公开(公告)号：US5871851A

公开(公告)日：1999-02-16

申请号：US920174

申请日：1997-08-25

申请人： Keisuke Fukumizu ,  Hiroaki Kato ,  Teruo Takeuchi ,  Takahide Shimazu ,  Yasuo Sato ,  Tatsuo Amaike ,  Ryoichi Yoshihara ,  Takeshi Harada

发明人： Keisuke Fukumizu ,  Hiroaki Kato ,  Teruo Takeuchi ,  Takahide Shimazu ,  Yasuo Sato ,  Tatsuo Amaike ,  Ryoichi Yoshihara ,  Takeshi Harada

IPC分类号： C21D8/02 ,  C21D8/12 ,  H01J29/06 ,  B32B15/18

CPC分类号： H01J29/06 ,  C21D8/0236 ,  C21D8/1277 ,  C21D8/0278 ,  C21D8/1233 ,  Y10T428/12854 ,  Y10T428/12937

摘要： A 0.1 to 0.5 mm-thick plated steel sheet having high coercive force and magnetic flux density is provided by hot rolling a slab comprising by weight carbon: 0.01 to 0.09%, silicon: not more than 1.0%, phosphorus: not more than 0.3%, manganese: not more than 1.5%, sulfur: not more than 0.04%, aluminum: not more than 1.0%, and nitrogen: not more than 0.01% with the balance consisting of iron and unavoidable impurities, cold rolling the hot rolled sheet, annealing the cold rolled sheet to prepare a steel sheet having an average grain diameter of 3 to 15 .mu.m, temper rolling the steel sheet with a reduction ratio of not more than 3%, and plating the temper rolled sheet with chromium or nickel. This enables the provision of a magnetic shielding material having no significant drift and very good electron beam landing properties.

摘要翻译： 通过热轧含有重量百分比为0.01〜0.09％的硅，不超过1.0％的磷，不超过0.3％的平板，提供具有高矫顽力和磁通密度的0.1〜0.5mm厚的镀覆钢板， ，锰：不大于1.5％，硫：不大于0.04％，铝：不大于1.0％，氮：不大于0.01％，余量由铁和不可避免的杂质组成，冷轧热轧板， 对冷轧板进行退火，制备平均粒径为3〜15μm的钢板，以3％以下的压下率对钢板进行回火处理，并对铬或镍进行镀层。 这使得能够提供没有显着漂移的磁屏蔽材料和非常好的电子束着陆性能。

公开(公告)号：US5818103A

公开(公告)日：1998-10-06

申请号：US828336

申请日：1997-03-28

申请人： Takeshi Harada

发明人： Takeshi Harada

IPC分类号： H01L23/495

CPC分类号： H01L24/32 ,  H01L23/49503 ,  H01L2224/32057 ,  H01L2224/32245 ,  H01L2224/83385 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/351

摘要： A semiconductor device has a semiconductor chip mounted on the mounting portion of a lead frame and sealed with resin. The chip is affixed to the lead frame by melting. A groove is formed in the lead frame in a cruciform, radial, lattice or similar pattern capable of reducing thermal stress during intermittent performance test and cycling test while insuring heat radiation.

摘要翻译： 半导体器件具有安装在引线框架的安装部分上并用树脂密封的半导体芯片。 芯片通过熔化固定在引线框架上。 在引线框架中以十字形，径向，格子或类似的图案形成凹槽，其能够在间歇性性能测试和循环测试期间降低热应力，同时确保热辐射。

公开(公告)号：US5488255A

公开(公告)日：1996-01-30

申请号：US162265

申请日：1993-12-07

申请人： Kazuo Sato ,  Mitsuhiro Shikida ,  Shigeo Ohashi ,  Toshio Hatada ,  Noriyuki Ashiwake ,  Shinji Tanaka ,  Takeshi Harada ,  Yukio Honda

发明人： Kazuo Sato ,  Mitsuhiro Shikida ,  Shigeo Ohashi ,  Toshio Hatada ,  Noriyuki Ashiwake ,  Shinji Tanaka ,  Takeshi Harada ,  Yukio Honda

IPC分类号： F04B43/04 ,  F04B45/047 ,  H01L23/467 ,  H02N1/00 ,  H01L23/34

CPC分类号： H01L23/467 ,  F04B43/043 ,  F04B45/047 ,  H02K99/20 ,  H02N1/006 ,  H01L2924/0002 ,  H01L2924/15192

摘要： A cooling device according to the present invention, in which a space is formed by means of flat electrodes and side plates disposed on the ends of the flat electrodes, and a flexible film fastened in that space in a shape of the letter S, is fixed to a semiconductor package so that one of the flat electrodes is fitted on the semiconductor package. The respective flat electrodes are alternately powered to move the S shaped section of the flexible film.

摘要翻译： 根据本发明的冷却装置，其中通过平面电极和设置在平坦电极的端部上的侧板形成空间，并且固定在该空间中的具有字母S的形状的柔性膜被固定 到半导体封装，使得一个平板电极安装在半导体封装上。 各个扁平电极交替供电以移动柔性膜的S形部分。

公开(公告)号：US5233260A

公开(公告)日：1993-08-03

申请号：US913348

申请日：1992-07-15

申请人： Takeshi Harada ,  Akiomi Kohno ,  Akiomi Kohno ,  Shigeru Jomura

发明人： Takeshi Harada ,  Akiomi Kohno ,  Akiomi Kohno ,  Shigeru Jomura

IPC分类号： H01L41/047 ,  H01L41/083 ,  H01L41/297

CPC分类号： H01L41/297 ,  H01L41/0477 ,  H01L41/083 ,  Y10T29/42

摘要： In an overall stacked piezoelectric element, the material for the electrode was selected from aluminum, nickel and copper each alone or alloys based on aluminum, nickel or copper, and further the parts of the electrodes which contact with molding resin on the side face of the stacked body and the parts which have to be insulated from the lead-out terminals were subjected to an oxidation or nitriding treatment. As the result, an improved element was obtained which is of a high reliability, suited to low voltage operation and suffers no short-circuit of the electrodes even when water permeates to the side face of the stacked body during operation in a humid atmosphere.

摘要翻译： 在整体堆叠的压电元件中，用于电极的材料单独选自铝，镍和铜或基于铝，镍或铜的合金，还有在模制树脂的侧面上与模制树脂接触的部分 堆叠体和必须与引出端子绝缘的部件进行氧化或氮化处理。 结果，获得了具有高可靠性的改进元件，其适用于低电压操作，并且即使当在潮湿气氛中操作期间水渗透到堆叠体的侧面时也不会发生电极的短路。