions.
摘要:
In a Bi-CM0S ESD protection structure, the holding voltage is increased by a desired amount by including a NBL of chosen length. The positioning of the NBL may be adjusted to adjust the I-V characteristics of the structure. Dual voltage capabilities may be achieved by providing two laterally spaced p-regions in a n-material and defining a n+ region and a p+ region in each of the p-regions to define I-V characteristics that are similar to those defined by a SCR device in a positive direction, but, in this case, having those characteristics in both directions. Over and above the NBL position being adjusted relative to the p-regions, the two p-regions may vary in doping level, and dimensions to achieve different I-V characteristics for the device in the positive and negative directions.
摘要:
In an ESD protection device using a SCR-like structure, a vertical device is provided that is highly robust and easily allows the triggering voltage to be adjusted during manufacture. Furthermore it is implementable in complementary form based on PNP and NPN BJT structures, to provide both positive and negative pulse protection.
摘要:
The holding voltage (the minimum voltage required for operation) of a low-voltage triggering silicon-controlled rectifier (LVTSCR) is increased to a value that is greater than a dc bias on a to-be-protected node. The holding voltage is increased by inserting a voltage drop between the to-be-protected node and the emitter of the pnp transistor of the LVTSCR. As a result, the LVTSCR can be utilized to provide ESD protection to power supply pins.
摘要:
An ESD protection structure for use with ICs that can protect from ESD events of both positive and negative polarities, has a low snapback holding voltage and a high maximum snapback current, and is relatively immune to thermal overheating. The structure includes a semiconductor substrate of a first conductivity type (typically P-type), as well as first and second well regions of a second conductivity type (typically N-type) that are separated a gap region of the first conductivity type and disposed in the substrate. A gate silicon dioxide layer overlies the gap region and a gate electrode overlies the gate silicon dioxide layer. Also included are first and second floating regions (of the second conductivity type) disposed in the first and second well regions adjacent to the gap region, respectively. The structure further includes first and second contact regions of the first conductivity type disposed on the first and second well regions, respectively, and spaced apart from the first and second floating regions, respectively. Also included are first and second contact regions of the second conductivity type disposed on the first and second well regions, respectively, and spaced apart from the first and second floating regions, respectively. During operation, the structure undergoes low current avalanche breakdown of the gap region between the first and second floating regions, followed by “double injection” of both holes and electrons. The structure's symmetrical nature provides for protection from both positive and negative ESD events and the gate electrode provides breakdown control capability.
摘要:
A self-propelled robotic device moves through bodily and other passageways by inflating regions of an overlying bladder along the length of the robotic device in a sequence that imparts motion to the device. The regions of the overlying bladder are inflated by energizing a plurality of coils, which are surrounded by a ferrofluid, in a sequence. The ferrofluid responds to the magnetic field created by an energized coil by creating a bulge in the side wall of the overlying bladder.
摘要:
A storage device that is capable of receiving an analog signal and storing it as a digital signal. The storage device includes an input node configured to receive an analog input voltage and two non-volatile storage cells. A second non-volatile memory cell is coupled to receive the analog input signal from the input node. The second non-volatile memory cell is capable of being programmed to a one of a plurality of programming states. The first non-volatile memory cell, which is coupled to the second non-volatile memory cell, is also capable of being programmed to one of a plurality of programming states. During operation, the second non-volatile memory cell and the first non-volatile memory cell are both programmed to a selected second programming state indicative of the magnitude of the analog input voltage. The first programming state and the second programming state are together are indicative of a digital value commensurate with the magnitude of the analog input voltage.