公开(公告)号：US09998924B2

公开(公告)日：2018-06-12

申请号：US15442831

申请日：2017-02-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sunghoon Kim ,  Changjin Song ,  Myungcheol Lee ,  Donghyun Yeom ,  Jiwoo Lee

IPC: H04W12/08 ,  H04L29/06 ,  G06F3/16 ,  G06F3/01 ,  G06F3/14

CPC classification number: H04W12/08 ,  G06F3/015 ,  G06F3/1423 ,  G06F3/165 ,  G06F21/32 ,  G06F2221/2111 ,  H04L63/0853 ,  H04L63/0861 ,  H04M1/72522 ,  H04M2203/6054 ,  H04M2250/12 ,  H04W12/06

Abstract: A method and an apparatus for acquiring and using biometric information of a user in an electronic device are provided. According to an example embodiment of the present disclosure, the method may include executing a call function using a communication module included in the electronic device, outputting a voice signal depending on the execution of the call function through a sound output device included in the electronic device, and acquiring, by a sensor included in the electronic device, biometric information of the user of the electronic device while the call function is executed.

公开(公告)号：US20180054765A1

公开(公告)日：2018-02-22

申请号：US15683668

申请日：2017-08-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sunghoon Kim ,  Jungje Son ,  Hoyeon Lee

IPC: H04W36/06 ,  H04W4/02 ,  H04W36/32

CPC classification number: H04W36/06 ,  H04L67/12 ,  H04W4/02 ,  H04W4/06 ,  H04W4/70 ,  H04W36/0055 ,  H04W36/12 ,  H04W36/22 ,  H04W36/32 ,  H04W84/042 ,  H04W88/02

Abstract: The present disclosure relates to a communication technique of fusing a 5G communication system for supporting higher data transmission rate beyond a 4G system with an IoT technology and a system thereof. The present disclosure may be applied to intelligent services (e.g., smart home, smart building, smart city, smart car or connected car, health care, digital education, retail business, security and safety related service, or the like) based on the 5G communication technology and the IoT related technology. A communication method of a CCNF comprises detecting a CCNF relocation necessity situation, determining a new CCNF, and transmitting a CCNF relocation request message including information on a terminal being served by the CCNF to the new CCNF The method further comprises receiving a CCNF relocation response message from the new CCNF, and performing a location update procedure with the terminal according to a predetermined condition.

公开(公告)号：US20130192722A1

公开(公告)日：2013-08-01

申请号：US13754008

申请日：2013-01-30

Applicant: Samsung Electronics Co., Ltd. ,  Dongwoo Fine-Chem Co., Ltd.

Inventor： Dong-Min Kang ,  Sunghoon Kim ,  Ingoo Kang ,  Taesung Kim ,  Jungjae Myung ,  Sang Tae Kim ,  Shijin Sung ,  In-Kak Song ,  Seunghyun Ahn ,  Kyoochul Cho

IPC: B23K35/362

Abstract: The inventive concept provides flux compositions for forming a solder bump and methods of fabricating a semiconductor device using the same. The flux composition may include a resin, an activator, and a solvent. The resin may include gum rosin and rosin ester, and a mass ratio of the gum rosin versus the rosin ester may have a range of about 60:40 to about 90:10.

Abstract translation: 本发明的概念提供了用于形成焊料凸块的焊剂组合物以及使用其制造半导体器件的方法。 焊剂组合物可以包括树脂，活化剂和溶剂。 树脂可以包括松香和松香酯，并且松香与松香酯的质量比可以为约60:40至约90:10的范围。