公开(公告)号：US20230341637A1

公开(公告)日：2023-10-26

申请号：US17729244

申请日：2022-04-26

Applicant: GlobalFoundries U.S. Inc.

Inventor： Yusheng Bian

IPC: G02B6/42

CPC classification number: G02B6/4206 ,  G02B6/42

Abstract: Photonics structures for a waveguide or an edge coupler and methods of fabricating a photonics structure for a waveguide or an edge coupler. The photonics structure includes a waveguide core having a first section, a second section longitudinally adjacent to the first section, first segments projecting in a vertical direction from the first section, and second segments projecting in the vertical direction from the second section. The first section of the waveguide core has a first thickness, and the second section of the waveguide core has a second thickness that is greater than the first thickness.

公开(公告)号：US11782208B1

公开(公告)日：2023-10-10

申请号：US17858549

申请日：2022-07-06

Applicant: GlobalFoundries U.S. Inc.

Inventor： Yusheng Bian

IPC: G02B6/12 ,  G02B6/13 ,  G02B6/293

CPC classification number: G02B6/12007 ,  G02B6/13 ,  G02B6/2938 ,  G02B6/29352 ,  G02B6/29325 ,  G02B2006/12061 ,  G02B2006/12097 ,  G02B2006/12164

Abstract: Structures for a wavelength splitter used in a wavelength-division-multiplexing filter stage and methods of forming same. The structure comprises a first waveguide core including a first section, a second section, and a phase delay line between the first section and the second section. The phase delay line of the first waveguide core includes a delay section and a plurality of segments longitudinally arranged in the delay section. The structure further comprises a second waveguide core including a first section, a second section, and a phase delay line between the first section and the second section. The first section of the second waveguide core is positioned adjacent to the first section of the first waveguide core to define a first directional coupler, and the second section of the second waveguide core is positioned adjacent to the second section of the first waveguide core to define a second directional coupler.

公开(公告)号：US20230305241A1

公开(公告)日：2023-09-28

申请号：US17701942

申请日：2022-03-23

Applicant: GlobalFoundries U.S. Inc.

Inventor： Yusheng Bian

IPC: G02B6/42

CPC classification number: G02B6/4203

Abstract: Structures for an edge coupler and methods of fabricating such structures. The structure includes a substrate, a waveguide core, and a metamaterial layer positioned in a vertical direction between the substrate and the waveguide core. The metamaterial layer includes a plurality of elements separated by a plurality of gaps and a dielectric material in the plurality of gaps.

公开(公告)号：US11747560B2

公开(公告)日：2023-09-05

申请号：US17411122

申请日：2021-08-25

Applicant: GLOBALFOUNDRIES U.S. Inc.

Inventor： Yusheng Bian ,  Roderick A. Augur

IPC: G02B6/122 ,  G02B6/125 ,  G02B6/12 ,  G02B6/136

CPC classification number: G02B6/1228 ,  G02B6/125 ,  G02B6/136 ,  G02B2006/12061

Abstract: Disclosed is a photonic integrated circuit (PIC) structure including: a first waveguide with a first main body and a first end portion, which is tapered; and a second waveguide with a second main body and a second end portion, which has two branch waveguides that are positioned adjacent to opposing sides, respectively, of the first end portion of the first waveguide and that branch out from the second main body, thereby forming a V, U or similar shape. The arrangement of the two branch waveguides of the second end portion of the second waveguide relative to the tapered first end portion of the first waveguide allows for mode matching conditions to be met at multiple locations at the interface between the waveguides, thereby creating multiple signal paths between the waveguides and effectively reducing the light signal power density along any one path to prevent or at least minimize any power-induced damage.

公开(公告)号：US20230273369A1

公开(公告)日：2023-08-31

申请号：US17680421

申请日：2022-02-25

Applicant: GlobalFoundries U.S. Inc.

Inventor： Shesh Mani Pandey ,  Yusheng Bian ,  Steven M. Shank ,  Judson Holt

IPC: G02B6/122 ,  H01L21/84 ,  G02B6/136

CPC classification number: G02B6/122 ,  G02B6/136 ,  H01L21/84

Abstract: Photonics structures including an optical component and methods of fabricating a photonics structure including an optical component. The photonics structure includes an optical component, a substrate having a cavity and a dielectric material in the cavity, and a dielectric layer positioned in a vertical direction between the optical component and the cavity. The optical component is positioned in a lateral direction to overlap with the cavity in the substrate.

公开(公告)号：US20230266526A1

公开(公告)日：2023-08-24

申请号：US17674905

申请日：2022-02-18

Applicant: GlobalFoundries U.S. Inc.

Inventor： Shesh Mani Pandey ,  Yusheng Bian ,  Francis O. Afzal

IPC: G02B6/028 ,  G02B6/036

CPC classification number: G02B6/0288 ,  G02B6/036

Abstract: Disclosed is an optical waveguide including a waveguide core and waveguide cladding surrounding the waveguide core. The waveguide cladding includes at least one stack of cladding material layers positioned laterally adjacent to a sidewall of the waveguide core such that each cladding material layer in the stack abuts the sidewall of the waveguide core. Each of the cladding material layers in the stack has a smaller refractive index than the waveguide core and at least two of the cladding material layers in the stack have different refractive indices, thereby tailoring field confinement and reshaping the optical mode. Different embodiments include different numbers of cladding material layers in the stack, different stacking orders of the cladding material layers, different waveguide core types, symmetric or asymmetric cladding structures on opposite sides of the waveguide core, etc. Also disclosed is a method of forming the optical waveguide.

公开(公告)号：US11662523B2

公开(公告)日：2023-05-30

申请号：US17151955

申请日：2021-01-19

Applicant: GLOBALFOUNDRIES U.S. Inc.

Inventor： Yusheng Bian ,  Roderick A. Augur ,  Kenneth J. Giewont ,  Karen Nummy

IPC: G02B6/30 ,  G02B6/42 ,  F21V8/00 ,  G02B6/12

CPC classification number: G02B6/305 ,  G02B6/0046 ,  G02B6/4298 ,  G02B6/12002 ,  G02B6/12004 ,  G02B2006/12147

Abstract: Structures including an edge coupler and methods of forming a structure including an edge coupler. The structure includes a waveguide core over a dielectric layer and a back-end-of-line stack over the dielectric layer and the waveguide core. The back-end-of-line stack includes a side edge and a truncated layer that is overlapped with a tapered section of the waveguide core. The truncated layer has a first end surface adjacent to the side edge and a second end surface above the tapered section of the waveguide core. The truncated layer is tapered from the first end surface to the second end surface.

公开(公告)号：US11656409B2

公开(公告)日：2023-05-23

申请号：US17197133

申请日：2021-03-10

Applicant: GLOBALFOUNDRIES U.S. Inc.

Inventor： Yusheng Bian ,  Qizhi Liu

IPC: G02B6/124 ,  G02B6/13

CPC classification number: G02B6/124 ,  G02B6/13

Abstract: Embodiments of the disclosure provide an optical antenna for a photonic integrated circuit (PIC). The optical antenna includes a semiconductor waveguide on a semiconductor layer. The semiconductor waveguide includes a first vertical sidewall over the semiconductor layer over the semiconductor layer. A plurality of grating protrusions extends horizontally from the first vertical sidewall of the semiconductor waveguide.

公开(公告)号：US20230130467A1

公开(公告)日：2023-04-27

申请号：US17452129

申请日：2021-10-25

Applicant: GlobalFoundries U.S. Inc.

Inventor： Nicholas A. Polomoff ,  Thomas Houghton ,  Yusheng Bian

IPC: G02B6/12 ,  G02B6/42 ,  G02B6/30 ,  G02B6/43

Abstract: A photonic integrated circuit (PIC) die are provided. The PIC die includes a set of optical connect grooves including a first groove aligning a core of a first optical fiber positioned with a first optical component in a first layer at a first vertical depth in a plurality of layers of a body of the die, and a second groove aligning a core of a second optical fiber positioned therein with a second optical component in a second, different layer at a second different vertical depth in the plurality of layers. The grooves may also have end faces at different lateral depths from an edge of the body of the PIC die. Any number of the first and second grooves can be used to communicate an optical signal to any number of layers at different vertical and/or lateral depths within the body of the PIC die.

公开(公告)号：US20230113261A1

公开(公告)日：2023-04-13

申请号：US17450324

申请日：2021-10-08

Applicant: GlobalFoundries U.S. Inc.

Inventor： Roderick Alan Augur ,  Yusheng Bian ,  Robert John Fox, III

IPC: H01L23/532 ,  H01L23/522 ,  H01L23/552

Abstract: A photonic integrated circuit (PIC) die includes a silicon nitride optical component over an active region. Multiple interconnect layers are over the silicon nitride optical component, each of the multiple interconnect layers including a metal interconnect therein. At least one optical deflector is over the multiple interconnect layers and over the silicon nitride optical component. The optical deflector(s) may also include a contact passing therethrough to the interconnect layers, but do not include any other electrical interconnects. Each optical deflector may deflect light within an ambient light range of less than 570 nanometers (nm) to protect the silicon nitride optical component from light-induced degradation.