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公开(公告)号：US20230188241A1
公开(公告)日：2023-06-15
申请号：US17551488
申请日：2021-12-15
Applicant: Applied Optoelectronics, Inc.
Inventor： Kai-Sheng LIN , Hao-Chiang CHENG , Ziliang CAI
CPC classification number: H04J14/0213 , H04B10/40
Abstract: The present disclosure is generally directed to a holder that can be used to couple to and optically align an optical component with, for instance, an associated light path to launch or receive optical channel wavelengths along the same. The holder preferably includes a receptacle to couple to the optical component and a mounting section enables the holder to be securely coupled to a substrate in a manner that minimizes or otherwise reduces introducing component shift and resulting optical misalignment.
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公开(公告)号：US11456566B2
公开(公告)日：2022-09-27
申请号：US16810517
申请日：2020-03-05
Applicant: Applied Optoelectronics, Inc.
Inventor： William G. Mahoney , Simon Farfoud
IPC: H01R13/52 , H01R24/52 , H01R24/54 , H01R13/631 , H01R13/642
Abstract: A coaxial seizure assembly is disclosed that includes an integrated mechanical stop that prevents over-insertion and maintains a nominal/expected impedance value to enable high-frequency switching, e.g., 1.8-3 Ghz or greater. In more detail, the coaxial seizure assembly includes a coaxial receptacle defined by an opening configured to at least partially receive and couple to a coaxial connector. The opening communicates with a seizure cavity defined within the coaxial seizure assembly. A radio frequency (RF) interconnect at least partially extends into the seizure cavity, with the RF interconnect having a first end to electrically couple to an electrical component and a second end that extends a predetermined angle relative to the first end, e.g., substantially 90 degrees. The second end defines a mating surface that aligns within the seizure cavity such that an imaginary line drawn along an insertion path of a coaxial cable conductor pin intersects with the mating surface.
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公开(公告)号：US20220091345A1
公开(公告)日：2022-03-24
申请号：US17031392
申请日：2020-09-24
Applicant: Applied Optoelectronics, Inc.
Inventor： Kai-Sheng LIN , John CHENG , Ziliang CAI
Abstract: In general, the present disclosure is directed to locking arrangements for use with optical subassembly housings, such as small form-factor pluggable (SFFP) housings, that include a handle member configured to rotate about the housing to allow a user to select a target/desired orientation. Preferably, the locking arrangement couples to a pluggable housing that is configured to removably couple into a receptacle of an optical transceiver cage or other suitable enclosure. The locking arrangement further includes a handle member rotatably coupled to the pluggable housing, the handle member being configured to allow the pluggable housing to releasably lock within the receptacle. The handle member is also preferably configured to maintain a user-selected orientation such that the handle member remains at a given angle relative to the pluggable housing in the absence of a user-supplied force.
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144.发明授权公开(公告)号：US11054592B2
公开(公告)日：2021-07-06
申请号：US16693361
申请日：2019-11-24
Applicant: Applied Optoelectronics, Inc.
Inventor： Kai-Sheng Lin , Hao-Chiang Cheng , Ziliang Cai
Abstract: The present disclosure is generally directed to a housing for use with optical transceivers or transmitters that includes integrated heatsinks with a graphene coating to increase thermal dissipation during operation. In more detail, an embodiment of the present disclosures includes a housing that defines at least first and second sidewalls and a cavity disposed therebetween. The first and/or second sidewalls can include integrated heatsinks to dissipate heat generated by optical components, e.g., laser diodes, laser diode drivers, within the cavity of the housing. The integrated heatsinks can include at least one layer of graphene disposed thereon to increase thermal performance, and in particular, to decrease thermal resistance of the heatsink and promote heat dissipation.
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公开(公告)号：US20210111687A1
公开(公告)日：2021-04-15
申请号：US16598218
申请日：2019-10-10
Applicant: Applied Optoelectronics, Inc.
Inventor： Yi LIU , Qin LI , Hsiu-Che WANG , Ruru CHEN
Abstract: The present disclosure is generally directed to utilizing capacitors stacks with capacitors mounted in a terminal-to-terminal mounting orientation to reduce overall footprint of capacitor arrays for bypass filtering circuits. In an embodiment, each capacitor stack includes at least a first capacitor, a second capacitor, and a ground plane interconnect. The first capacitor includes first and second terminals disposed opposite each other. The first terminal provides a mating surface to couple to the second capacitor, the second terminal couples to a ground plane. The second capacitor includes first and second terminals disposed opposite each other. The first terminal provides a mounting surface to electrically couple to and support the first capacitor, and the second terminal provides a mating surface to electrically and physically couple to the ground plane. Accordingly, the first capacitor can be inverted and mounted atop the second capacitor to eliminate the necessity of wire bonds, for example.
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Patent Agency Ranking
146.发明授权公开(公告)号：US10948671B2
公开(公告)日：2021-03-16
申请号：US16295586
申请日：2019-03-07
Applicant: Applied Optoelectronics, Inc.
Inventor： Kai-Sheng Lin , Kevin Liu , Hao-Chiang Cheng
Abstract: The present disclosure is generally directed to a multi-channel TOSA arrangement with a housing that utilizes a feedthrough device with at least one integrated mounting surface to reduce the overall dimensions of the housing. The housing includes a plurality of sidewalls that define a hermetically-sealed cavity therebetween. The feedthrough device includes a first end disposed in the hermetically-sealed cavity of the housing and a second end extending from the cavity away from the housing. The feedthrough device provides the at least one integrated mounting surface proximate the first end within the hermetically-sealed cavity. At least a first laser diode driver (LDD) chip mounts to the at least one integrated mounting surface of the feedthrough device. A plurality of laser arrangements are also disposed in the hermetically-sealed cavity proximate the first LDD chip and mount to, for instance, a LD submount supported by a thermoelectric cooler.
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公开(公告)号：US20210072469A1
公开(公告)日：2021-03-11
申请号：US16561531
申请日：2019-09-05
Applicant: Applied Optoelectronics, Inc.
Inventor： Kevin LIU , Kai-Sheng LIN , Hsiu-Che WANG
IPC: G02B6/42
Abstract: The present disclosure is generally directed to a holder element, also generally referred to herein as a welding element, configured to couple an optical coupling receptacle to a substrate and provide an integrated optical arrangement to redirect light received from the optical coupling receptacle along a receive light path to an output light path that is offset from the receive light path.
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公开(公告)号：US20210018716A1
公开(公告)日：2021-01-21
申请号：US16514580
申请日：2019-07-17
Applicant: Applied Optoelectronics, Inc.
Inventor： I-Lung HO , Hsiu-Che WANG , Qin LI
Abstract: The present disclosure is generally directed to a lens clip that defines at least one mounting surface for coupling to and supporting an array of optical components, e.g., a laser diode and associated components, and an optical lens slot to receive and securely hold an array of optical lenses at a predetermined position relative to the optical components to ensure nominal optical coupling. The optical lens slot includes dimensions that permit insertion of each optical lens into the same and restrict travel along one or more axis. Accordingly, disposing an optical lens within the lens slot ensures correct alignment along at least two axis, e.g., Z and X, with the third axis (e.g., Y) extending parallel along the slot to permit lateral adjustment of each lens.
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公开(公告)号：US20210013696A1
公开(公告)日：2021-01-14
申请号：US16506587
申请日：2019-07-09
Applicant: Applied Optoelectronics, Inc.
Inventor： Chong WANG , Kai-Sheng LIN , YongXuan LIANG
Abstract: In general the present disclosure is directed to a temperature control device, e.g., a TEC, that includes a top plate with at least first and second contact pads to allow for a soldering process to attach optical components to the first contact pad without causing one or more layers of the second contact pad to reflow and solidify with an uneven mounting surface. Thus, optical components such as a focus lens can be mounted to the second contact pad via, for instance, thermal epoxy. This avoids the necessity of a submount to protect the focus lens from the relatively high heat introduced during a soldering process as well as maintain the flatness of the second contact pad within tolerance so that the mounted focus lens optically aligns by virtue of its physical location/orientation with other associated optical components coupled to the first contact pad, e.g., a laser diode.
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公开(公告)号：US10788690B2
公开(公告)日：2020-09-29
申请号：US16257635
申请日：2019-01-25
Applicant: Applied Optoelectronics, Inc.
Inventor： Kai-Sheng Lin , Kevin Liu , Ziliang Cai
Abstract: This present disclosure is generally directed to an optical isolator array with a magnetic base that allows for mounting and alignment of N number of optical isolators modules within an optical subassembly module. In an embodiment, the magnetic base provides at least one mounting surface for coupling to N number of optical isolators, with N being equal to an optical channel count for the optical subassembly (e.g., 4-channels, 8-channels, and so on). The magnetic base includes an overall width that allows for a desired number of optical isolators to get mounted thereon. Each optical isolator can be uniformly disposed along the same axis on the magnetic base and at a distance D from adjacent optical isolators. An adhesive such as ultraviolet-curing (UV-curing) optical adhesives may be used to secure each optical isolator at a predefined position and increase overall structural integrity.
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