摘要:
A semiconductor device including a first semiconductor layer formed on a semiconductor substrate, a second semiconductor layer surrounding the first semiconductor layer, the second semiconductor layer being formed on the semiconductor substrate with one of an insulating film and a cavity, and a third semiconductor layer surrounding the second semiconductor layer, the third semiconductor layer being formed on the semiconductor substrate.
摘要:
A semiconductor device comprises a semiconductor substrate, a MOSFET including a double gate structure provided on the semiconductor substrate, and an isolation region for isolating the MOSFET from other elements comprising a trench provided on the surface of the semiconductor substrate and an insulator provided in the trench, a part of the isolation region in the trench around the MOSFET having a bottom deeper than other part of the isolation region.
摘要:
Provided is a developer for thermal positive type photosensitive composition, which is easy in developer handling such as pH adjustment, has a developing treatment capability ensuring durability in multiple uses, has little change of pH value over a prolonged period of time and is excellent in durability, has a development capability capable of satisfactorily developing of 100 or more rolls, preferably about 300 to 400 rolls so that the developer can be applied especially to photoengraved rolls for gravure printing, and exhibits a buffering action and is minimized in the aging deterioration of processing capacity so as to realize reduction of the frequency of developer replacement. The developer for thermal positive type photosensitive composition comprises a weak alkaline aqueous solution containing (A) triethanolamine and/or diethanolamine and (B) at least one member selected from the group consisting of: potassium pyrophosphate; sodium tripolyphosphate; and sodium hexametaphosphate.
摘要:
There is provided a positive photosensitive composition which requires no burning, makes it possible to obtain necessary and sufficient adhesion when it is applied under a humidity of 25 to 60%, can be developed at a low alkali intensity, makes it possible to carry out development with keeping high sensitivity while forming no residue, ensures sharp edges, can provide a very hard resist film and is improved in scratch resistance in the handling before development. The composition comprises (A) an alkali-soluble high molecular substance having in the molecule thereof at least one carboxyl group, (B) a photo-thermal conversion material which absorbs infrared rays from an image exposure light source to convert the rays to heat, and (C) a thiol compound.
摘要:
A toner cartridge inserted in an image forming apparatus and supplying toner to the image forming apparatus, the cartridge comprises a toner container that contains toner, and a protrusion for showing a type of the toner cartridge, wherein the protrusion forms a ramp inclining toward a direction the toner cartridge is inserted in the image forming apparatus.
摘要:
The present invention realizes both the reduction of thickness of a liquid crystal panel and the acquisition of a sufficient strength of the liquid crystal display panel simultaneously. A display device including a display panel includes a first substrate, a second substrate which is arranged to face the first substrate in an opposed manner on a side closer to a viewer than the first substrate, an upper polarizer which is arranged on the side closer to the viewer than the second substrate, and a resin film which is arranged on the side closer to the viewer than the upper polarizer and is brought into close contact with the upper polarizer by adhesion, wherein an outer periphery of the upper polarizer is arranged more inside than an outer periphery of the second substrate, and an outer periphery of the resin film is arranged more outside than the outer periphery of the upper polarizer as viewed from a front surface of the display panel, and a cushion material which is brought into close contact with the second substrate and the resin film is interposed between the second substrate and the resin film more outside than the outer periphery of the upper polarizer.
摘要:
A method of manufacturing a semiconductor device substrate is disclosed, which comprises forming a mask layer patterned on a semiconductor layer insulated from a surface of a semiconductor substrate by an electrically insulating layer, etching the semiconductor layer according to the pattern of the mask layer to form a trench leading to the insulating layer, etching a protective layer deposited thinner on the semiconductor substrate than the thickness of the insulating layer to form a sidewall protective film which covers a side surface of the trench, etching the insulating layer from a bottom surface of the trench to the semiconductor substrate; and growing a single-crystalline layer from the surface of the semiconductor substrate exposed as a result of etching the insulating layer.
摘要:
A semiconductor chip includes a base substrate, a bulk device region having a bulk growth layer on a part of the base substrate, an SOI device region having a buried insulator on the base substrate and a silicon layer on the buried insulator, and a boundary layer located at the boundary between the bulk device region and the SOI device region. The bulk device region has a first device-fabrication surface in which a bulk device is positioned on the bulk growth layer. The SOI device region has a second device-fabrication surface in which an SOI device is positioned on the silicon layer. The first and second device-fabrication surfaces are positioned at a substantially uniform level.
摘要:
A method of manufacturing a semiconductor device substrate includes forming a mask layer pattern on a semiconductor layer insulated from a surface of a semiconductor substrate by an electrically insulating layer, etching the semiconductor layer according to the pattern of the mask layer to form a trench leading to the insulating layer, etching a protective layer on the semiconductor substrate having a thickness less than the thickness of the insulating layer to form a sidewall protective film which covers a side surface of the trench, etching the insulating layer from a bottom surface of the trench to the semiconductor substrate; and growing a single-crystalline layer from the surface of the semiconductor substrate exposed as a result of etching the insulating layer.