公开(公告)号：US20020183892A1

公开(公告)日：2002-12-05

申请号：US10012474

申请日：2001-12-12

Applicant: Via Technologies, Inc.

Inventor： Yeun-Jonq Lee ,  Yueh-Wen Chen ,  Yi-Hui Lin

IPC: G06F007/00

CPC classification number: G06Q10/06

Abstract: A method for booking stocks by using a stock operation system in a computer comprises the steps of: a stock query information is firstly keyed into the stock operating system, wherein the stock query information includes the number or name of an item/product. Then, the stock operating system calculates statistically a offers and needs information of the item/product and shows the offers and needs information of the item/product on a monitor, where the offers and needs information of the item/product includes the information of the required quantity, booked quantity and lacked quantity of this item/product, etc. Subsequently, a stock adjustment information is keyed into the stock operating system, wherein the stock adjustment information includes the information for increase and reduction of the booked quantity of the item/product. If the sums of the available quantity and the booked quantity of this item/product before and after the stock adjustment information is keyed in are different, go back to the previous step to re-key in another stock adjustment information to the stock operating system. If the sum after the stock adjustment information is keyed in is not changed, the stock operating system will save up a new offers and needs information of this item/product after the stock adjustment information is keyed in.

Abstract translation: 通过使用计算机中的库存操作系统来预订股票的方法包括以下步骤：首先将股票查询信息键入股票操作系统，其中股票查询信息包括项目/产品的数量或名称。 然后，库存操作系统统计地计算项目/产品的报价和需求信息，并在监视器上显示项目/产品的报价和需求信息，其中项目/产品的报价和需求信息包括 所需数量，预订数量和缺少该项目/产品的数量等。随后，库存调整信息被键入库存操作系统，其中库存调整信息包括用于增加和减少项目/ 产品。 如果在库存调整信息键入之前和之后的该项目/产品的可用数量和预订数量的总和不同，则返回到上一步骤以将库存调整信息重新输入库存操作系统。 如果库存调整信息被扣除后的总和不变，库存操作系统将在库存调整信息被键入后保存该项目/产品的新的报价和需求信息。

公开(公告)号：US20250106996A1

公开(公告)日：2025-03-27

申请号：US18811795

申请日：2024-08-22

Applicant: VIA Technologies, Inc.

Inventor： Nai-Shung Chang ,  Ping-Hsun Hsieh ,  Hung-Sen Liang

IPC: H05K1/11 ,  H05K1/02 ,  H05K1/18

Abstract: An electronic assembly includes a circuit board having a mounting surface and outer pads located on the mounting surface and staggered. The outer pads include pairs of differential signal pads arranged adjacent to each other including a first pair of differential signal pads and a second pair of differential signal pads. The first pair of differential signal pads and the second pair of differential signal pads are symmetrically arranged with respect to a symmetry line. A center extension line passing through the first pair of differential signal pads and a center extension line passing through the second pair of differential signal pads intersect at an intersection point on the symmetry line. The center extension line passing through the first pair of differential signal pads or the center extension line passing through the second pair of differential signal pads and the symmetry line are not perpendicular to each other.

公开(公告)号：US20250098330A1

公开(公告)日：2025-03-20

申请号：US18518806

申请日：2023-11-24

Applicant: VIA TECHNOLOGIES, INC.

Inventor： Ke-Yuan CHEN

IPC: H01L27/02

Abstract: An electrostatic discharge (ESD) protection device is provided. The ESD protection device includes a first ESD protection unit in a P-type semiconductor substrate to protect a first circuit. The first ESD protection unit includes first and second N-type and P-type well regions. The first N-type and P-type doped regions are in the first N-type well region. The second N-type and P-type doped regions are in the first P-type and second N-type well regions. The third N-type and P-type doped regions are in the second P-type well region. The first P-type and the third N-type doped regions are electrically connected to a common bus electrically connected to power supply and ground terminals of the first circuit. The first N-type and the second P-type doped regions are electrically connected to the power supply terminal. The second N-type and the third P-type doped regions are electrically connected to the ground terminal.

公开(公告)号：US20250061727A1

公开(公告)日：2025-02-20

申请号：US18522372

申请日：2023-11-29

Applicant: VIA Technologies, Inc.

Inventor： Cheng Yu WEN ,  Yao-Ching PENG

IPC: G06V20/56

Abstract: The image recognition system includes an image sensor and an image processor. The image sensor acquires a plurality of sensed images of continuous frames. The image processor performs image recognition on the plurality of sensed images. The image processor determines on the plurality of sensed images respectively whether the sensed image is a valid frames not containing a road, to determine a plurality of valid sensed images. The image processor determines on the plurality of valid sensed images respectively whether a proportion of an area of a drivable area in a plurality of sub-image regions of the valid sensed image is less than a preset proportion, to perform danger marking. The image processor calculates the number of danger marks of the sub-image regions for each of the valid sensed images. When the number of danger marks is greater than a preset threshold, the image processor generates a danger warning.

公开(公告)号：US20240421096A1

公开(公告)日：2024-12-19

申请号：US18476281

申请日：2023-09-27

Applicant: VIA Technologies, Inc.

Inventor： Wen-Yuan Chang ,  Wei-Cheng Chen ,  Chen-Yueh Kung

IPC: H01L23/538 ,  H01L23/00 ,  H01L25/065

Abstract: A manufacturing method of an electronic package includes the following steps. Multiple chips are temporarily fixed to a temporary carrier. At least one bridge element is installed on the adjacent chips. A base dielectric layer covering a temporary bonding layer, the chips, and the bridge element is formed. A material of the base dielectric layer includes a silicate composite material. Multiple base conductive vias and a redistribution structure are respectively formed on the chips and the base dielectric layer. Multiple conductive bumps are formed on the redistribution structure. In addition, an electronic package is also provided, which may be produced by the manufacturing method.

公开(公告)号：US12105695B2

公开(公告)日：2024-10-01

申请号：US17363031

申请日：2021-06-30

Applicant: VIA Technologies Inc.

Inventor： Peng Zhang

IPC: G06F16/22

CPC classification number: G06F16/2282 ,  G06F16/2246 ,  G06F16/2272

Abstract: An encoding method for a key Trie includes generating a plurality of meta data by applying encoding to a portion of non-leaf nodes of the key Trie, and storing an encoding result of the key Trie into a storage device, wherein the encoding result includes the plurality of meta data corresponding to the portion of non-leaf nodes, respectively.

公开(公告)号：US20240242710A1

公开(公告)日：2024-07-18

申请号：US18302180

申请日：2023-04-18

Applicant: VIA TECHNOLOGIES, INC.

Inventor： Jiah-Hui LUO ,  Jing-Jing GUO

IPC: G10L15/065 ,  G10L15/16 ,  G10L15/18

CPC classification number: G10L15/065 ,  G10L15/16 ,  G10L15/18

Abstract: A system for updating language models is provided. The system includes a data-storage module, a data-update module, and a model-building module. The data-storage module is used for storing multiple pieces of corpus data that corresponds to multiple categories. The data-update module is used for storing a piece of new corpus data into the data-storage module. The piece of new corpus data corresponds to one of the categories. The model-building module is used for building a plurality of classified language models, and for updating one of the classified language models based on the piece of new corpus data stored in the data-storage module. The classified language model updated corresponds to the category that corresponds to the piece of new corpus data.

公开(公告)号：US20240222361A1

公开(公告)日：2024-07-04

申请号：US18296531

申请日：2023-04-06

Applicant: VIA TECHNOLOGIES, INC.

Inventor： Ke-Yuan CHEN

IPC: H01L27/02

CPC classification number: H01L27/0262

Abstract: An electrostatic discharge protection device is provided. The electrostatic discharge protection device includes first and second N-type deep well (DNW) regions in a P-type semiconductor substrate, first to fourth N-type and P-type doped regions, and first and second P-type well (PW) regions. The first N-type and P-type doped regions and the first PW region are located in the first DNW region. The second N-type and P-type doped regions and the second PW region are located in the second DNW region. The third and fourth N-type and P-type doped regions are located in the first and second PW regions. The first P-type and fourth N-type doped regions are connected to an input/output terminal. The first N-type and second P-type doped regions are connected to a power supply terminal. The third N-type and the fourth P-type doped regions are connected to a ground terminal.

公开(公告)号：USD1017437S1

公开(公告)日：2024-03-12

申请号：US29769078

申请日：2021-02-03

Applicant: VIA TECHNOLOGIES, INC.

Designer： Yue Xiang

Abstract: FIG. 1 is a front perspective view of a vehicle display device showing my new design;
FIG. 2 is a front view thereof;
FIG. 3 is a rear view thereof;
FIG. 4 is a left side view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
The broken lines depict portions of the vehicle display device in which the design is embodied that form no part of the claimed design.

公开(公告)号：US20240072463A1

公开(公告)日：2024-02-29

申请号：US18090525

申请日：2022-12-29

Applicant: VIA Technologies, Inc.

Inventor： Nai-Shung Chang

IPC: H01R12/71

CPC classification number: H01R12/714 ,  H01R12/716 ,  H01R2201/06

Abstract: A circuit board has a surface and a contact arrangement on the surface. The contact arrangement includes contacts. The contacts are staggered. The contacts include multiple first ground contacts, multiple first signal contacts and multiple second signal contacts. The ground contacts are arranged along a first straight line. The first signal contacts are arranged on one side of the first straight line, and the two adjacent first signal contacts are grouped into a first signal contact pair. The second signal contacts are arranged on the other side of the first straight line, and the two adjacent second signal contacts are grouped into a second signal contact pair, and the transmission direction of the first signal contact pair is different from the transmission direction of the second signal contact pair.