Light-emitting diode panel and spliced panel

    公开(公告)号:US12100700B2

    公开(公告)日:2024-09-24

    申请号:US17599568

    申请日:2021-07-29

    Inventor: Yan Li

    CPC classification number: H01L25/167 H01L33/62

    Abstract: A light-emitting diode panel and a spliced panel are disclosed. In the light-emitting diode panel, a substrate includes a first area and a second area, and the substrate is provided with a plurality of through-holes defined in the first area or the second area; conductors are disposed in the through-holes; light-emitting units correspond to the first area, and one of the light-emitting units includes at least one light-emitting diode; first wirings connect the at least one light-emitting diode to the conductors; a flexible circuit board is disposed on a back side of the substrate; and second wirings connect the conductors to the flexible circuit board.

    DISPLAY PANEL AND METHOD FOR FABRICATING SAME
    170.
    发明公开

    公开(公告)号:US20240178234A1

    公开(公告)日:2024-05-30

    申请号:US17769748

    申请日:2022-04-13

    Inventor: Lixia LI

    CPC classification number: H01L27/124 H01L27/1288 G02F1/133512 G02F1/1368

    Abstract: A display panel includes a first substrate and a second substrate disposed opposite to each other and spaced apart from each other, and a second semiconductor layer. The first substrate includes a first base substrate, a first metal layer, a first semiconductor layer, and a second metal layer. The first metal layer is disposed on the first base substrate. The first semiconductor layer is disposed on the first metal layer. The second metal layer is disposed on the first semiconductor layer. The second substrate includes a second base substrate and a third metal layer. The third metal layer is disposed on the second base substrate. The second semiconductor layer is disposed between the first metal layer and the third metal layer. The first semiconductor layer is insulated from the second semiconductor layer.

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