公开(公告)号：US20240202383A1

公开(公告)日：2024-06-20

申请号：US18287854

申请日：2021-04-26

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Guiu Tio Medina ,  Sergio Gonzalez Martin ,  Jordi Roca Vila

IPC: G06F30/17 ,  B29C64/386 ,  B33Y50/00

CPC classification number: G06F30/17 ,  B29C64/386 ,  B33Y50/00

Abstract: Information on assembly components to be printed by a three dimensional (3D) printer is accessed. Different assembly arrangements are determined based on the information to optimise three dimensional (3D) nesting.

公开(公告)号：US20240198699A1

公开(公告)日：2024-06-20

申请号：US17909845

申请日：2020-03-20

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Dan Rothenbuhler ,  Kenneth K. Smith ,  Choon Siang Peck ,  Inn Chyun Goh ,  Aiqiang Yang ,  Jeffrey Nursalim

IPC: B41J11/00 ,  B41J13/10 ,  B65H1/04

CPC classification number: B41J11/003 ,  B41J11/0095 ,  B41J13/103 ,  B65H1/04 ,  B65H2511/10 ,  B65H2511/20

Abstract: A printing device includes an input tray in which sheets of media are loadable and a media guide movably adjustable along a dimension of the input tray and positionable against the sheets. The printing device includes a drive conductor electrically exposed parallel to the dimension of the input tray, detect conductors differently electrically exposed parallel to the dimension of the input tray, and a cross-conductor disposed on the media guide. The cross-conductor selectively electrically connects the drive conductor with the detect conductors according to a current media guide position to permit detection of the current media guide position.

公开(公告)号：US12014749B2

公开(公告)日：2024-06-18

申请号：US17783305

申请日：2020-01-10

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Anton Wiranata ,  Kathryn Janet Ferguson ,  Mark Q. Shaw ,  Chin-Ning Chen ,  Jan Allebach

IPC: G10L25/51

CPC classification number: G10L25/51

Abstract: Example implementations relate to audio samples to detect device anomalies. For example, computing device, comprising: a processing resource and a non-transitory computer readable medium storing instructions executable by the processing resource to: generate a matrix of audio information for a plurality of audio samples of a device, select audio information from one of the plurality of audio samples, generate a plurality of principal components for the selected audio information utilizing a principal component expansion, select a principal component from the plurality of principal components based on a quantity of variance, and detect an anomaly of the device based on a comparison between a real time audio sample of the device and the selected principal component.

公开(公告)号：US12013683B2

公开(公告)日：2024-06-18

申请号：US17267389

申请日：2019-01-31

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Victor Diego Gutierrez ,  Jordi Sanroma Garrit ,  Manuel Freire Garcia ,  Enrique Gurdiel Gonzalez

IPC: B33Y50/00 ,  B22F10/80 ,  B29C64/386 ,  G05B19/4099 ,  G06F30/00 ,  G06F30/20 ,  G06F113/10 ,  G06T17/00

CPC classification number: G05B19/4099 ,  B22F10/80 ,  B29C64/386 ,  B33Y50/00 ,  G06F30/00 ,  G06F30/20 ,  G06T17/00 ,  G05B2219/35117 ,  G05B2219/49008 ,  G06F2113/10

Abstract: In an example, a method includes receiving, at least one processor, object model data representing at least a portion of an object that is to be generated by an additive manufacturing apparatus by fusing build material within a fabrication chamber, wherein the object model data comprises a mesh model comprising data describing a surface of the object. A geometrical compensation vector may be determined for the object model data, the geometrical compensation vector having a first component applying to a first axis of the fabrication chamber and a second component applying to a second axis of the fabrication chamber. A geometrical compensation to apply to at least one location on the surface of the object may be determined by determining a product of the geometrical compensation vector and a vector indicative of the normal of the object surface at the location and the determined geometrical compensation may be applied to the object model data to generate modified object model data.

公开(公告)号：US20240193126A1

公开(公告)日：2024-06-13

申请号：US18555680

申请日：2021-04-23

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Andre Da Fonte Lopes Da Silva ,  Richard Edward Hodges ,  Carol Tatsuko Ozaki ,  Eunkyeol Kim

IPC: G06F16/14 ,  G06F16/11 ,  G06F16/176

CPC classification number: G06F16/156 ,  G06F16/116 ,  G06F16/176

Abstract: An example method includes: storing, for an account identifier representing a user account, event data for events associated with the account identifier and file data for files owned by the account identifier; tracking associations between the event data and the file data, each association representing a recorded access of a file during an event; obtaining a set of parameters for a file retrieval request; comparing the set of parameters and the associations between the event data and the file data; and selecting a recommended file for the file retrieval request based on the comparison of the set of parameters and the associations between the event data and the file data.

公开(公告)号：US20240190079A1

公开(公告)日：2024-06-13

申请号：US18286121

申请日：2021-04-13

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Lluis PARE BARNIOL ,  Oriol BORRELL CARBONELL ,  Daniel Alejandro POVEDA PI

IPC: B29C64/386 ,  B22F5/00 ,  B22F10/80 ,  B29L31/00 ,  B33Y50/00 ,  B33Y80/00 ,  G06T19/20

CPC classification number: B29C64/386 ,  B22F5/007 ,  B22F10/80 ,  B33Y50/00 ,  B33Y80/00 ,  G06T19/20 ,  B29L2031/757 ,  G06T2219/2021

Abstract: According to examples, a computer-readable medium may have stored thereon instructions that may cause a processor to obtain a first 3D model of a first portion of a component, the first 3D model may include a first digital attachment edge corresponding to a first attachment edge on the first portion. The processor may obtain a second 3D model of a second portion of the component, the second 3D model may include a second digital attachment edge corresponding to a second attachment edge on the second portion, in which the second portion is to be joined with the first portion to form the component. The processor may modify the first 3D model to include a first digital rib including holes along a segment of the first digital attachment edge and the second 3D model to include a second digital rib including protrusions along a segment of the second attachment edge.

公开(公告)号：US20240190072A1

公开(公告)日：2024-06-13

申请号：US18286479

申请日：2021-04-12

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Seongsik CHANG

IPC: B29C64/282 ,  B29C64/165 ,  B29C64/236 ,  B29C64/268 ,  B33Y10/00 ,  B33Y30/00

CPC classification number: B29C64/282 ,  B29C64/165 ,  B29C64/236 ,  B29C64/268 ,  B33Y10/00 ,  B33Y30/00

Abstract: In one example in accordance with the present disclosure, an additive manufacturing system is described. The additive manufacturing system includes a build material distributor to deposit layers of powder build material on a bed and an agent distribution system to deposit an agent on a layer of powder build material in a pattern to form a slice of a three-dimensional object. The additive manufacturing system also includes an energy delivery system to generate a line-shaped beam of energy to selectively join build material particles with the agent deposited thereon. The line-shaped beam of energy spans a width of the bed. The additive manufacturing system also includes a scanning carriage to hold the energy delivery system and move the line-shaped beam of energy across the bed.

公开(公告)号：US12005641B2

公开(公告)日：2024-06-11

申请号：US17857362

申请日：2022-07-05

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Kristopher J. Erickson ,  Thomas C. Anthony

IPC: B29C64/165 ,  B22F1/054 ,  B22F10/14 ,  B28B1/00 ,  B33Y10/00 ,  B33Y70/00 ,  C04B35/622 ,  C04B35/634 ,  C04B35/64

CPC classification number: B29C64/165 ,  B22F1/054 ,  B22F10/14 ,  B28B1/001 ,  B33Y10/00 ,  B33Y70/00 ,  C04B35/62218 ,  C04B35/634 ,  C04B35/64 ,  B22F2304/05 ,  C04B2235/3206 ,  C04B2235/3217 ,  C04B2235/3218 ,  C04B2235/3225 ,  C04B2235/3232 ,  C04B2235/3244 ,  C04B2235/3272 ,  C04B2235/3284 ,  C04B2235/3286 ,  C04B2235/3293 ,  C04B2235/3418 ,  C04B2235/3826 ,  C04B2235/3847 ,  C04B2235/3865 ,  C04B2235/3873 ,  C04B2235/422 ,  C04B2235/442 ,  C04B2235/5454 ,  C04B2235/6026 ,  C04B2235/667 ,  B22F2998/10 ,  B22F10/14 ,  B22F3/02

Abstract: According to an example, a green body may include from about 1 wt. % to about 20 wt. % of a metal nanoparticle binder and a build material powder, wherein the metal nanoparticle binder is selectively located within an area of the green body to impart a strength greater than about 3 MPa.

公开(公告)号：US20240184331A1

公开(公告)日：2024-06-06

申请号：US18554323

申请日：2021-04-20

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Kenneth Maclean ,  Chad Patrick Paris ,  Woojin Chung ,  Stacy L. Wolff ,  Eric Chen ,  Oliver Poyntz ,  Marcus Hoggarth ,  Benjamin Carroll

IPC: G06F1/16

CPC classification number: G06F1/1632 ,  G06F1/1681

Abstract: An example system includes a peripheral device including a first contact surface, and an electronic device including a housing, a second contact surface aligned with a surface of the housing, and a hinge coupled to the second contact surface. The second contact surface is to pivot into the housing about the hinge in response to an engagement with the first contact surface of the peripheral device.

公开(公告)号：US12001534B2

公开(公告)日：2024-06-04

申请号：US17418883

申请日：2019-07-19

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Syed Azam ,  Alexander Williams

IPC: G06F21/32 ,  G06F3/02 ,  G06V40/12 ,  H04L9/40

CPC classification number: G06F21/32 ,  G06F3/021 ,  G06V40/1365 ,  H04L63/08

Abstract: In an example implementation according to aspects of the present disclosure, an input device of a plurality of input switches, a plurality of biometric sensors integrated into each of the plurality of input switches and a processor. The processor configured to receive an indication from a first input switch. The processor receives a biometric data collected by one of the biometric sensors. The processor determines whether the received indication corresponds with a first state in a predetermined sequence. The processor determines whether the biometric data corresponds with as second state in a predetermined biometric data sequence. The processor authenticates the user based on the first and second states.