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公开(公告)号:US11815717B2
公开(公告)日:2023-11-14
申请号:US17525293
申请日:2021-11-12
Applicant: GLOBALFOUNDRIES U.S. Inc.
Inventor: Vibhor Jain , Nicholas A. Polomoff , Yusheng Bian
CPC classification number: G02B6/122 , G02B6/243 , H01L23/573 , G02B2006/12061 , G02B2006/12126
Abstract: The present disclosure relates to semiconductor structures and, more particularly, to a photonic chip security structure and methods of manufacture. The structure includes an optical component and a photonic chip security structure having a vertical wall composed of light absorbing material surrounding the optical component.
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公开(公告)号:US11808995B2
公开(公告)日:2023-11-07
申请号:US17707403
申请日:2022-03-29
Applicant: GlobalFoundries U.S. Inc.
Inventor: Yusheng Bian
CPC classification number: G02B6/4203 , G02B6/1228 , G02B6/12002 , G02B2006/12152
Abstract: Structures for an edge coupler and methods of fabricating such structures. The structure includes a back-end-of-line stack located over a substrate. The back-end-of-line stack includes a waveguide core having a longitudinal axis and a tapered section with a width that varies with position along the longitudinal axis based on a non-linear function.
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公开(公告)号:US20230341637A1
公开(公告)日:2023-10-26
申请号:US17729244
申请日:2022-04-26
Applicant: GlobalFoundries U.S. Inc.
Inventor: Yusheng Bian
IPC: G02B6/42
CPC classification number: G02B6/4206 , G02B6/42
Abstract: Photonics structures for a waveguide or an edge coupler and methods of fabricating a photonics structure for a waveguide or an edge coupler. The photonics structure includes a waveguide core having a first section, a second section longitudinally adjacent to the first section, first segments projecting in a vertical direction from the first section, and second segments projecting in the vertical direction from the second section. The first section of the waveguide core has a first thickness, and the second section of the waveguide core has a second thickness that is greater than the first thickness.
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公开(公告)号:US11782208B1
公开(公告)日:2023-10-10
申请号:US17858549
申请日:2022-07-06
Applicant: GlobalFoundries U.S. Inc.
Inventor: Yusheng Bian
CPC classification number: G02B6/12007 , G02B6/13 , G02B6/2938 , G02B6/29352 , G02B6/29325 , G02B2006/12061 , G02B2006/12097 , G02B2006/12164
Abstract: Structures for a wavelength splitter used in a wavelength-division-multiplexing filter stage and methods of forming same. The structure comprises a first waveguide core including a first section, a second section, and a phase delay line between the first section and the second section. The phase delay line of the first waveguide core includes a delay section and a plurality of segments longitudinally arranged in the delay section. The structure further comprises a second waveguide core including a first section, a second section, and a phase delay line between the first section and the second section. The first section of the second waveguide core is positioned adjacent to the first section of the first waveguide core to define a first directional coupler, and the second section of the second waveguide core is positioned adjacent to the second section of the first waveguide core to define a second directional coupler.
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公开(公告)号:US20230305241A1
公开(公告)日:2023-09-28
申请号:US17701942
申请日:2022-03-23
Applicant: GlobalFoundries U.S. Inc.
Inventor: Yusheng Bian
IPC: G02B6/42
CPC classification number: G02B6/4203
Abstract: Structures for an edge coupler and methods of fabricating such structures. The structure includes a substrate, a waveguide core, and a metamaterial layer positioned in a vertical direction between the substrate and the waveguide core. The metamaterial layer includes a plurality of elements separated by a plurality of gaps and a dielectric material in the plurality of gaps.
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公开(公告)号:US11747560B2
公开(公告)日:2023-09-05
申请号:US17411122
申请日:2021-08-25
Applicant: GLOBALFOUNDRIES U.S. Inc.
Inventor: Yusheng Bian , Roderick A. Augur
CPC classification number: G02B6/1228 , G02B6/125 , G02B6/136 , G02B2006/12061
Abstract: Disclosed is a photonic integrated circuit (PIC) structure including: a first waveguide with a first main body and a first end portion, which is tapered; and a second waveguide with a second main body and a second end portion, which has two branch waveguides that are positioned adjacent to opposing sides, respectively, of the first end portion of the first waveguide and that branch out from the second main body, thereby forming a V, U or similar shape. The arrangement of the two branch waveguides of the second end portion of the second waveguide relative to the tapered first end portion of the first waveguide allows for mode matching conditions to be met at multiple locations at the interface between the waveguides, thereby creating multiple signal paths between the waveguides and effectively reducing the light signal power density along any one path to prevent or at least minimize any power-induced damage.
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公开(公告)号:US20230273369A1
公开(公告)日:2023-08-31
申请号:US17680421
申请日:2022-02-25
Applicant: GlobalFoundries U.S. Inc.
Inventor: Shesh Mani Pandey , Yusheng Bian , Steven M. Shank , Judson Holt
Abstract: Photonics structures including an optical component and methods of fabricating a photonics structure including an optical component. The photonics structure includes an optical component, a substrate having a cavity and a dielectric material in the cavity, and a dielectric layer positioned in a vertical direction between the optical component and the cavity. The optical component is positioned in a lateral direction to overlap with the cavity in the substrate.
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公开(公告)号:US20230266526A1
公开(公告)日:2023-08-24
申请号:US17674905
申请日:2022-02-18
Applicant: GlobalFoundries U.S. Inc.
Inventor: Shesh Mani Pandey , Yusheng Bian , Francis O. Afzal
CPC classification number: G02B6/0288 , G02B6/036
Abstract: Disclosed is an optical waveguide including a waveguide core and waveguide cladding surrounding the waveguide core. The waveguide cladding includes at least one stack of cladding material layers positioned laterally adjacent to a sidewall of the waveguide core such that each cladding material layer in the stack abuts the sidewall of the waveguide core. Each of the cladding material layers in the stack has a smaller refractive index than the waveguide core and at least two of the cladding material layers in the stack have different refractive indices, thereby tailoring field confinement and reshaping the optical mode. Different embodiments include different numbers of cladding material layers in the stack, different stacking orders of the cladding material layers, different waveguide core types, symmetric or asymmetric cladding structures on opposite sides of the waveguide core, etc. Also disclosed is a method of forming the optical waveguide.
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公开(公告)号:US11662523B2
公开(公告)日:2023-05-30
申请号:US17151955
申请日:2021-01-19
Applicant: GLOBALFOUNDRIES U.S. Inc.
Inventor: Yusheng Bian , Roderick A. Augur , Kenneth J. Giewont , Karen Nummy
CPC classification number: G02B6/305 , G02B6/0046 , G02B6/4298 , G02B6/12002 , G02B6/12004 , G02B2006/12147
Abstract: Structures including an edge coupler and methods of forming a structure including an edge coupler. The structure includes a waveguide core over a dielectric layer and a back-end-of-line stack over the dielectric layer and the waveguide core. The back-end-of-line stack includes a side edge and a truncated layer that is overlapped with a tapered section of the waveguide core. The truncated layer has a first end surface adjacent to the side edge and a second end surface above the tapered section of the waveguide core. The truncated layer is tapered from the first end surface to the second end surface.
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公开(公告)号:US11656409B2
公开(公告)日:2023-05-23
申请号:US17197133
申请日:2021-03-10
Applicant: GLOBALFOUNDRIES U.S. Inc.
Inventor: Yusheng Bian , Qizhi Liu
Abstract: Embodiments of the disclosure provide an optical antenna for a photonic integrated circuit (PIC). The optical antenna includes a semiconductor waveguide on a semiconductor layer. The semiconductor waveguide includes a first vertical sidewall over the semiconductor layer over the semiconductor layer. A plurality of grating protrusions extends horizontally from the first vertical sidewall of the semiconductor waveguide.
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